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AZ5325-01F.R7G
Semiconductor
Features
Compiance
Schematic Diagram
Pin Description
80 Watts peak pulse power (tp = 8/20μs)
Transient protection for high speed data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Working voltages : 5V
Protects One Power or I/O Port
Low operating and clamping voltages
Solid-state silicon avalanche technology
DFN1006P2X
Applications
Notebooks, Desktops, Servers and Video Graphics Cards
USB Power & Data Line Protection
Monitors and Flat Panel Displays
I²C Bus Protection
Portable Instrumentation
Set Top Box
Maximum Rating @ Ta=25℃ unless otherwise specified
Symbol
Parameter
Ratings
Units
80
Watts
PPK
Peak Pulse Power (tp = 8/20μs)
TL
Lead Soldering Temperature
260(10sec.)
℃
TJ
Operating Temperature
-55 to +125
℃
Storage Temperature
-55 to +150
℃
TSTG
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AZ5325-01F.R7G
Semiconductor
Compiance
Electrical Characteristics@ Ta=25℃ unless otherwise
VRWM @IR
P/N
AZ5325-01F.R7G
V
5
VBR@ImA
VC@1
VC@IPP
µA
V
V
V
MAX
MIN
MAX
MAX
1
5.8
11.8
15
CJ
A
pF
TYP
5
2.5
Typical Characteristics@ Ta=25℃ unless otherwise specified
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AZ5325-01F.R7G
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
A
Dim
B
C
R
D
E
MIN
Millimeters
MAX
MIN
MAX
A
0.0125
0.02
0.32
0.52
B
0.000
0.002
0.00
0.05
C
0.037
0.043
0.95
1.080
D
0.022
0.027
0.55
0.680
E
0.016
0.024
0.40
0.60
F
0.008
0.012
0.20
0.30
H
R
F
Inches
0.015Typ.
0.001
0.40Typ.
0.005
0.05
0.15
H
1.20
0.50
0.60
0.70
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
REEL SPECIFICATION
P/N
AZ5325-01F.R7G
PKG
DFN1006P2X
QTY
12000
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AZ5325-01F.R7G
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative
nearest
you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
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accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
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in
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without the prior written permission of MSKSEMI Semiconductor.
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guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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