BZT52C5V6

山东晶导微电子有限公司 BZT52C2V0 THRU BZT52C39 Jingdao Microelectronics Surface Mount Zener Diodes PINNING PIN FEATURES • Total power dissipation: Max. 500mW. • Wide zener reverse voltage range 2.0 V to 39V. • Small plastic package suitable for surface mounted design. DESCRIPTION 1 Cathode 2 Anode 2 MECHANICAL DATA ▪Case: SOD-123 ▪Terminals: Solderable per MIL-STD-750, Method 2026 ▪ Approx. Weight:16mg 0.00056oz 1 Simplified outline SOD-123 and symbol Absolute Maximum Ratings And Characteristics （Ta = 25 °C） Symbol Value Unit Power Dissipation PD 500 mW Forward Voltage at I F = 10 mA VF 0.9 V RθJA 305 °C/W T j , T stg -55 ~ +150 °C Parameter Typical thermal resistance juncting to ambient Operating and Storage Temperature Range (1) Fig.1 Maximum Continuous Power Derating 0.6 Power Dissipation ( W ) 0.5 0.4 0.3 0.2 0.1 0.0 25 50 75 100 125 150 T c ,Case Temperature (°C) 2017.08 175 Transient Thermal Impedance（ °C /W） (1) Thermal resistance from junction to ambient at P.C.B. mounted with 7.6mm X 9.4mm X 0.87mm copper areas pads. Fig.2 Typical Transient Thermal Impedance 2000 1000 100 10 0.01 0.1 1 10 100 t, Pulse Duration（sec） SOD123-W-BZT52C2V0~BZT52C39-500mW Page 1 of 3 山东晶导微电子有限公司 BZT52C2V0 THRU BZT52C39 Jingdao Microelectronics Characteristics at Ta = 25°C Maximum Zener (3) Impedance Zener Voltage Range （2） Type Marking V ZT（at I ZT） I ZT Z ZT@I ZT Z ZK@I ZK (Ω) Min（V） Nom（V） Max（V） (mA) Reverse Current (2) Typical temperature coefficient @I ZTC mV/°C Test current I ZTC I ZK IR @V R (mA) μA V MIN MAX mA BZT52C2V0 WY 1.91 2.0 2.09 5 100 600 1 150 1.0 -3.5 0 5 BZT52C2V4 WX 2.2 2.4 2.6 5 100 600 1 50 1.0 -3.5 0 5 BZT52C2V7 W1 2.5 2.7 2.9 5 100 600 1 20 1.0 -3.5 0 5 BZT52C3V0 W2 2.8 3.0 3.2 5 95 600 1 10 1.0 -3.5 0 5 BZT52C3V3 W3 3.1 3.3 3.5 5 95 600 1 5.0 1.0 -3.5 0 5 BZT52C3V6 W4 3.4 3.6 3.8 5 90 600 1 5.0 1.0 -3.5 0 5 BZT52C3V9 W5 3.7 3.9 4.1 5 90 600 1 3.0 1.0 -3.5 0 5 BZT52C4V3 W6 4.0 4.3 4.6 5 90 600 1 3.0 1.0 -3.5 0 5 BZT52C4V7 W7 4.4 4.7 5.0 5 80 500 1 3.0 2.0 -3.5 0.2 5 BZT52C5V1 W8 4.8 5.1 5.4 5 60 480 1 2.0 2.0 -2.7 1.2 5 BZT52C5V6 W9 5.2 5.6 6.0 5 40 400 1 1.0 2.0 -2 2.5 5 BZT52C6V2 WA 5.8 6.2 6.6 5 10 150 1 3.0 4.0 0.4 3.7 5 BZT52C6V8 WB 6.4 6.8 7.2 5 15 80 1 2.0 4.0 1.2 4.5 5 BZT52C7V5 WC 7.0 7.5 7.9 5 15 80 1 1.0 5.0 2.5 5.3 5 BZT52C8V2 WD 7.7 8.2 8.7 5 15 80 1 0.7 5.0 3.2 6.2 5 BZT52C9V1 WE 8.5 9.1 9.6 5 15 100 1 0.5 6.0 3.8 7.0 5 BZT52C10 WF 9.4 10 10.6 5 20 150 1 0.2 7.0 4.5 8.0 5 BZT52C11 WG 10.4 11 11.6 5 20 150 1 0.1 8.0 5.4 9.0 5 BZT52C12 WH 11.4 12 12.7 5 25 150 1 0.1 8.0 6.0 10.0 5 12.4 13 14.1 5 30 170 1 0.1 8.0 7.0 11.0 5 200 1 0.1 10.5 9.2 13.0 5 200 1 0.1 11.2 10.4 14.0 5 BZT52C13 WI BZT52C15 WJ 13.8 15 15.6 5 30 BZT52C16 WK 15.3 16 17.1 5 40 BZT52C18 WL 16.8 18 19.1 5 45 225 1 0.1 12.6 12.4 16.0 5 BZT52C20 WM 18.8 20 21.2 5 55 225 11 0.1 14.0 14.4 18.0 5 BZT52C22 WN 20.8 22 23.3 5 55 250 1 0.1 15.4 16.4 20.0 5 BZT52C24 WO 22.8 24 25.6 5 70 250 1 0.1 16.8 18.4 22.0 5 BZT52C27 WP 25.1 27 28.9 2 80 300 0.5 0.1 18.9 21.4 25.3 2 BZT52C30 WQ 28.0 30 32.0 2 80 300 0.5 0.1 21.0 24.4 29.4 2 BZT52C33 WR 31.0 33 35.0 2 80 325 0.5 0.1 23.1 27.4 33.4 2 BZT52C36 WS 34.0 36 38.0 2 90 350 0.5 0.1 25.2 30.4 37.4 2 BZT52C39 WT 37.0 39 41.0 2 130 350 0.5 0.1 27.3 33.4 41.2 2 NOTES:（1）f=1KHz （2）Short duration test pulse used to minimize self-heating effect. 2017.08 www.sdjingdao.com Page 2 of 3 山东晶导微电子有限公司 BZT52C2V0 THRU BZT52C39 Jingdao Microelectronics PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-123 A D b E A1 C ∠ALL ROUND L1 E1 SOD-123 mechanical data A C D E E1 L1 b A1 max 1.3 0.22 1.8 2.8 3.9 0.45 0.7 0.2 min 0.9 0.09 1.5 2.5 3.6 0.25 0.5 max 51 8.7 71 110 154 18 28 min 35 3.5 59 98 142 10 20 UNIT ∠ mm 9° 8 mil The recommended mounting pad size 2.0 (79) 1.2 (47) 1.2 (47) 1.2 (47) Unit： mm (mil) 2017.08 www.sdjingdao.com Page 3 of 3