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SMD1210P035TF

SMD1210P035TF

  • 厂商:

    RUILON(瑞隆源)

  • 封装:

    1210

  • 描述:

    最大电压:6V 最大电流:100A 保持电流:350mA 跳闸电流:750mA

  • 详情介绍
  • 数据手册
  • 价格&库存
SMD1210P035TF 数据手册
ELECTRONICS Positive Thermal Coefficent SMD1210 Series Circuit Protection System Specifications are subject to change without notice. Positive Thermal Coefficent - SMD1210 Series Features 1. I(hold): 0.05~2A 2. RoHS compliant, lead-free and halogen-free 3. Fast response to fault currents 4. Compact design saves board space 5. Low resistance 6. Low-profile 7. Compatible with high temperature solders Applications 1. USB peripherals 2. Disk drives 3. CD-ROMs 4. Plug and play protection for motherboards and peripherals 5. Mobile phones - battery and port protection 6. Disk drives 7. PDAs / digital cameras 8. Game console port protecti Product Name S M Surface Mount Device D 1 2 Device Dimensions: Length/Width (Unit: 1/100 inch) Circuit Protection System 1 0 P 0 1 Polytronics Symbol Current Rating:0.1A 0 T F T: Thin Version (Optional) F: Lead-free / - - Special Voltage Rating (Optional) Specifications are subject to change without notice. Page:1 Positive Thermal Coefficent - SMD1210 Series Dimension A B D Ihold Itrip Type Number Marking A A Maximum Time To Trip Current A Time s C Vmax Imax P Rmin R1max dmax Vdc A W Ω Ω Package Dimensions (mm) A Package B C D min max min max min max min SMD1210P005TF A 0.05 0.15 0.25 1.5 30 100 0.6 2.8 50 1210 3 3.43 2.35 2.8 0.3 0.8 0.3 SMD1210P010TF 1 0.1 0.3 0.5 0.6 30 100 0.6 0.8 15 1210 3 3.43 2.35 2.8 0.3 0.8 0.3 SMD1210P020TF 2 0.2 0.4 8 0.02 30 100 0.6 0.4 5 1210 3 3.43 2.35 2.8 0.3 0.8 SMD1210P035TF 3 0.35 0.75 8 0.2 6 100 0.6 0.2 1.3 1210 3 3.43 2.35 2.8 0.3 0.8 0.3 SMD1210P050TF 5 0.5 1 8 0.1 13.2 100 0.6 0.18 0.9 1210 3 3.43 2.35 2.8 0.3 0.8 0.3 SMD1210P075TF 7 0.75 1.5 8 0.1 6 100 0.6 0.07 0.4 1210 3 3.43 2.35 2.8 0.3 0.8 0.3 SMD1210P110TF 0 1.1 2.2 8 0.3 6 100 0.6 0.05 0.21 1210 3 3.43 2.35 2.8 0.3 0.8 0.3 SMD1210P150TF X 1.5 3 8 0.5 6 100 0.8 0.03 0.11 1210 3 3.43 2.35 2.8 0.4 0.8 0.3 SMD1210P175TF Y 1.75 3.6 8 0.6 6 100 0.8 0.02 0.08 1210 3 3.43 2.35 2.8 0.4 0.8 0.3 SMD1210P200TF Z 2 4 8 1 6 100 0.8 0.015 0.07 1210 3 3.43 2.35 2.8 0.4 1.2 0.3 03 Vocabulary Ihold = Hold current: maximum current device will pass without tripping in 23ºC still air. Itrip = Trip current: minimum current at which the device will trip in 23 ºC still air. Vmax = Maximum voltage device can withstand without damage at rated current (I max) Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd typ = Typical power dissipated from device when in the tripped state at 23 ºC still air. Rmin = Minimum resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 23 ºC measured one hour after tripping or reflow soldering of 260 ºC for 20 sec. Circuit Protection System Specifications are subject to change without notice. Page:2 Positive Thermal Coefficent - SMD1210 Series Thermal Derating Curve Percentage of Rated Current 200.00 150.00 100.00 50.00 0.00 -40.00 0.00 40.00 80.00 Device Ambient Temperature ( 120.00 ) Thermal Derating Chart Profile Feature Pb-Free Assembly Average Ramp-Up Rate(Ts max to T p) 3°C/second mac. Preheat -Temperature Min(Ts min) -Temperature Max(Ts max) -Time(Ts min to Ts max) 150°C 200°C 60~180 seconds Time maintained above: -Temperature(TL) -Time(tL) +217°C 60~150 seconds Peak Temperature(Tp) Ramp-Down Rate ·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free ·Recommended maximum paste thickness is 0.25mm (0.010 inch) ·Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Circuit Protection System Time 25°C to Peak Temperature Storage Condition 260°C 6°C/second max. 8 minutes max 0°C~35°C,70%RH Specifications are subject to change without notice. Page:3 Positive Thermal Coefficent - SMD1210 Series Average Time-Current Curve A 100.00 B DE C F GH IJ SMD1210P005TF SMD1210P010TF C SMD1210P020TF D SMD1210P035TF 10.00 Time to Trip (Sec.) A B E SMD1210P050TF F SMD1210P075TF SMD1210P075TF/24 1.00 G SMD1210P110TFT H SMD1210P150TFT 0.10 I SMD1210P175TF J SMD1210P200TF 0.01 0.10 1.00 10.00 Fault Current (Amp.) Temperature(°C) Average Time-Current Curve 300 250 200 190 160 100 0 Preheating Soldering Cooling 60-120 sec. 30-60 sec. 120 sec. ·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free ·Recommended maximum paste thickness is 0.25mm (0.010 inch) ·Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Circuit Protection System Specifications are subject to change without notice. Page:4 Positive Thermal Coefficent - SMD1210 Series Tape And Reel Specifications (mm) EIA Tape Component Dimention Governing Specifications P0 EIA 481-2 W 12 ± 0.20 P0 4.0 ± 0.10 P1 8.0 ± 0.10 P2 2.0± 0.05 A0 3.5 ± 0.23 B0 5.1 ± 0.15 B1max 5.9 D0 1.5+0.1,-0 F 5.5 ± 0.05 E1 1.75 ± 0.10 E2min 10.25 Tmax 0.6 T1max 0.1 K0 0.9 ± 0.15 Leader min. 390 Trailer min. 160 T 60 W1 12.4+20,-0.0 W2max. 18.4 E1 A0 B1 F K0 B0 T1 P1 W E2 EIA Reel Dimentions W2(measured at hub) A 178 N min. Embossment P2 Cover tape Reel Dimensions A max D0 Cover tape . 0 N(hub dia.) W1(measured at hub) Carrier tape Embossed cavity Storage And Handling • Storage conditions : 40°C max, 70% R.H. • Devices may not meet specified performance if storage conditions are exceeded. Circuit Protection System Specifications are subject to change without notice. Page:5 Positive Thermal Coefficent - SMD1210 Series Thermal Derating Chart Part Numberr -40℃ -20℃ 0℃ 23℃ 40℃ 50 ℃ 60℃ 70℃ 85℃ SMD1210P005TF 0.08 0.07 0.06 0.05 0.04 0.04 0.03 0.03 0.02 SMD1210P010TF 0.16 0.14 0.12 0.10 0.08 0.07 0.06 0.05 0.05 SMD1210P020TF 0.29 0.26 0.22 0.20 0.16 0.14 0.13 0.11 0.08 SMD1210P035TF 0.47 0.45 0.40 0.35 0.33 0.28 0.24 0.21 0.18 SMD1210P050TF 0.76 0.67 0.58 0.50 0.43 0.40 0.36 0.32 0.28 SMD1210P075TF 1.00 0.97 0.86 0.75 0.64 0.59 0.54 0.48 0.40 SMD1210P075TF/24 1.00 0.97 0.86 0.75 0.64 0.59 0.54 0.48 0.40 SMD1210P110TFT 1.60 1.42 1.26 1.10 0.94 0.86 0.80 0.70 0.58 SMD1210P150TFT 2.30 2.02 1.76 1.50 1.24 1.11 1.00 0.85 0.65 SMD1210P175TF 2.45 2.22 2.01 1.75 1.45 1.26 1.10 0.98 0.80 SMD1210P200TF 2.60 2.44 2.35 2.00 1.78 1.67 1.50 1.45 1.10 Warehouse Storage Conditions of Products · Storage Conditions: 1. Storage Temperature: -10°C~+40°C 2. Relative Humidity:≤75%RH 3. Keep away from corrosive atmosphere and sunlight. · Period of Storage: 1 year Circuit Protection System Specifications are subject to change without notice. Page:6
SMD1210P035TF
物料型号为 SMD1210P005TF 至 SMD1210P200TF,这些是正温度系数热敏电阻,用于电路保护系统。

器件简介包括 I(hold) 电流范围从 0.05A 至 2A,符合 RoHS 标准,无铅且无卤素,对故障电流响应快,设计紧凑节省板空间,电阻低,外形低矮,兼容高温焊接。

引脚分配未在文档中明确说明,但通常这类器件为表面贴装型。

参数特性包括保持电流、触发电流、最大电压、最大电流、典型功耗、最小电阻和最大电阻等。

功能详解涉及器件在不同温度下的热降额曲线、时间-电流曲线等。

应用信息包括用于 USB 外设、硬盘驱动器、CD-ROM、主板和外设的即插即用保护、手机电池和端口保护、PDA/数码相机、游戏控制台端口保护等。

封装信息为 SMD1210,尺寸为 3.43mm x 2.35mm x 0.8mm。
SMD1210P035TF 价格&库存

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SMD1210P035TF
    •  国内价格
    • 5+0.41820
    • 50+0.36690
    • 150+0.34125
    • 500+0.32196
    • 2500+0.27415
    • 4000+0.26645

    库存:4507