ES2AB THRU ES2JB
Reverse Voltage - 50 to 600 Volts
Forward Current - 2.0 Ampere
SURFACE MOUNT SUPER FAST RECOVERY RECTIFIER
Features
DO-214AA/SMB
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low reverse leakage
Built-in strain relief,ideal for automated
placement High forward surge current capability
High temperature soldering guaranteed:
0.155(3.94)
0.130(3.30)
0.086 (2.20)
0.071 (1.80)
0.185(4.70)
0.160(4.06)
0.012(0.305)
0.006(0.152)
250°C/10 seconds at terminals
Glass passivated chip junction
0.096(2.44)
0.084(2.13)
0.060(1.52)
0.030(0.76)
Mechanical Data
0.008(0.203)MAX.
0.220(5.59)
0.200(5.08)
Case : JEDEC DO-214AA/SMB Molded plastic body
Terminals : Solder plated, solderable per MIL-STD-750,Method 2026
Polarity : Polarity symbol marking on body
Mounting Position : Any
Weight : 0.003 ounce, 0.095 grams
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
SYMBOLS
Marking Code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
VRRM
VRMS
VDC
MDD
ES2AB
50
35
50
MDD
MDD
MDD
MDD
MDD
ES2BB ES2CB ES2DB ES2EB ES2GB
100
70
100
150
105
150
200
140
200
300
210
300
400
280
400
MDD
ES2JB
UNITS
600
420
600
V
V
V
Maximum average forward rectified current
at TL=125℃
I(AV)
2.0
A
Peak forward surge current
8.3ms single half sine-wave
superimposed onrated load (JEDEC Method)
IFSM
60
A
Maximum instantaneous forward voltage at 2.0A
VF
Maximum DC reverse current
at rated DCblocking voltage
IR
5
100
uA
trr
35
ns
CJ
40
pF
Maximum reverse recovery time
TA=25℃
TA=125℃
(NOTE 1)
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
Operating junction and storage temperature range
1
1.25
RθJA
60
RθJC
20
TJ,TSTG
-55 to +150
1.68
V
℃/W
℃
Note:1.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A
2.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
3.P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas
http://www.microdiode.com
Rev:2024A2
Page :1
ES2AB THRU ES2JB
Reverse Voltage - 50 to 600 Volts
Forward Current - 2.0 Ampere
Ratings And Characteristic Curves
Fig.1 Reverse Recovery Time Characteristic And Test Circuit Diagram
trr
10 ohm
Noninductive
50 ohm
Noninductive
+0.5
D.U.T
+
PULSE
GENERATOR
Note 2
25Vdc
approx
0
-
-0.25
1 ohm
NonInductive
OSCILLOSCOPE
Note 1
-1.0
Note:1.Rise Time = 7ns, max.
Input Impedance = 1megohm,22pF.
2. Ries Time =10ns, max.
Source Impedance = 50 ohms.
10ns/div
Set time Base for 10ns/div
Fig.3 Typical Reverse Characteristics
3.5
300
3.0
100
I R - Reverse Current (μA)
Average Forward Current (A)
Fig.2 Maximum Average Forward Current Rating
2.5
2.0
1.5
1.0
0.5
Single phase half-wave 60 Hz resistive
or inductive load
TJ=125°C
10
TJ=75°C
1.0
TJ=25°C
0.1
0.0
25
50
75
100
125
150
0
175
20
Case Temperature (°C)
100
80
Fig.5 Typical Junction Capacitance
10
Junction Capacitance (pF)
Instaneous Forward Current (A)
60
% of PIV.VOLTS
Fig.4 Typical Forward Characteristics
TJ=25°C
1.0
ES2AB~ES2DB
ES2EB/ES2GB
0.1
40
ES2JB
0.01
TJ=25°C
100
10
TJ=25°C
f = 1.0MHz
Vsig = 50mVp-p
1
0.001
0
0.5
1.0
1.5
2.0
2.5
Instaneous Forward Voltage (V)
0.1
1.0
10
100
Reverse Voltage (V)
Peak Forward Surage Current (A)
Fig.6 Maximum Non-Repetitive Peak
Forward Surage Current
80
70
60
50
40
30
20
10
8.3 ms Single Half Sine Wave (JEDEC
Method)
00
1
10
100
Number of Cycles
The curve above is for reference only.
http://www.microdiode.com
Rev:2024A2
Page :2
ES2AB THRU ES2JB
Reverse Voltage - 50 to 600 Volts
Forward Current - 2.0 Ampere
Packing information
P0
P1
unit:mm
d
E
Item
F
B
A
Symbol
Tolerance
SMB
A
B
C
d
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.05
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.81
5.41
2.42
1 5.0
330.00
50.00
13.00
1.75
5.55
8.00
4.00
2.00
0.30
12.00
12.30
W
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
P
D2
T
D1
C
W1
D
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
Reel packing
PACKAGE
SMB
REEL SIZE
REEL
(pcs)
COMPONENT
SPACING
(mm)
13"
3,000
4.0
INNER
BOX
(mm)
REEL
DIA,
(mm)
CARTON
SIZE
(mm)
CARTON
(pcs)
190*190*41
330
365*365*360
48,000
BOX
(pcs)
6,000
APPROX.
GROSS WEIGHT
(kg)
14.0
Suggested Pad Layout
Symbol
A
B
C
D
E
http://www.microdiode.com
Unit (mm)
2.8
2.4
Unit (inch)
0.110
4.6
0.094
0.181
2.2
7.0
0.086
0.276
Rev:2024A2
Page :3
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