FP1007R3-R23-R

Technical Data 4341 Effective October 2015 Supersedes September 2010 FP1007 High frequency, high current power inductors Applications Product description • High current carrying capacity • Low core loss • Frequency range up to 2MHz • Inductance Range from 115 nH to 300nH • Current range from 32 to 94 amps • 10.4 x 8.0mm footprint surface mount package in 6.5, 7.0 or 7.5mm height • Ferrite core material • Halogen free, lead free, RoHS compliant • Servers • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Desktop VRMs and EVRDs • Data networking and storage systems • Graphics cards and battery power systems • Point-of-Load modules • DCR Sensing circuits Environmental data • Storage temperature range (Component): -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise) • Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE FP1007 High frequency, high current power inductors  Technical Data 4341 Effective October 2015 Product specifications OCL1 (nH)±10% FLL2 (nH) minimum Irms3 (amps) Isat14 (amps) Isat25 (amps) DCR (mΩ) @ 20°C ±5% K-factor8 FP1007R1-R12-R 120 86 60 81 65 0.29 ± 10% 371 FP1007R1-R14-R 140 100 60 72 56 0.29 ± 10% 371 FP1007R1-R17-R 170 122 60 58 46 0.29 ± 10% 371 FP1007R1-R22-R 215 155 60 50 36 0.29 ± 10% 371 FP1007R1-R30-R 300 216 60 32 26 0.29 ± 10% 371 FP1007R2-R12-R 120 86 51 81 65 0.48 ± 8% 368 FP1007R2-R14-R 140 100 51 72 56 0.48 ± 8% 368 FP1007R2-R17-R 170 122 51 58 46 0.48 ± 8% 368 FP1007R2-R22-R 215 155 51 50 36 0.48 ± 8% 368 FP1007R2-R30-R 300 216 51 32 26 0.48 ± 8% 368 115 83 61 94 86 0.29 ± 5% 354 Part Number7 R1 version R2 version R3 version FP1007R3-R12-R FP1007R3-R15-R 150 108 61 76 70 0.29 ± 5% 354 FP1007R3-R17-R 175 126 61 66 60 0.29 ± 5% 354 FP1007R3-R22-R 215 155 61 50 43 0.29 ± 5% 354 FP1007R3-R23-R 230 165 61 48 40 0.29 ± 5% 354 FP1007R3-R27-R 270 194 61 40 34 0.29 ± 5% 354 FP1007R3-R30-R 300 216 61 35 30 0.29 ± 5% 354 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1, +25°C 3. Irms: Irms: DC current for an approximate temperature rise of 40ºC without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff @ +25°C 5. Isat2: Peak current for approximately 20% rolloff @ +125°C 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps). 7. Part Number Definition: FP1007Rx-Rxx-R FP1007R= Product code and size x = DCR indicator Rxx = Inductance value in μH, R= decimal point -R suffix = RoHS compliant Dimensions (mm) Recommended Pad Layout Schematic Part marking: 1007Rx (x = DCR indicator), Rxx (xx = inductance value in uH, R = decimal point, wwllyy = date code, R = revision level Tolerances are ±0.25 millimeters unless stated otherwise. PCB tolerances are ±0.1 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeter DCR measured from point “a” to point “b” Do not route traces or vias underneath the inductor 2 www.eaton.com/elx FP1007 High frequency, high current power inductors Technical Data 4341 Effective October 2015  Packaging information (mm) Supplied in tape and reel packaging, FP1007R1 700 parts per 13 ” diameter reel FP1007R2 750 parts per 13 ” diameter reel FP1007R3 650 parts per 13 ” diameter reel User direction of feed Temperature rise vs. total loss www.eaton.com/elx 3 Technical Data 4341 Effective October 2015 Core loss vs. Bp-p Inductance characteristics 4 www.eaton.com/elx FP1007 High frequency, high current power inductors  FP1007 High frequency, high current power inductors Technical Data 4341 Effective October 2015  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3