HCM1307-3R3-R

Technical Data 10433 Effective September 2015 HCM1307 High current power inductors Applications Description • High current carrying capacity • Low core losses • Magnetically shielded, low EMI • Frequency range up to 1MHz • Inductance range from 0.47μH to 3.3μH • Current range from 15 to 63 amps • 14.2 x 13.0mm footprint surface mount package in a 6.5mm height • Iron powder core material • Halogen free, lead free, RoHS compliant • Multi-phase regulators • Voltage Regulator Modules (VRMs) • Distributed power systems DC-DC converters • Desktop and server VRMs and EVRDs • Point-of-Load (POL) modules • Field Programmable Gate Array (FPGA) DC-DC converters • Battery power systems • High current power supplies • Data networking and storage systems Environmental Data • Storage temperature range (Component): -55°C to +125°C • Operating temperature range: -55°C to +125°C (ambient + self-temperature rise) • Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE HCM1307 High current power inductors  Technical Data 10433 Effective September 2015 Product Specifications Part Number6 OCL1 (μH) ±20% FLL2 (μH) minimum Irms3 (amps) Isat4 (amps) DCR (mΩ) typical @ +20°C DCR (mΩ) maximum @ +20°C K-factor5 HCM1307-R47-R 0.47 0.26 38 63 1.0 1.2 192 HCM1307-1R0-R 1.0 0.56 29 49 1.7 2.0 111 HCM1307-3R3-R 3.3 1.85 15 40 4.3 4.5 88 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms, @ Isat, @ +25ºC 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat: Peak current for approximately 30% rolloff @ +25°C 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (Gauss), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps). 6. Part Number Definition: HCM1307-xxx-R HCM1307 = Product code and size xxx= inductance value in μH, R= decimal point , If no R is present then last character equals number of zeros -R suffix = RoHS compliant b Dimensions (mm) a Recommended Pad Layout 13.2 ±1.0 6.3 ±0.2 2.5 ±0.3 Schematic 14.20 4.9 2 3.8 ±0.5 1 XXX wlyy R 1 2 1 12.5 ±0.5 2 8.0 ref 3.25 7.7 Part marking: XXX=Inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wlyy=date code, R=revision level All soldering surfaces to be coplanar within 0.10 millimeters Tolerances are ±0.3 millimeters unless stated otherwise Color: Grey Do not route traces or vias underneath the inductor 2 www.eaton.com/elx HCM1307 High current power inductors Technical Data 10433 Effective September 2015  Packaging information (mm) Supplied in tape and reel packaging, 400 parts per 13” diameter reel 2.0 4.0 1.75 1.5 dia XXX wlyy R 11.5 24.0 ±0.3 13.3 1.5 dia 20.0 7.0 13.1 4.5 User direction of feed Temperature rise vs. total loss 60 Temperature Rise (°C) 50 40 30 20 HCM1307-R47-R HCM1307-1R0-R HCM1307-3R3-R 10 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 Total Loss (W) www.eaton.com/elx 3 HCM1307 High current power inductors  Technical Data 10433 Effective September 2015 Core loss vs. Bp-p 10.000 1MHz Core Loss (mw) 500kHz 300kHz 1.000 200kHz 100kHz 50kHz 0.100 25kHz 0.010 0.001 100 1000 10000 B p-p (Gauss) Inductance characteristics HCM1307-1R0-R 110% 110% 100% 100% 90% 90% % of OCL % of OCL HCM1307-R47-R 80% 70% 60% 50% 50% 0 10 20 30 40 50 60 70 80 90 I DC(Amps) 110% 100% 90% 80% 70% 60% 50% 40% 0 5 10 15 20 25 I DC(Amps) www.eaton.com/elx 40% 0 5 10 15 20 25 30 35 40 I DC(Amps) HCM1307-3R3-R % of OCL 70% 60% 40% 4 80% 30 35 40 45 45 50 55 60 65 HCM1307 High current power inductors Technical Data 10433 Effective September 2015  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3