R5035315MA4SI

YSR315S503 1. SCOPE This specification is applied to a SAW resonator designed for the stabilization of transmitters such as garage door openers and security transmitters. 2. EL ECTRICAL SPECIFICATION 2.1 Maximum Rating DC Voltage VDC AC Voltage Vpp Operation temperature Storage temperature Max Input Power 10V 10V 50Hz/60Hz -40℃ to +85℃ -45℃ to +85℃ 10dBm 2.2Electronic Characteristics Item Center Frequency Insertion Loss Quality Factor Unload Q 50Ω Loaded Q Temperature Turnover Temperature Stability Freq.temp.Coefficient Frequency Aging DC. Insulation Resistance Motional Resistance R1 RF Equivalent Motional Inductance L1 RLC Model Motional Capacitance C1 Transducer Static Capacitance Unites MHz dB ℃ ppm/℃2 ppm/yr MΩ Ω μ H fF pF Minimum Typical Maximum 314.925 315.000 315.075 1.5 2.2 8000 12800 1000 2000 10 25 40 0.037 ≤±10 1.0 17 26 109.28 2.3357 2.7 come visit our site http://www.yxc.hk 1/4 YSR315S503 3. TEST CIRCUIT 4. DIMENSION 4-1 Typical dimension (unit: mm) 4-2 Typical circuit board land patter come visit our site http://www.yxc.hk 2/4 YSR315S503 5. ENVIRONMENTAL CHARACTERISTICS 5-1 High temperature exposure Subject the device to +85℃ for 16 hours. Then release the resonator into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2. 5-2 Low temperature exposure Subject the device to -40℃ for 16 hours. Then release the device into the room conditions for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2. 5-3 Temperature cycling Subject the device to a low temperature of -40℃for 30 minutes. Following by a high temperature of +85℃ for 30 Minutes. Then release the device into the room conditions for 24 hours prior to the measurement. It shall meet the specifications in 2.2. 5-4 Resistance to solder heat Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for 10±1 sec. Then release the device into the room conditions for 4 hours. The device shall meet the specifications in 2.2. 5-5 Solderability Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95% area of the terminals must be covered with new solder. It shall meet the specifications in 2.2. 5-6 Mechanical shock Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device shall fulfill the specifications in 2.2. 5-7 Vibration Subject the device to the vibration for 1 hour each in x, y and z axes with the amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2.2. 6. REMARK 6.1 Static voltage Static voltage between signal load & ground may cause deterioration &destruction of the component. Please avoid static voltage. 6.2 Ultrasonic cleaning Ultrasonic vibration may cause deterioration & destruction of the component. Please avoid ultrasonic cleaning 6.3 Soldering Only leads of component may be soldered. Please avoid soldering another part of component. come visit our site http://www.yxc.hk 3/4 YSR315S503 7. TYPCIAL APPLICATION CIRCUITS come visit our site http://www.yxc.hk 4/4