CML0306-2N2-BNH

CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 1 OF 15 0201 Series Thin Film Chip Inductor (Lead / Halogen Free) 1. Scope This specification applies to 0.6mm x 0.3mm (0201) size, fixed thin film chip inductor rectangular type. 2. Type Designation CML 0306 － ＊＊＊ － ＊ NH (1) (2) (3) (4) (5) Where (1) Product Type CML : fixed thin film chip inductor (2) Size 0306 : 0.30 × 0.60mm (3) Nominal inductance value : three digits of number, refer to Table 1. The nominal inductance value shell is represented by two significant figures and a code “N” representing the unit. (4) Tolerance B : ±0.1nH ; C : ± 0.2nH ; S : ± 0.3nH H : ± 3% ; J : ± 5% (5) NH = Sn plating ( Lead free / Halogen free) 3. Construction and Physical Dimensions L a a W Code Letter Dimensions L 0.61 ± 0.05 W 0.31 ± 0.05 t 0.28 ± 0.05 a 0.08 ± 0.05 b 0.15 ± 0.05 Unit : mm t b Downloaded from DatasheetLib.com - datasheet search engine Note : ① Coil : Cu ② Electrode : plating Sn plating (Lead free) ③ Protective Coat : Epoxy Resin coating ④ Substrate : Alumina ceramic CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 2 OF 15 4. Specifications Table 1 Electric Specification Characteristics Inductance Tolerance (nH) CML0306-0N6 ± 0.1nH CML0306-0N7 CML0306-0N8 ± 0.2nH CML0306-0N9 CML0306-1N0 ± 0.3nH CML0306-1N1 CML0306-1N2 CML0306-1N3 CML0306-1N4 CML0306-1N5 CML0306-1N6 CML0306-1N7 CML0306-1N8 CML0306-1N9 CML0306-2N0 CML0306-2N1 CML0306-2N2 CML0306-2N3 CML0306-2N4 CML0306-2N5 CML0306-2N6 CML0306-2N7 CML0306-2N8 CML0306-2N9 CML0306-3N0 CML0306-3N1 CML0306-3N2 CML0306-3N3 CML0306-3N4 CML0306-3N5 CML0306-3N6 CML0306-3N7 Downloaded from DatasheetLib.com - datasheet search engine Q min. --------------4 4 4 4 4 4 4 4 4 4 4 4 4 4 5 5 5 5 5 5 5 5 5 5 5 LQ Meas. Freq. (MHz) 100 Self Resonance Freq. (MHz)min. 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 6000 DC Resistance Rated Current (Ω Ω)max. 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.12 0.13 0.16 0.16 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.23 0.25 0.25 0.25 0.25 0.25 0.30 0.32 0.32 0.32 0.40 (mA) 500 490 490 480 470 460 450 440 440 430 420 410 390 390 380 370 360 360 350 340 340 340 330 330 330 330 330 320 310 310 310 300 CYNTEC CO., LTD. 乾坤科技股份有限公司 CML0306-3N8 CML0306-3N9 CML0306-4N3 CML0306-4N7 CML0306-5N1 CML0306-5N6 CML0306-6N2 CML0306-6N8 ± 3% CML0306-7N5 CML0306-8N2 ± 5% CML0306-9N1 CML0306-10N CML0306-12N CML0306-15N CML0306-18N CML0306-22N
5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 100 : CYNP-8Z-031 REVISION PAGE : A5 : 3 OF 15 0.40 0.40 0.40 0.45 0.45 0.50 0.55 0.70 1.10 1.20 1.20 1.30 1.30 1.50 1.60 1.80 300 300 280 280 270 270 250 250 240 230 220 220 190 180 170 150 L, Q vs Frequency Typical Characteristics Chart 1000 80 60 100 ) H n( L 6000 6000 6000 6000 6000 6000 6000 5500 5000 5000 4500 4500 3700 3700 3100 2800 DOCUMENT 22nH 10 Q 40 15nH 10nH 6.8nH 1000 Frequency(MHz) Downloaded from DatasheetLib.com - datasheet search engine 3.3nH 6.8nH 10nH 22nH 1.0nH 100 2.0nH 20 3.3nH 2.0nH 1 1.0nH 15nH 0 10000 100 1000 Frequency(MHz) 10000 CYNTEC CO., LTD. 乾坤科技股份有限公司
DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 4 OF 15 L, Q vs Frequency Reference Characteristics Table Inductance ( nH ) Part Number Q 500MHz 800MHz 1.8GHz 2.4GHz 500MHz 800MHz 1.8GHz 2.4GHz CML0306-0N6 0.6 0.6 0.6 0.6 25min 30min 45min 50min CML0306-0N7 0.7 0.7 0.7 0.7 25min 30min 45min 50min CML0306-0N8 0.8 0.8 0.8 0.8 25min 30min 45min 50min CML0306-0N9 0.9 0.9 0.9 0.9 24min 30min 45min 50min CML0306-1N0 1 1 1 1 25 31 45 51 CML0306-1N1 1.1 1.1 1.1 1.1 25 31 45 52 CML0306-1N2 1.2 1.2 1.2 1.2 25 31 45 52 CML0306-1N3 1.3 1.3 1.3 1.3 24 30 45 52 CML0306-1N4 1.3 1.3 1.3 1.3 22 28 41 48 CML0306-1N5 1.5 1.4 1.4 1.4 21 26 39 45 CML0306-1N6 1.6 1.6 1.6 1.6 19 23 38 43 CML0306-1N7 1.7 1.7 1.7 1.7 19 24 37 43 CML0306-1N8 1.8 1.8 1.8 1.8 19 25 38 43 CML0306-1N9 1.9 1.9 1.9 1.9 20 25 38 43 CML0306-2N0 2 2 2 2 20 25 38 42 CML0306-2N1 2.1 2.1 2.1 2.1 20 25 38 43 CML0306-2N2 2.2 2.2 2.2 2.2 21 26 38 44 CML0306-2N3 2.3 2.3 2.3 2.3 21 26 37 43 CML0306-2N4 2.4 2.4 2.4 2.4 20 25 37 43 CML0306-2N5 2.5 2.5 2.5 2.5 20 25 37 42 CML0306-2N6 2.6 2.6 2.6 2.6 19 24 35 40 CML0306-2N7 2.7 2.6 2.6 2.7 19 24 35 40 CML0306-2N8 2.8 2.8 2.8 2.8 18 23 33 38 CML0306-2N9 2.9 2.9 2.9 2.9 18 22 33 37 CML0306-3N0 3 3 3 3 17 21 32 37 CML0306-3N1 3.1 3.1 3.1 3.1 17 21 30 33 CML0306-3N2 3.2 3.2 3.2 3.3 17 21 31 35 CML0306-3N3 3.3 3.3 3.3 3.3 17 21 31 35 CML0306-3N4 3.4 3.4 3.4 3.4 17 21 31 35 CML0306-3N6 3.5 3.5 3.6 3.7 15 19 28 30 CML0306-3N9 3.7 3.7 3.8 4 17 21 31 34 CML0306-4N3 4.1 4.1 4.3 4.5 17 22 31 34 CML0306-4N7 4.5 4.5 4.7 5 16 19 28 30 CML0306-5N1 5 5 5.2 5.6 17 19 28 29 Downloaded from DatasheetLib.com - datasheet search engine CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 5 OF 15 CML0306-5N6 5.6 5.6 5.8 6.1 16 19 28 29 CML0306-6N2 6.2 6.2 6.4 6.7 16 19 27 27 CML0306-6N8 6.6 6.6 6.9 7.3 16 19 27 27 CML0306-7N5 7.3 7.3 7.8 8.4 16 19 27 27 CML0306-8N2 8 8 8.3 9.1 15 19 23 22 CML0306-9N1 8.9 8.9 9.4 10.5 12 15 20 20 CML0306-10N 10 10 11 12.5 15 17 20 18 CML0306-12N 12 12 14 18 13 15 18 15 CML0306-15N 15 15 18 --- 13 15 18 --- CML0306-18N 18 18 24 --- 13 15 17 --- CML0306-22N 22 24 --- --- 15 20 15 --- Downloaded from DatasheetLib.com - datasheet search engine CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 6 OF 15 5. Characteristics Unless otherwise specified, the standard range of atmospheric conditions for marking measurements tests is as follows; Temperature 24 ± 5℃ Relative humidity 45 to 85%RH Air pressure 86 to 106kPa If there is any doubt about results, measurements shall be made within the following limits; Temperature 20 ± 2℃ Relative humidity 60 to 70%RH Air pressure 86 to 106kPa 5-1 Electrical Item Inductance Conditions DC Resistance Measurement shall be performed by Impedance Analyzer 4287A with the frequency specified in Table 1. Measurement shall be performed by Impedance Analyzer 4287A with the frequency specified in Table 1. Refer to IEC 60115-1, Sub-clause 4.5. Self Resonance Frequency Measurement shall be performed by Network Analyzer Agilent N5230A. Temperature Coefficient Measurement shall be performed at RT and RT+100℃ , and the calculation shall be performed with the measured values. Overload Test current : 2 times of the maximum current. Duration : 5 minutes Q value Downloaded from DatasheetLib.com - datasheet search engine Specifications Refer to Table 1. Refer to Table 1. DC Resistance shall be within the specified tolerance. Self resistance frequency shall be within the specified frequency. ( Table 1.) TCL：0 ~ +125 ppm/℃. TCQ： -0.25% ~ 0%/℃ TCR：0 ~ +0.45% /℃ No smoke, Fire nor significant damage shall be observed. CYNTEC CO., LTD. 乾坤科技股份有限公司 Item DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 7 OF 15 Conditions Specifications Rated Current Rated current shall be the current with which the temperature raise of the inductor becomes 20℃. Refer to Table 1. Insulation Resistance (1) Between Electrode Place the specimen on the groove of metal plate so and insulating that the edge of metal block positions almost center enclosure. of both electrodes, with the surface of insulation 100MΩ or more enclosure located downward or upward and (2) Between Electrode pressurize the block by a force or 1.0 ± 0.2N. The test voltage shall be 100 ± 15Vdc, and maintain and base material this voltage for about 1 minute. The insulation 1,000MΩ or more resistance shall then be measured while applying the voltage. Insulation plate Measurement Point A on metallic block Measurement Point B on metallic plate R0.25mm~R0.5mm Insulating enclosure surface Spring Specimen Figure 2 : Measurement Setup Refer to IEC 60115-1, Sub-clause 4.6 Voltage Proof The inductor shall be tested as shown in Figure 2. Test Voltage : 100VAC (rms.) for 60 ± 5 seconds Refer to IEC 60115-1, Sub-clause 4.7. Downloaded from DatasheetLib.com - datasheet search engine No mechanical damage shall be observed. Electrical characteristics shall be within specification. CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 8 OF 15 5-2 Mechanical Item Substrate bending test (Bond strength of the face plating) Conditions Specifications Apply pressure in the direction of the arrow at a rate of about 1mm/s. until bent width reaches 3 mm and hold for 30 seconds. Testing board A DC Resistance Characteristics shall be within specification. Within ±2mm Solder 45 Supports Unit : mm Specimen No mechanical damage shall be observed. 45 ( 5) Amplitude of bend 3mm 50 Pressure 20 Press Jig R230 Refer to IEC 60115-1, Sub-clause 4.33 Body Strength A load of 10N (1.02kgf) using a R0.5 pressure rod shall be applied to the center in the direction of arrow and held for 10 ± 1 seconds. Pressure rod Loading R0.5 Specimen 1/2L L Unit : mm Downloaded from DatasheetLib.com - datasheet search engine No mechanical damage shall be observed. Electric haracteris-tics shall be within specification. CYNTEC CO., LTD. 乾坤科技股份有限公司 Item Resistance to Soldering Heat DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 9 OF 15 Conditions Specifications (1) Solder bath method Pre-heat : 100 to 110℃ 30 seconds Temperature : 270 ± 5℃ 10 ± 1seconds (2) Reflow Soldering method Peak temperature : 260 ± 5℃ 10seconds or less Temperature : 220 ± 5℃ 60 seconds max. 2cycles or less The temperature shall be board surface temperature No mechanical damage shall be observed. Electrical characteristics shall be within specification. (3) Soldering iron method Bit temperature : 350 ± 5℃ Time : 3 +1/-0 seconds The specimen shall be stored at standard atmospheric conditions for 1hour after which the measurement shall be made. Refer to IEC 60115-1, Sub-clause 4.18 Solderability Solder temperature : 245 ± 5℃ Duration of immersion : 2 ± 0.5 seconds A new uniform coating of 95% of the surface being immersed. Refer to IEC 60115-1, Sub-clause 4.17 Solvent Resistance Immersion cleaning At normal temperature 5 minutes Isopropyl alcohol. Without distinct damage in appearance. Refer to IEC 60115-1, Sub-clause 4.29 5-3 Endurance Item Rapid change of temperature Conditions Specifications The specimen shall be subjected to 5 continuous cycles, each as shown in the figure below. Temperature 1 －40 ± 3℃ 2 Room temperature 3 ＋125 ± 2℃ 4 Room temperature Use for Testing board B Time 30 minutes 2 ∼ 3minutes 30 minutes 2 ∼ 3minutes Refer to IEC 60115-1, Sub-clause 4.19 Downloaded from DatasheetLib.com - datasheet search engine No mechanical damage shall be observed. Electrical characteristics shall be within specification. CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 10 OF 15 Mounting of the test sample onto the test board shall be either of following methods. (1) Mounting by solder dipping Epoxy based glue shall be applied in the middle of two lands of the test board. The resistor shall be mounted in such a way that the electrodes of resistors will be evenly placed in the land area and then adhesive resin shall be cured. After applying the Resin Flux with 25 weight % Methyl Alcohol, the board shall be soldered by dipping into a molten solder bath with 260 ± 5℃ for 3 to 5 seconds (2) Mounting by Reflow soldering Solder paste with approximate 100μm thickness shall be applied to the land of test board. The resistor shall be mounted in such way that the electrodes of resistors will be evenly placed in the land area and then shall be soldered under the circumstance that the surface temperature of the board shall be raised 245 ± 5℃(peak) for 5 to 10 seconds in an upper-heater oven. Test board Material : Glass Fabric Epoxy Resin ( Refer to JIS C 6484 ) Board thickness : 1.6mm Copper foil thickness : 0.035mm Solder Resist Coating Land 15 ± 1 7.5 a 3.0 33.0 P/N 3.0 2.0 20.0 10.0 35.0 ± 1 a b c 0.28 ± 0.02 0.34 ± 0.02 0.76 ± 0.04 Unit : mm Downloaded from DatasheetLib.com - datasheet search engine 40 ± 1 21 ± 1 8.0 4.0 ± 1 16.0 4.0 b 11.0 15 ± 1 100 ± 1 f CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 11 OF 15 +0.0 58.5-1.0 1.24 5.08 1.32 1.22 2.00 0.5 1.35 0.42 0.42 Unit : mm Downloaded from DatasheetLib.com - datasheet search engine 1.35 1.32 +0.05 0.36-0.00 25.0 ± 1.0 3.0 3.0 15.10 1.2 16.5 50.5 CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 12 OF 15 6. Packaging 6-1 Dimensions 6-1-1 Tape Packaging Dimensions 1.5 +-0.1 0.0 0.3 ± 0.05 4.0 ± 0.1 Sprocket hole 3.5 ± 0.05 B Inductor 1.75 ±0.1 8.0 ± 0.3 A Carrier cavity 0.42 ± 0.05 4.0 ± 0.1 2.0 ± 0.05 Pull Direction ※ “Bottom less type” of tape is used. ※ Pre.emptied holes：150 holes (or 30cm) or more Code Letter A B Dimension 0.70 ± 0.03 0.43 ± 0.03 Unit : mm 6-1-2 Reel Dimensions 13 ± 1.4 50 105 2 ± 0.5 13 ± 0.2 +1 60-0 21 ± 0.8 R1 Label +0 180-3 9 ± 0.3 Unit : mm Plastic Reel Thickness : 0.5mm Plastic Reel : Correspond with EIAJ RRV08B Downloaded from DatasheetLib.com - datasheet search engine CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 13 OF 15 6-2 Peel Strength of Top Cover Tape The peel speed shall be about 300 mm/minute The peel strength of top cover tape shall be between 0.1 to 0.7N. Top Cover Tape 165 ~ 180 Pull out ° 0.1 ~0.7N Bottom Cover Tape Carrier Tape 6-3 Quantity per Reel 10,000 pieces / reel 6-4 Label Marking The following items shall be marked on the reel. (1) Manufactures parts number (2) Quantity (3) Manufacturing date code (4) Manufacturer’s name (5) The country of origin (6) Shipping number (7) Identification showing lead-free products. Downloaded from DatasheetLib.com - datasheet search engine CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 REVISION PAGE : A5 : 14 OF 15 7. Precautions 7-1 Storage (1) The product shall be stored in a room where temperature and humidity must be controlled. (temperature: 5-35℃, humidity : 45-85% RH). However, humidity keeps it low, as it is possible. (2) The product shall be stored as direct sunshine doesn't hit on it. (3) The product shall be stored with on moisture, dust, a material that will make solderability inferior, and a harmful gas (hydrogen chloride, sulfurous acid gas, and hydrogen sulfide). (4) The product shall be stored as tape packaging condition. 7-2 Term for use (1) The term for use is within one year from the shipping day of the product. (2) If the product has been left unused for more than one year after delivered, check solderability before use. 7-3 Chip mounting (1) When chip are mounted on PC board, protective coat of the product must not be scratched. If it will be scratched, it will make characteristic inferior. (2) In case that product will be soldered by soldering iron, heating shall be done on the land, and soldering iron must not hit on the product itself. (3) In case that resin coating or resin seal will be made for a PC board after chip mounting, do washing and drying it enough before coating or sealing. If ion bear or moisture will be sealed in resin coating, it will make characteristic inferior. (4) For resinous use, it is necessary to set up enough the curing conditions. As it gets improper for the condition, changes of a resistance value are large and are a case. (5) According to shape, material, and pressure of clamping in chip mounting machine, there is the case that crack will be appeared on the product. Control a shock energy for clamping the product under 7 x 10-4 J . With a shock energy around clamping that says here, it is suited to a potential energy, in case that iron block of 25 g is dropped naturally to the product placed on iron plate for the height of 2.8mm. (6) The glue to fix the product on the PC board around chip mounting, it is needed high insulation resistance and great performance or moisture. And it is needed that these characteristics are not inferno in using temperature range and a hot spot temperature to be acting. Downloaded from DatasheetLib.com - datasheet search engine CYNTEC CO., LTD. 乾坤科技股份有限公司 DOCUMENT : CYNP-8Z-031 (Preliminary specification) REVISION PAGE : A0 : 15 OF 1516 7-4 Using and Handling (1) It is necessary to investigate the performance and reliability enough when using under harsh environment. (2) It is necessary to protect the and protective coat of the product from mechanical stress. (3) Handle with care when PC board is divided or fixed on support body, because bending of PC board after chip mounting will make mechanical stress for the product. (4) The product shall be used within rated range shown in specification. Especially, if current more than specified value will be loaded to the product, there is a case it will make damage for machine because of temperature rise depending on generation of heat, and characteristic inferior. (5) In case that product is loaded a rated current, it is necessary to confirm temperature of the product and to reduce a load current according to load reduction curve, because a temperature rise of the product depends on influence of heat from mounting density and neighboring element. (6) If there is a possibility that a large voltage (pulse voltage, shock voltage) charge to the product, It is necessary that operating condition shall be set up before use, because performance of the product is affected by a large shock voltage. (7) The items listed listed in the specifications assure the product quality as the product alone. Evaluation and confirmation of the product quality after mounting, in accordance with the operation condition, is required for actual use. Downloaded from DatasheetLib.com - datasheet search engine