HCM2012GD900AE

INPAQ Global RF/Component Solutions HCM 2012 G Series Specification Product Name Series Size Chip Common Mode Filter HCM G Series EIAJ 2012 INPAQ Global RF/Component Solutions HCM2012G SERIES (Chip Common Mode Filter ) Engineering Specification RoHS Pb This product belongs to the industrial grade standard, not the vehicle gauge product! Can not use auto parts, if the customer is not expressly informed and privately used to auto parts, produce any consequences, the original is not responsible for after-sales service, thank you! Features and Application ．Powerful components with composite co-fired material to solve EMI problem for high speed differential signal transmission line as USB, and LVDS, without distortion to high speed signal transmission. ．MIPI, MHL serial interface in mobile device. 1.PRODUCT DETAIL Part No. Imp. Com. (Ω)±25% @100MHz DCR Max. (Ω) Rated Current Max.(mA) Rated Voltage (V) Insulation Resistance Min.(MΩ) HCM2012GH670AE 67 1.0 200 10 100 HCM2012GH900AE 90 1.0 200 10 100 HCM2012GD500AE 50 1.0 100 10 100 HCM2012GD900AE 90 1.0 200 10 100 HCM2012GD121AE 120 1.2 100 10 100 Test Instruments •HP4991B RF IMPEDANCE / MATERIAL ANALYZER •HP4338A/B MILLIOHMMETER •Agilent E5071C S-PARAMETER NETWORK ANALYZER •HP6632B SYSTEM DC POWER SUPPLY •Keithley 2410 1100V SOURCE METER HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. Version: A8 Page 1 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 2.PART NUMBER CODE HCM 2012 G □ 90 0 □ E 1 2 3 4 5 6 7 8 1：Series name 2：Dimensions L*W 3：Material code 4：Product identification number 5：Impedance value (ex：900=90Ω) 6：Fixed decimal point 7：INPAQ internal code 8：Packaging style E – Embossed tape, 7" reel 3.TYPICAL CHARACTERISTIC HCM2012GH670A IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 1000 0 Common Mode 100 10 Differential Mode Insertion loss (dB) Impedance (ohm) Differential Mode -5 -10 -15 -20 Common Mode 1 -25 10 100 1,000 Frequency (MHz) HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. 10,000 10 100 1,000 10,000 Frequency (MHz) Version: A8 Page 2 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions HCM2012GH900A IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 1000 Insertion loss (dB) Impedance (ohm) Differential Mode Common Mode 100 Differential Mode 10 -5 -10 -15 -20 Common Mode -25 1 10 100 1,000 10 10,000 100 1,000 10,000 Frequency (MHz) Frequency (MHz) HCM2012GD500A IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 1000 Insertion loss (dB) Impedance (ohm) Differential Mode Common Mode 100 Differential Mode 10 -5 -10 -15 -20 Common Mode 1 -25 10 100 1,000 Frequency (MHz) HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. 10,000 10 100 1,000 10,000 Frequency (MHz) Version: A8 Page 3 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions HCM2012GD900A IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 10000 Insertion loss (dB) Impedance (ohm) Differential Mode 1000 Common Mode 100 -5 -10 -15 Differential Mode 10 -20 Common Mode 1 -25 10 100 1,000 10,000 10 100 1,000 10,000 Frequency (MHz) Frequency (MHz) HCM2012GD121A IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 1000 Insertion loss (dB) Impedance (ohm) Differential Mode Common Mode 100 Differential Mode 10 -5 -10 -15 -20 Common Mode 1 -25 10 100 1,000 Frequency (MHz) HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. 10,000 10 100 1,000 Frequency (MHz) Version: A8 Page 4 of 10 www.inpaq.com.tw ; www.inpaqgp.com 10,000 INPAQ Global RF/Component Solutions 4.SHAPES AND DIMENSIONS HCM2012GH & GD SERIES TYPE Dimension L W T 2.00±0.20 1.20±0.20 1.00±0.10 P C1 C2 1.60±0.20 0.40±0.20 0.30±0.20 Unit：mm HCM2012GD500A HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. Version: A8 Page 5 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 5.MEASURING CIRCUITS (A):Common mode (B):Differential mode 6.CIRCUIT CONFIGURATION & LAYOUT PAD HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. Version: A8 Page 6 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 7.TAPE AND REEL SPECIFICATIONS/ TAPING DIMENSIONS Type：Embossed Carrier Unit：mm Symbol Size Symbol Size W 8.00±0.10 Po 4.00±0.10 P1 4.00±0.10 P2 2.00±0.10 E 1.75±0.10 Bo 2.30±0.10 F 3.50±0.10 Ao 1.40±0.10 Do 1.55±0.05 Ko 1.13±0.10 D1 1.00±0.05 t 0.22±0.05 HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. Version: A8 Page 7 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 8.REEL DIMENSIONS Unit：mm 9.STANDARD QUANTITY FOR PACKAGING Packaging style：Taping Reel packaging quantity：3000 pcs/reel Inner box：5 reel/inner box HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. Version: A8 Page 8 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 10.RECOMMENDED SOLDERING CONDITIONS 11.GENERAL TECHNICAL DATA Operating temperature range : - 40℃ ~ +85℃ Storage Condition : Less than 40℃ and 70% RH Storage Time: 6 months Max. Soldering method: Reflow HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. Version: A8 Page 9 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 12.RELIABILITY AND TEST CONDITION Test item Temperature Cycle Test condition A. Temperature : -40 ~ +85℃ B. Cycle : 100 cycles C. Dwell time : 30minutes Measurement : at ambient temperature 24 hrs after test completion A. Temperature : 85℃ ± 5℃ Operational Life Criteria A. No mechanical damage B.Impedance value should be within ± 20 % of the initial value B. Test time : 1000 hrs C. Apply current : full rated current Measurement : at ambient A. No mechanical damage B.Impedance value should be within ± 20 % of the initial value temperature 24 hrs after test completion Biased Humidity A. Temperature : 40 ± 2℃ A. No mechanical damage B. Humidity : 90 ~ 95 % RH C. Test time : 1000 hrs D. Apply current : full rated current Measurement : at ambient B. Impedance value should be within ± 20 % of the initial value temperature 24 hrs after test completion A. Solder temperature : 260 ± 5℃ Resistance to Solder Heat B. Flux : Rosin C. DIP time : 10 ± 1 sec A. More than 95 % of terminal electrode should be covered with new solder B. No mechanical damage C.Impedance value should be within ± 20 % of the initial value A. Temperature : 93 ± 2℃ Steam Aging Test B. Test time : 4 hrs C. Solder temperature : 235 ± 5℃ More than 95 % of terminal electrode should be covered with new solder D. Flux : Rosin E. DIP time : 5 ± 1 sec 13.NOTE All the products in this specification comply with RoHS 1.0 directive. HCM 2012 G Series Engineer Specification All Specifications are subject to change without notice. Version: A8 Page 10 of 10 www.inpaq.com.tw ; www.inpaqgp.com