MCM2012B900GBE

INPAQ Global RF/Component Solutions MCM 2012 B Series Specification Product Name Series Size Chip Common Mode Filter MCM B Series EIAJ 2012 RoHS INPAQ Pb Global RF/Component Solutions MCM2012B SERIES (Chip Common Mode Filter) Engineering Specification This product belongs to the industrial grade standard, not the vehicle gauge product! Can not use auto parts, if the customer is not expressly informed and privately used to auto parts, produce any consequences, the original is not responsible for after-sales service, thank you! Features and Application ．Powerful components with composite co-fired material to solve EMI problem for high speed differential signal transmission line as USB, and LVDS, without distortion to high speed signal transmission. 1.PRODUCT DETAIL Part No. Imp. Com. (Ω)±25% @100MHz DCR Max. (Ω) Rated Current Rated Voltage Withstand Insulation Voltage Resistance Max.(mA) (V) (V) Min.(MΩ) MCM2012B670GBE 67 0.40 400 10 25 200 MCM2012B900GBE 90 0.40 400 10 25 200 MCM2012B121GBE 120 0.40 400 10 25 200 MCM2012B161GBE 160 0.50 400 10 25 200 MCM2012B181GBE 180 0.50 400 10 25 200 MCM2012B221FBE 220 0.50 300 10 25 200 Test Instruments •Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER •HP4338 MILLIOHMMETER • Agilent E5071C ENA SERIES NETWORK ANALYZER •Keithley 2410 1100V SOURCE METER MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. Version: A24 Page 1 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 2.PART NUMBER CODE MCM 2012 B 1 2 3 90 4 0 G B 5 7 8 6 E Series Name Size Code: the first two digitals : length(mm), the last two digitals : width(mm) Material Code Impedance(Ω) ± 25% (ex：900=90Ω ；121=120Ω) Fixed Decimal Point Rated Current Code 1 2 3 4 5 6 A=50mA B=80mA C=100mA D=150mA E=200mA G=400mA H=500mA I =600mA J =700mA K=800mA F=300mA 7 Soldering: Green Parts: A— Soldering Lead-Free B— Lead-Free for whole chip 8 Packaging: E - Embossed plastic tape, 7" reel. 3.TYPICAL CHARACTERISTIC MCM2012B670 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 1000 Insertion loss (dB) Impedance (ohm) Differential Mode 100 Common Mode 10 Differential Mode -5 -10 Common Mode -15 1 -20 1 10 100 1,000 Frequency (MHz) MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. 10,000 1 10 100 1,000 10,000 Frequency (MHz) Version: A24 Page 2 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions MCM2012B900 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 Insertion loss (dB) Impedance (ohm) 1000 100 Common Mode 10 Differential Mode 10 100 1,000 -10 -15 1 1 Differential Mode -5 10,000 Common Mode -20 1 10 100 1,000 10,000 Frequency (MHz) Frequency (MHz) MCM2012B121 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 Differential Mode Insertion loss (dB) Impedance (ohm) 1000 Common Mode 100 10 Differential Mode -5 -10 -15 Common Mode 1 -20 1 10 100 1,000 Frequency (MHz) MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. 10,000 1 10 100 1,000 Frequency (MHz) Version: A24 Page 3 of 10 www.inpaq.com.tw ; www.inpaqgp.com 10,000 INPAQ Global RF/Component Solutions MCM2012B161 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 1000 Differential Mode Common Mode Insertion loss (dB) Impedance (ohm) 0 100 10 -5 -10 Differential Mode -15 Common Mode 1 1 10 100 1,000 10,000 -20 1 10 Frequency (MHz) 100 1,000 10,000 Frequency (MHz) MCM2012B181 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 Differential Mode Insertion loss (dB) Impedance (ohm) 1000 Common Mode 100 -5 -10 10 Differential Mode -15 Common Mode 1 -20 1 10 100 1,000 Frequency (MHz) MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. 10,000 1 10 100 1,000 10,000 Frequency (MHz) Version: A24 Page 4 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions MCM2012B221 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 1000 Insertion loss (dB) Impedance (ohm) Differential Mode Common Mode 100 10 Differential Mode -5 -10 -15 Common Mode 1 -20 1 10 100 1,000 Frequency (MHz) MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. 10,000 1 10 100 1,000 10,000 Frequency (MHz) Version: A24 Page 5 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 4.SHAPES AND DIMENSIONS TYPE 2012 L 2.00±0.20 W 1.25±0.20 T 1.00±0.10 P 1.60±0.20 C1 0.40±0.20 C2 0.30±0.20 Unit mm 5.MEASURING CIRCUITS (A):Common mode MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. (B):Differential mode Version: A24 Page 6 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 6.CIRCUIT CONFIGURATION & LAYOUT PAD 7.RECOMMENDED SOLDERING CONDITIONS MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. Version: A24 Page 7 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 8.RELIABILITY AND TEST CONDITION Test item Temperature Cycle Test condition A. Temperature : -40 ~ +85℃ B. Cycle : 100 cycles C. Dwell time : 30minutes Measurement : at ambient temperature 24 hrs after test completion A. Temperature : 85℃ ± 5℃ Operational Life Criteria A. No mechanical damage B. Impedance value should be within ± 20 % of the initial value A. No mechanical damage B. Test time : 1000 hrs C. Apply current : full rated current B. Impedance value should be Measurement : at ambient within ± 20 % of the initial temperature 24 hrs after test value completion A. Temperature : 40 ± 2℃ B. Humidity : 90 ~ 95 % RH Biased Humidity A. No mechanical damage C. Test time : 1000 hrs B. Impedance value should be D. Apply current : full rated current within ± 20 % of the initial Measurement : at ambient value temperature 24 hrs after test completion A. Solder temperature : 260 ± 5℃ Resistance to Solder B. Flux : Rosin Heat C. DIP time : 10 ± 1 sec A. More than 95 % of terminal electrode should be covered with new solder B. No mechanical damage C .Impedance value should be within ± 20 % of the initial value A. Temperature : 93 ± 2℃ Steam Aging Test B. Test time : 4 hrs(MCA) Others : 8 hrs C. Solder temperature : 235 ± 5℃ D. Flux : Rosin More than 95 % of terminal electrode should be covered with new solder E. DIP time : 5 ± 1 sec MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. Version: A24 Page 8 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 9.TAPE AND REEL SPECIFICATIONS Type：Plastic Carrier Unit：mm Symbol Size Symbol Size W 8.00±0.10 D1 1.00±0.10 P 4.00±0.10 Po 4.00±0.10 E 1.75±0.10 Ao 1.40±0.10 F 3.50±0.05 Bo 2.30±0.10 P2 2.00±0.05 Ko 1.13±0.10 D +0.10 t 0.22±0.05 1.50 -0.00 MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. Version: A24 Page 9 of 10 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions 10.REEL DIMENSIONS Unit: mm 11.STANDARD QUANTITY FOR PACKAGING Packaging style：Taping Reel packaging quantity：3000 pcs/reel Inner box：5 reel/inner box 12.GENERAL TECHNICAL DATA Operating temperature range : - 40℃ ~ +85℃ Storage Condition : Less than 40℃ and 70% RH Storage Time: 6 months Max. Soldering method: Reflow MCM 2012 B Series Engineer Specification All Specifications are subject to change without notice. Version: A24 Page 10 of 10 www.inpaq.com.tw ; www.inpaqgp.com