SPECIFICATION FOR APPROVAL
产品规格承认书
SMD POWER INDUCTOR
功率电感
CUSTOMER.
MODEL NO.
MPA252012S2R2M
CUSTOMER'S PART
NO.
LILE NO.
DATE.
2019.7.1
REVISION.
A/1
CUSTOMER APPROVE
DATE:
DRAWING
DRAWN BY
CHECK BY
APPROVAL BY
DATE:
深圳市迈翔科技有限公司
SHENZHEN MOTTO TECHNOLOGY Co., Ltd
香港瑞德科技有限公司
黄冈市迈翔电子有限公司
Motto Technology park, niu e ling village no#214 xintian,nghua Town,
Guanlan Street, Longhua District,Shenzhen
TEL: +86 0755-8948751~2 89487610 Fax: +86 0755-61624574
IATF16949 / ISO9001 / ISO14000
Http://www.coilmx.com
E-mail: sales@mottotech.com
深圳市迈翔科技有限公司
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MODEL NO.
MPA252012S2R2M
PART NO.
REVISION
A/1
DATE
2019.7.1
REVISIONS
REW
PROJECT CHANGE
DESCRIPTION
Date
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CUSTOMER
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FILE NO.
MPA252012S2R2M
PART NO.
REVISION
A/1
DATE
2019.7.1
1.PRODUCT DIMENSION
UNIT:mm
A
2.5±0.2
B
2.0±0.2
C
1.2MAX
D
0.8±0.2
E
0.8±0.2
F
0.80 TYP
G
2.50 TYP
H
2.00 TYP
2.ELECTRICAL REQUIREMENTS
PARAMETER
SPECIFICATION
CONDITION
TEST INSTRUMENTS
L( uH)
2.2±20%
1MHz/1.0V
MICROTEST 6377
DCR(mΩ)
144MAX
At 25℃
TH2512A
I sat(A)
1.55A TYP L0A* 70%
1MHz/1.0V
MICROTEST 6377+6220
3.CHARACTERISTICS
(1). All test data is based on 25℃ ambient.
(2). DC current(A)that will cause an approximate △T40℃
(3). DC current(A)that will cause L0 to drop approximately 10%Typ
(4). Operating temperature range: -55℃~+125℃
(5).The part temperature (ambient + temp rise)should not exceed 125℃ under worst case operating
conditions. circuit design, component.PWB trace size and thickness,airflow and other cooling
provision all affect the part temperature. Part temperature should be verified in the den application
4.SPECIAL REQUEST
(1)Lettering on top of the body.
深圳市迈翔科技有限公司
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DATE
2019.7.1
PART NO.
5.PRODUCT IDENTIFICATION
XX
XXXX
①
①、 Product Symbol
②
S
XXX
X
③
④
⑤
②、 Dimensions
③、 material class number
④、 Inductance ⑤ 、Tolerance: M±20%, N±30%.
6.ELECTRICAL SCHEMATICS
7.APPLICATION
(1)Low profile,high current power supplies.
(2)Battery powered devices.
(3)DC/DC converters in distributed power systems.
(5)DC/DC converters for field programmable gate array.
8.FEATURES
(1)ROHS compliant.
(2)Super low resistance,ultra high current rating.
(3)high performance(I sat)realized by metal dust core.
(4)Frequency Range:up to 1MHZ.
9.RECOMMENDED PCB LAYOUT
g
2.5typ
f
0.8typ
h
2.0typ
深圳市迈翔科技有限公司
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MODEL NO.
FILE NO.
SORT
PRODUCT&
DIMENSION
ELECTRICAL
& REQUIREME
NTS
MPA252012S2R2M
PART NO.
ITEM
A
B
C
D
SPEC
2.5±0.2
2.0±0.2
1.2MAX
0.8±0.2
1
2.55
2.15
1.12
0.82
2
2.50
2.14
1.17
0.84
3
2.49
2.18
1.14
0.85
4
2.47
2.18
1.14
0.82
5
2.54
2.14
1.16
0.84
X
2.51
2.16
1.15
0.83
R
0.08
0.04
0.05
0.03
ITEM
L(uH)
DCR
(mΩ)
I sat(A)
SPEC
2.2±20%
144MAX
1.55A TYP
L0A* 70%
1
1.95
87.85
83.00
2
2.08
87.51
77.00
3
2.23
88.60
78.00
4
2.07
88.70
81.00
5
2.01
87.38
74.00
X
2.07
88.01
78.60
R
0.28
1.32
9.00
REVISION
A/1
DATE
2019.7.1
SHAPE:
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3
项目Item
规格与需求
Specification and Requirement
沾锡面积不得小于95%上锡面
可焊性
Solder a bility test Terminals area must have 95% min
solder coverage
振动测试
Vibration test
测试方法Test Method
上锡升温曲线Solder heat proof:
(1) 预热:160±10℃持续90s
Preheating: 160±10℃ for 90 seconds
(2) 恒温时段:245±5℃持续2±0.5s
Retention time: 245±5℃ for 2±0.5 seconds
(1) 振动频率(10Hz 55Hz 10Hz)60s为一个周期 Vibration
frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period
(2) 振动时间 Vibration time:
三维正交坐标系每个方向振动(周期) 循环2小时 Period
Inductance change: Within±5% Without cycled for 2 hours in each of 3 mutual
mechanical damage such as break
perpendicular directions
(3) 振幅 Amplitude: 1.5 mm Max
感值变化:不超过±5%
且无破裂等机械损伤产生
冲击测试
Shock test
(1) 最大振幅 Peak value: 100G
感值变化:不超过±5%
(2) 脉冲波长 Duration of pulse: 11ms
且无破裂等机械损伤产生
(3) 三维正交坐标系每个方向正负方向冲击3次 Times in each
Inductance change: Within±5% Without
positive and negative direction of 3 mutual perpendicular
mechanical damage such as break
directions
冷热冲击
Thermal shock
(1)重复以上100个循环Repeat 100 cycle as follow
(-55±2℃,30±3分钟)
室温5分钟
(-55±2℃,30±3 minutes)
感值变化:不超过±5%
Room temperature,5 minutes
且无破裂等机械损伤产生
(+125±2℃,30±3分钟) 室温5分钟
(+125±2℃,30±3 minutes)
Inductance change: Within±5% Without
Room temperature,5 minutes
mechanical damage such as break
(2)恢复:测试于标准条件下恢复48+4/-0小时 (参考注释1)
Recovery:48+4/-0 hours of recovery under the standard
condition after the test. (see Note1)
(1)环境条件:85±2℃
感值变化:不超过±5%
Environment condition : 85±2℃
耐高温测试
且无破裂等机械损伤产生
应用电流:额定电流
High temperature
Inductance change: Within±5% Without
Applied current: Rated current
life test
mechanical damage such as break
(2)持续时间:1000+4/-0 小时(参考注释1)
Duration:1000+4/-0 hours (see Note1)
耐湿测试
Humidity
Resistance
(1)环境条件:60±2℃
Environment condition : 60±2℃
感值变化:不超过±5%
湿度:90~95%
且无破裂等机械损伤产生
Humidity:90~95%
Inductance change: Within±5% Without
应用电流:额定电流
mechanical damage such as break
Applied current: Rated current
(2)持续时间:1000+4/-0 小时(参考注释1)
Duration:1000+4/-0 hours (see Note1)
感值变化:不超过±5%
低温存放测试Low
(1)存储温度 Store temperature
且无破裂等机械损伤产生
temperature life
-55±2℃下存放 1000+4/-0 小时
Inductance change: Within±5% Without
test
-55±2℃for total 1000+4/-0 hours
mechanical damage such as break
感值变化:不超过±5%
高温存放测试High
(1)存储温度 Store temperature
且无破裂等机械损伤产生
temperature life
+125±2℃下存放 1000+4/-0 小时
Inductance change: Within±5% Without
test
+125±2℃for total 1000+4/-0 hours
mechanical damage such as break
深圳市迈翔科技有限公司
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DATE
2019.7.1
12、包装 Packaging
12.1、尺寸 Dimensions
12.1.1 包装料带尺寸 Tape packaging dimensions
W
A0
B0
K0
E
F
P
D0
P0
T
8.00
±0.30
1.9
±0.10
2.3
±0.10
1.2
±0.10
1.75
±0.10
3.5
±0.05
4.0
±0.10
1.5
±0.10
4.0
±0.10
0.18
±0.03
12.1.2 卷轴尺寸 Reel dimensions
项目
尺寸(mm)
A
178 ± 2.0
B
58± 1.0
C
13.5 ±0.2
D
9.0 ± 1.5
项目
数量(PCS)
1卷轴
2000
12.1.3 外箱尺寸Carton dimensions
1内箱
1外箱
深圳市迈翔科技有限公司
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Reflow curve
※ Reflow Profile
1. Reflow Soldering Method
2. Soldering iron method :350±5℃ Max.3 seconds.
REVISION
A/1
DATE
2019.7.1
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