X2R019200BZ1H-CHZ

SPECIFICATIONS FOR APPROVAL GP Customer Part No.: HELE. Part No: Application For: Products: Accepted Model: Type & Freq.: Sample Order No: X2R019200BZ1H-CHZ CRYSTAL HSX221SR / 19.200MHz Date: 2012/08/13 Approved By : HARMONY ELECTRONICS CORP. HARMONY ELECTRONICS (THAILAND) CO., LTD. HARMONY ELECTRONICS (SHENZHEN) CORP., LTD. TAIPEI OFFICE: 公司:(114) 台北市內湖區堤頂大道 2 段 409 號 2 樓 2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN (R.O.C.) TEL:886-2-26588883 FAX:886-2-26588683 TAIWAN FACTORY: 工廠:(831) 高雄市大寮區大發工業區華東路 39 號 No.39, Hua dong Rd., Daliao Dist.,Dafa Industrial Park., Kaohsiung City 831, Taiwan (R.O.C.) TEL: (07)787-1555-6 FAX: (07)787-1557 Tittle HSX221SR Date THAILAND FACTORY: 66MOO 5, KAONGU-BEOKPRAI RD., T.BEOKPRAI, A. BANPONG, RAJCHABUREE PROVINCE 70110, THAILAND TEL: (032)221994-6, 200740-1 FAX: (032)200742 SHENZHEN FACTORY: 深圳市福永鎮塘尾村塘橋路聚源工業區 QIAO TANG RD., TANGWEI VILLAGE FU YONG TOWN SHENZHEN CITY CHINA TEL: 0755-7309272 / 7309262 FAX: 0755-7309755 Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 1 HSX221SR SPECIFICATION INDEX ITEM PAGE 1. QUARTZ CRYSTAL UNIT SPECIFICATION．．．．．．．．．．．． 3 2. MARKING & DIMENSIONS．．．．．．．．．．．．．．．．．．． 4 3. INSIDE STRUCTURE．．．．．．．．．．．．．．．．．．．．．． 5 4. EMBOSS CARRIER TAPE&REEL．．．．．．．．．．．．．．．． a. DIMENSIONS OF CARRIER TAPE．．．．．．．．．．．．．．． 6 b. DIMENSIONS OF REEL．．．．．．．．．．．．．．．．．．．． 6-7 c. STORAGE CONDITION．．．．．．．．．．．．．．．．．．．． 7 d. STANDARD PACKING QUANTITY．．．．．．．．．．．．．．． 7 e. MATERIAL OF TAPE．．．．．．．．．．．．．．．．．．．．． 7 f. LABEL CONTENTS．．．．．．．．．．．．．．．．．．．．．． 7 g. TAPING DIMENSION．．．．．．．．．．．．．．．．．．．．． 8 h. JOINT OF TAPE．．．．．．．．．．．．．．．．．．．．．．． 8 i. RELEASE STRENGHT OF COVER TAPE．．．．．．．．．．．． 8 j. PACKAGE．．．．．．．．．．．．．．．．．．．．．．．．．．． 9 5. MECHANICAL ENDURANCE．．．．．．．．．．．．．．．．．． 10 6. ENVIRONMENTAL ENDURANCE．．．．．．．．．．．．．．．． 10 7. SUPPLEMENT．．．．．．．．．．．．．．．．．．．．．．．．． 11-12 8. Flow Chart．．．．．．．．．．．．．．．．．．．．．．．．．．． 13 Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 2 1. QUARTZ CRYSTAL UNIT SPECIFICATION 1. Frequency: 19.200000MHz 2. Holder type : HSX221SR 3. Frequency tolerance: +/-10 ppm at 25deg.C +/-3deg.C 4. Equivalent resistance: 80 ohms Max. / SERIES 5. Storage temperature range: -40 deg.C To +105 deg.C 6. Operable temperature range: -30 deg.C To +85 deg.C 7. Temperature drift: +/-12ppm 8. Loading capacitance (CL) : -30 deg.C To +85deg.C 7.0 pF +/- 0.2 pF 9. Drive level: 10 μW 10. Shunt Capacitance: 0.3~1.3 pF 11. Insulation resistance : More than 500M ohms at DC 100V 12. Mode of oscillation: Fundamental 13. Circuit: Measured in HP/E5100A,S&A 250B 14. Shocking : Dropping from 50 cm height 3 times on firm wood Variation : +/- 2 uW (100uW Max) Frequency less than +/-5 ppm Resistance less than +/- 15 ﹪or 2ohms max. 15. Aging: Less than +/- 1 ppm/Year 16. Holder HSX221SR Seam type 17.Dimensions and marking Refer to page.4 18.Emboss carrier tape & reel Refer to page.6 and page.7 19.Note: Motional capacitance: 1.80fF to 3.10fF Spurious mode series resistance: 1100 ohms +/-1 MHz Q value: Min. 75,000 Coefficient range: C0: -0.94ppm C1: -0.2 ppm/℃(-0.40~-0.10ppm/℃) -4 C2: 0.3 ppm/℃^2 C3: 9.932-5 ppm/℃^3 (8.5-5~11.5-5/℃^3) C3 and C1 coefficients are calculated per Qualcomm’s mini-spec 80-V9690-9 Rev. E and 80-V9690-23. Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 3 2. HSX221SR MARKING & DIMENSIONS ● *Marking should be printed as following: Logo, Nominal Frequency, Manufactured year & month *Nominal frequency = integer only ( ex. 14.31818 MHz Æ 14 ) *Manufacturing Lot No. (M: month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-2). Marking : Laser marking. (Table-1) Year 2000 2010 0 Code 2001 2011 1 2002 2012 2 2003 2013 3 2004 2014 4 2005 2015 5 2006 2016 6 2007 2017 7 2008 2018 8 2009 2019 9 (Table-2) Jan. A Feb. B Mar. C Apr. D May. E Jun. F Jul. G Tittle HSX221SR Date Aug. H Sep. J Oct. K Nov. L Dec. M Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 4 3. INSIDE STRUCTURE ※Reference drawing (1) Base: Alumina Ceramic (Al2O3) Metallized Pad: W Ni Plating Au Plating (2) Lid : Fe- Ni -Co (3) Crystal Enclosure Seal: Seal Seam (4) Crystal Blank Rectangular At-Cut Quartz Crystal Blank (5) Adhesive Silver Conductive Silicon Resin (6) PAD Alumina Ceramic (W. Ni. Au) (7) Cover Ring： Fe-Ni-Co Alloy The use prohibition chemistry substance of Table 1 of DHE-0204-1 (HE-QA-24) is not included in this item. (8) Thermistor Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 5 4. HSX221SR EMBOSS CARRIER TAPE & REEL a.) Dimensions of Carrier Tape b.) Dimensions of Reel Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 6 (Table-2) (UNIT: mm) MARK DIMENSIONS‧ANGLE Diameter A ψ180+0/-3 Inner Width W1 9.3+/-0.3 Outer Width W2 Out Line diameter B 11.3+/-1.0 ψ60.5+/-0.5 F1 3.0+0.5/-0 F2 4.0+0.5/-0 F3 5.0+0.5/-0 q C 120deg ψ13.2+/-0.5 E 3.0+/-0.2 ITEM FLANCE HUB Width Center Core slit Position Spindle diameter Key Ditch Width c.) Storage condition Temperature: +40deg.C Max. Relative Humidity: 80% Max. d.) Standard packing quantity 3,000PCS / REEL e.) Material of the tape Tape Carrier tape Top tape Material PS Conductive Polyester f.) Label contents .The type of product .Our specification No. .Your Part No. .Lot No. .Nominal Frequency .Quantity .Our Company Name Sticks label for every reel. Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 7 g.) Taping dimension Cover-tape Leader Carrier-tape Cover-tape Terminal Carrier-tape Terminal The length of cover-tape in the leader is more than 400 mm including empty embossed area. After all products were packaged, must remain more than twenty pieces or 400 mm empty area, which should be sealed by cover-tape. The tip of cover-tape shall be fixed temporary by paper tape and roll around the core of reel one round. The empty embossed area which are sealed by top cover-tape must remain more the 40 mm. Components Leader Emptv compartments Emptv compartments Top cover-tape Embossed Carrier-tape h.) Joint of tape The carrier-tape and top cover-tape should not be jointed. i.) Release strength of cover tape It has to between 0.1N to 0.7N under following condition. Pulling direction 165° to 180° Speed 300mm/min. Otherwise unless specified. 165°~ 180° Pulling direction Other standards shall be based on JIS C 0806-1990. Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 8 j.) Package Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 9 5. Mechanical Performance Test Methods 1 Natural Drop 2 Vibration 3 Sealing Tightness 4 Solderability Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board. Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak detector. – Fine Leakage. After applying ROSIN Flux, dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. 6. 1 2 3 4 A A --B Environment Performance Item Specifications Code Test Methods Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours. Back to room temperature first, then in 1~2 hours, the component shall be checked. -40deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. +85deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. -40deg.C +/-2deg.C (30min) ↔ +85deg.C +/-2deg.C (30min) 25 cycles. Back to the room temperature first, then in 1~2 hours, the component shall be checked. Humidity Storage in Low Temperature Storage in High Temperature Temperature cycles A A A A Specifications code Specifications A Frequency variation shall be within +/-5ppm and equivalent resistance shall be within the specification after the test More than 90% of lead shall be covered by new solder. B Tittle HSX221SR Date Specifications Code Item Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 10 7. Supplement 7.1.Soldering 7.2.Please stay with our proposed reflow condition and do then soldering 2 times max. Available for Lead Free Soldering Temperature 260 deg.C 220 deg.C (3) 160~180deg.C (2) (1) Time (1) Preheat 160~180 deg.C 120sec. (2) Primary heat 220 deg.C 60sec. (3) Peak 260 deg.C 10sec. Max. 7.3.Land pattern layout(Example) 7.4.Solder iron (Example) Bit temp.:350℃max.,Time:3sec max. ,Each terminal solder a 1 time max. Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 11 7.5.Mounting This component is designed for automatic insertion. However, you are requested to do the trial with your insertion machine in order to be sure of proper operation and no damage of component. Please pay attention to board warp which may damage the component and cause Soldering Process. 7.6.Cleaning Cleaning liquid which corrodes Nickel shall not be used It may cause the problem on the surface, color, marking etc. Ultra-sonic cleaning is possible, however, you are requested to check on your board. Because we only checked as single unit. 7.7.Storage Please keep away from high temperature and high humidity ,which may cause put solderbility. No direct Sunlight, No dew as well. Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 12 8. Flow Chart Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 13 REV. No. DATE REASON 0 2012/08/13 New CONTENTS Tittle HSX221SR Date Country of origin QUARTZ CRYSTAL SPECIFICATION Check Confirm Prepare 2012/08/13 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Page Rev. X2R019200BZ1H-CHZ ELECTRONICS CORP. 0 14