SPECIFICATIONS FOR APPROVAL
GP
Customer Part No.:
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.: HSO221S / 8.0000MHz
Sample Order No:
S2H008000I3CHE-T
OSCILLATOR
Date:
EOS-F70285-1
2015/12/22
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409 號 2 樓
2F., NO.409, SEC.2, TIDING BLVD.,
NEIHU DISTRICT, TAIPEI CITY 114,
TAIWAN
TEL:886-2-26588883
FAX:886-2-26588683
TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路 39 號
No.39, HWA DONG RD., DALLIAO
DIST.,DAFA INDUSTRIAL PARK.,
KAOHSIUNG CITY 831, TAIWAN
TEL: (07)787-1555-6
FAX: (07)787-1557
Tittle
THAILAND FACTORY:
66MOO 5, KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE 70110,
THAILAND
TEL: (032)221994-6,
200740-1
FAX: (032)200742
SHENZHEN FACTORY:
深圳市福永鎮塘尾村橋塘路聚源工業區
QIAO TANG RD., TANGWEI VILLAGE
FU YONG TOWN SHENZHEN CITY
CHINA
TEL: 0755-27309272 /
27309262
FAX: 0755-27309755
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HSO221S SPECIFICATION
Date
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1
HSO221S
SPECIFICATION
INDEX
ITEM
PAGE
1. Type..............................
3
2. Output Frequency.......................
3
3. Absolute Maximum Ratings...................
3
4. Electric Specifications.....................
3-4
5. Dimensions...........................
5
6. Inside Structure.........................
6
7. Mechanical Performance.....................
6
8. Environment Performance....................
7
9. Supplement...........................
8-9
10. Taping and Packing.......................
9-12
11. Flow Chart...........................
13
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1. Type Name:
HSO221S
2. Output Frequency:
8.000000MHz
3. Absolute Maximum Ratings:
Item
Symbol
Vdd terminal voltage
Vdd
Input terminal voltage
Vcont
Output terminal voltage
Vout
Output terminal current
Iout
Storage temp. range
Tstr
4.
Value
-0.5 ~ 4.0
-0.5 ~ Vdd+0.5
-0.5 ~ Vdd+0.5
15
-55~125
Unit
V
V
V
mA
deg.C
Electric Specifications:
Δf/F
Topr
Vdd
Min
-50
-40
3.0
Value
Typ
25
3.3
Max
+50
+85
3.6
ppm
℃
V
Idd1
-
-
7
mA
Idd2
-
-
0.01
mA
Duty
Vol
Voh
Tr & Tf
40
-
50
-
60
%
V
V
ns
Item
Symbol
Frequency Stability
Operating temp. range
Supply voltage
Current consumption 1
(#1 pin: open or "H")
Current consumption 2
(#1 pin: "L" level)
Symmetry
Low level output voltage
High level output voltage
Rise & Fall time
Pin #1 options
Output load
Low level input current
High Level input current
Low level input voltage
High level input voltage
Output disable time
Output enable time
Aging
Iil
Iih
Vil
Vih
Tplz
Tpzl
-
Unit
0.1xVdd
Condition
Vdd
Temp
Etc
Fig1,2
3.3+/0.3V
-40~85
℃
3.3V
25+/-3
℃
10
YES
C-MOS CL =15 pF (Idd1, Idd2 test at No Load)
10
uA
10
uA
Vddx0.3
V
Vddx0.7
V
Fig3
3.3V
150
ns
10
ms
ppm/year
-3
3
0.9xVdd
25+/-3
℃
F: Output Frequency
Δf =Oscillation Frequency - F
Frequency Stability is inclusive of 25℃
Tolerance, operating temperature range, input voltage change,
Load change, first of aging, shock and vibration.
Moisture Sensitivity Level: Level 1
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Fig. 1) Measurement Circuit :
CL = Include jig & probe capacitance
(Refer to 4)
Switch
H
Open
L
Out term.
Oscillation out
Oscillation out
High Z
Fig. 2) Output Wave Form:
Fig. 3) Input Output Condition:
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4
5.
Dimensions:
2.5±0.1
Frequency
3
4
Pin Connections
1 OE(Output Enable)
2
GND
3
Output
4
Vdd
2±0.1
26.0
H YM
1
2
1.0 Max.
1.15
4
3
0.95
2
1
1
0.575
1.3
0.7
1
0.65
2
1.75
3
4
Lot No.:
Year : Last digit of the year
Year
Code
2000
2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
0
1
2
3
4
5
6
7
8
9
Month : Alphabet assign below
Month
1
2
3
4
5
6
7
8
9
10
11
12
Code
A
B
C
D
E
F
G
H
J
K
L
M
Marking : Laser marking
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5
6.
Inside Structure:
7
5
6
6
3
2
5
4,7
4
2
Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
Metalized Pad: W
Ni Plating
Au Plating
(2)IC:
IC(Si. Al.)
(3) Au Bonding Wire:
Au
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) LID:
Fe+Ni+Co
(6) Adhesive
Silver Conductive Silicon Resin
(7) Electrode
1
3
1
The use prohibition chemistry substance of
Table 1 of DHE-0204-1 (HE-QA-24) is not
included in this item.
7.
Mechanical Performance:
Item
1
2
3
4
Specifications
Code
Test Methods
Natural Drop
Vibration
Sealing Tightness
Solder ability
Drop 3 times from the height of 50cm onto min. 30mm
thickness hard wooden board.
Refer to: JIS C 60068-2-6
A
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y
and Z 3 axes, Duration of 2 hours to each axis.
Refer to: MIL-HDBK-781A 6.5.2/ JIS C 60068-2-6
A
(1) Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium
leak detector. – Fine Leakage.
(2) Dipping in the FC-40 at +125 +/-5deg.C for 5 minutes, no
gas bubble observed from the inside of the can.
---
After applying ROSIN Flux, dipping in solder bath at
245deg.C+/-5deg.C for 3+/-0.5 sec.
Refer to: JIS C 60068-2-20
B
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8.
Environment Performance:
Item
1
Specifications
Code
Test Methods
Humidity
Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours.
Back to room temperature first, then in 1~2 hours, the
component shall be checked.
A
Refer to: JIS C 60068-2-3
2
Storage in Low
Temperature
-40deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
A
Refer to: JIS C 60068-2-1
3
Storage in High
Temperature
+85deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
A
Refer to: JIS C 60068-2-2
4
Temperature
cycles
-30deg.C +/-2deg.C (30min) +80deg.C +/-2deg.C (30min) 25
cycles. Temp. increasing or reducing time need to be within 3
minutes.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
A
Refer to: JIS C 0025
5
High
Temperature
Operation
+85deg.C +/-2deg.C, +3.3V Vdd Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
A
Refer to: JIS C 60068-2-2
Specifications code
A
Specifications
Frequency variation shall be within +/-5ppm and equivalent resistance shall
be within the specification after the test
More than 90% of lead shall be covered by new solder.
B
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9.
Supplement:
9.1.Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
9.2.Land Pattern Layout: (Example)
9.3.Solder Iron: (Example)
Bit temp.:350deg.C Max. , Time: 3sec Max. , Each terminal solder a 1 time Max.
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9.4.Mounting:
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be
Sure of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause
Soldering Process.
Avoid mounting and processing by Ultrasonic welding because this method has a
Possibility of an excessive vibration spreading inside the crystal products and
Becoming the cause of characteristic deterioration and not oscillating.
9.5.Cleaning:
Cleaning liquid which corrodes Nickel shall not be used.
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
9.6.Handling:
HSO211S series is designed to withstand Drop and Vibration, however, the crystal blank
might be broken. So, if excess force is given, please check the characteristics before use.
HSO221S series has C-MOS circuit inside. Please pay attention to static-electricity as
same handling as other C-MOS. devices.
9.7.By-pass Capacitor:
It has no by-pass capacitor integrated. We recommend you to use capacitor (like ceramic chip
capacitor) 0.01μF in-between Vdd and GND.
9.8.Storage:
Please keep away from high temperature and high humidity, which may cause put solderbility.
No direct Sunlight, No dew as well.
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10. Taping and Packing:
10.1.Emboss Tape Specifications:
10.2.Reel Specifications:
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(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
9.3+/-0.3
Outer Width
W2
11.3+/-1.0
Out Line diameter
B
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
Q
120deg
C
ψ13.2+/-0.5
E
3.0+/-0.2
ITEM
FLANCE
HUB
Width
Center
Core slit
Position
Spindle diameter
Key Ditch
Width
10.3.Storage:
Temperature+40deg.C Max.
Humidity 80% Max.
10.4.Quantity on Reel:
3,000 PCS/REEL
10.5.Label:
Label is following information:
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10.6. PACKAGE:
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11.
Flow Chart:
LID(外 殼 蓋 )
BLANK(晶 片 )
LID進 料 檢 查
1
2
Incoming Inspection
of LID
LID洗 淨
BLANK進 料 檢 查
7
8
Cleaning of LID
BASE(基 座 )
9
10
11
12
13
4
Incoming Inspection
of BLANK
IC
BASE進 料 檢 查
IC進 料 檢 查
3
Incoming Inspection
of BASE
Incoming
Inspection of IC
化學蝕刻
Etching
頻率選別
5
Freq. Sorting
IC 搭 載
IC Ass'y
晶片排盤
Blank Array
6
打 金 線 ($)
Wire Bonding
洗 淨 +微 蝕 刻
Washing+Flash Etching
基礎蒸著
Base Plating
押入接著
Blank Ass'y
14
15
16
17
18
接著硬化
Adhesive Curing
接著檢查
Bonding Check
調 整 蒸 著 /ION Partial
Partial Adjustment
/Ion Partial
中 間 檢 查 ($)
Middle Check
25
高真空烘烤
26
Annealing
in High Vacuum
27
19
21
老 化 Aging
Check of DLD
最 終 檢 查 ($)
Final Check
Check of
Temp. Characteristics
(for Specific Freq. ONLY)
28
外觀檢查
Appearance Check
印 字 +外 觀 檢 查
Marking & Check
29
Taping
30
出貨檢查
氣 密 檢 查 I (AIR)
Leak Check I
Outgoing Inspection
氣 密 檢 查 II (氦 氣 加 壓 )
24
DLD檢 查
溫 度 特 性 檢 查 (C)
REFLOW 1
23
Leak Check II
熔 接 Seam Seal
20
22
氣 密 檢 查 II(HE)
Leak Check II
(Helium Pressurization)
31
出貨捆包
Packing to
Shipment/stock
出 貨 Shipment
($): 特 殊 特 性
(For Special Characteristics)
(C): 指 定 製 程
(Arranged for customer requirement)
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REV.
No.
0
DATE
REASON
CONTENTS
2015/12/22
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-
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