SPECIFICATIONS FOR APPROVAL
GP
X5H015360FK1H-X
Customer Part No.:
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.: HSX530G/ 15.360MHz
EOS-C30225-1
Sample Order No:
Date:
QUARTZ CRYSTAL
2012/03/14
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409 號 2 樓
2F., NO.409, SEC.2, TIDING BLVD.,
NEIHU DISTRICT, TAIPEI CITY 114,
TAIWAN (R.O.C.)
TEL:886-2-26588883
FAX:886-2-26588683
TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路 39 號
No.39, Hua dong Rd., Daliao Dist.,Dafa
Industrial Park., Kaohsiung City 831,
Taiwan (R.O.C.)
TEL: (07)787-1555-6
FAX: (07)787-1557
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
Confirm
2012/03/14 F. S. TSAI
Check
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C. L. WANG U. F. CHEN
HARMONY
THAILAND FACTORY:
66MOO 5, KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE 70110,
THAILAND
TEL: (032)221994-6, 200740-1
FAX: (032)200742
SHENZHEN FACTORY:
深圳市福永鎮塘尾村塘橋路聚源工業區
QIAO TANG RD., TANGWEI VILLAGE
FU YONG TOWN SHENZHEN CITY
CHINA
TEL: 0755-7309272 / 7309262
FAX: 0755-7309755
Country of origin TAIWAN
FACTORY
THAILAND FACTORY
SHENZHEN FACTORY
Spec. No.
Rev.
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HSX530G
SPECIFICATION
INDEX
ITEM
PAGE
1. QUARTZ CRYSTAL UNIT SPECIFICATION.............
3
2. MARKING & DIMENSIONS....................
4
3. INSIDE STRUCTURE.......................
5
4. EMBOSS CARRIER TAPE&REEL..................
6
a. DIMENSIONS OF CARRIER TAPE................
6
b. DIMENSIONS OF REEL.....................
6-7
c. STORAGE CONDITION.....................
7
d. STANDARD PACKING QUANTITY.................
7
e. MATERIAL OF TAPE.......................
7
f. LABEL CONTENTS.......................
7
g. TAPING DIMENSION.......................
8
h. JOINT OF TAPE.........................
8
i. RELEASE STRENGHT OF COVER TAPE...............
8
j. PACKAGE..........................
9
5. MECHANICAL ENDURANCE...................
10-11
6. ENVIRONMENTAL ENDURANCE.................
12
7. Flow Chart...........................
13
8. Environmental Workload Chemical Substance Components List..
14
9. TEST DATA............................
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
Confirm
2012/03/14 F. S. TSAI
Check
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HARMONY
Country of origin TAIWAN
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Spec. No.
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1. QUARTZ CRYSTAL UNIT SPECIFICATION
1. Frequency:
15.360000MHz
2. Holder type :
HSX530G
3. Frequency tolerance:
+/-30ppm at 25deg.C+/- 3deg.C
4. Equivalent resistance:
100 ohms Max. / SERIES
5. Storage temperature range:
-40deg.C To +85deg.C
6. Operable temperature range:
-40deg.C To +85deg.C
7. Temperature drift:
+/-50ppm
8. Loading capacitance (CL) :
20.0pF
9. Drive level:
10 uW
10. Shunt Capacitance:
7.0 pF Max.
11. Insulation resistance :
More than 500M ohms at DC 100V
12. Mode of oscillation:
Fundamental
13. Circuit:
Measured in HP/E5100A,S&A 250B
14. Shocking :
Dropping from 50 cm height 3 times on firm wood
Variation :
-40deg.C To +85deg.C
(300uW Max)
Frequency less than +/-5 ppm
Resistance less than +/- 15 ﹪or 2ohms max.
15. Aging:
Less than +/-5 ppm/Year
16. Holder
HSX530G Ceramic Base
17.Dimensions and marking
Refer to page.4
18 Emboss carrier tape & reel
19 Note:
Refer to page.6 and page.7
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
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2012/03/14 F. S. TSAI
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HARMONY
Country of origin TAIWAN
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Spec. No.
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2. HSX530G MARKING & DIMENSIONS
*Marking should be printed as following:
Nominal Frequency, Logo, Manufactured year & month
*Nominal frequency (j)= 3 number after decimal point MAX.
( ex. 12.000 MHz Æ 12.000 )
*Manufacturing Lot No.
(Y: year) ex. 2000 shall be marked as ‘ 0 ’ (As shown on the Table-1)
(M: month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-2).
Marking : Laser marking.
(Table-1)
Year
Code
2000
2010
0
2001
2011
1
2002
2012
2
2003
2013
3
2004
2014
4
2005
2015
5
2006
2016
6
2007
2017
7
2008
2018
8
2009
2019
9
(Table-2)
Jan.
A
Feb.
B
Mar.
C
Apr.
D
May.
E
Jun.
F
Jul.
G
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
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C. L. WANG U. F. CHEN
HARMONY
Aug.
H
Sep.
J
Oct.
K
Nov.
L
Dec.
M
Country of origin TAIWAN
FACTORY
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Spec. No.
Rev.
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4
3. INSIDE STRUCTURE
※Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
Metallized Pad:
Ni Plating
Au Plating
(2) Cap:
Alumina Ceramic (Al2O3)
(3) Crystal Enclosure Seal:
Seal Glass
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) Adhesive
Silver Conductive Silicon Resin
(6) PAD
Alumina Ceramic (Ni. Au)
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
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2012/03/14 F. S. TSAI
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C. L. WANG U. F. CHEN
HARMONY
The use prohibition chemistry
substance of Table 1 of DHE-0204-1
(HE-QA-24) is not included in this
item.
Country of origin TAIWAN
FACTORY
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Spec. No.
Rev.
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5
4. HSX530G EMBOSS CARRIER TAPE & REEL
a.) Dimensions of Carrier Tape
b.) Dimensions of Reel
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
Confirm
2012/03/14 F. S. TSAI
Check
Prepare
C. L. WANG U. F. CHEN
HARMONY
Country of origin TAIWAN
FACTORY
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Spec. No.
Rev.
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X5H015360FK1H-X
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6
(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
12.8+/-0.3
Outer Width
W2
Out Line diameter
B
15.5+/-1.0
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
q
C
120deg
ψ13.2+/-0.5
E
3.0+/-0.2
ITEM
FLANCE
HUB
Width
Center
Core slit
Position
Spindle diameter
Key Ditch
Width
c.) Storage condition
Temperature: +40℃ Max.
Relative Humidity: 80% Max.
d.) Standard packing quantity
1,000 PCS / REEL
e.) Material of the tape
Tape
Carrier tape
Top tape
Material
PS
PET
f.) Label contents
Sticks label for every reel.
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
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2012/03/14 F. S. TSAI
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g.) Taping dimension
Cover-tape
Leader
Carrier-tape
Cover-tape
Terminal
Carrier-tape
Terminal
The length of cover-tape in the leader is more than 400 mm including empty
embossed area.
After all products were packaged, must remain more than twenty pieces or
400 mm empty area, which should be sealed by cover-tape.
The tip of cover-tape shall be fixed temporary by paper tape and roll around
the core of reel one round.
The empty embossed area which are sealed by top cover-tape must remain
more the 40 mm.
Components
Leader
Emptv compartments
Emptv compartments
Top cover-tape
Embossed Carrier-tape
h.) Joint of tape
The carrier-tape and top cover-tape should not be jointed.
i.) Release strength of cover tape
It has to between 0.1N to 0.7N under following condition.
Pulling direction 165° to 180°
Speed
300mm/min.
Otherwise unless specified.
165°~ 180°
Pulling direction
Other standards shall be based on JIS C 0806-1990.
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
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2012/03/14 F. S. TSAI
Check
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HARMONY
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Spec. No.
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X5H015360FK1H-X
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j.) Package
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
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5. Mechanical Endurance: Provided that measurement shall be carried out after
it alone in the room temperature for 1 hour.
Specifications
Item
Test Methods
Code
1
Drop
2
Vibration
3
Substrate
Bending
4
Adhesion
5
Body strength
Should be satisfied after dropping three times from the
height of 50 cm onto hard wooden board of thickness
more than 30mm.
Should be satisfied after supplying following vibration.
(1)Vibration Frequency: 10~55Hz
(2)Cycle: 1 to 2 Min.
(3)Amplitude: 0.8mm
(4)Direction: X.Y.Z
(5)Time: 2 Hours / Each Direction
Mount the specimen on substrate.
Apply the following pressure
Direction: see Fig –1
Speed: 0.5 mm/sec
Hours: 5 ± 1 sec
Amount of substrate: 3 mm Max.
Mount the specimen on substrate.
Apply the following pressure
Direction: see Fig –2
Weight: 5N
Hours: 10 ± 1 sec
Mount the specimen on substrate.
Apply the following pressure
Direction: see Fig –3
Weight: 10N
Hours: 10 ± 1 sec
A
A
C
L >= W
Pressure jig
P.C.B.
R 0.5
W
L
Pressure jig
Pressure jig
P.C.B.
specimen
R 230
R 0.5
specim en
45±2
45±2
0.5L
L
Fig-1
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
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2012/03/14 F. S. TSAI
Fig-3
Fig-2
Check
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C. L. WANG U. F. CHEN
HARMONY
Country of origin TAIWAN
FACTORY
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Spec. No.
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X5H015360FK1H-X
ELECTRONICS
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10
6
Seal
7
Solder ability
Less than 1.0 x 10-8 Pa.m3/sec by Helium leak detector.
Also, no serial bubble is observed by Fluorinate tests.
---
3sec +/-0.5sec. Dip in 245deg.C+/-5deg.C solder.
(Use ROSIN type flux for solder.)
B
Run in reflow
Reflow soldering shall be allowed
Only two (2) time.
Available for Lead Free Soldering
8
Resistance to
Soldering Heat
Temperature
260 deg.C
220 deg.C
A
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
Confirm
2012/03/14 F. S. TSAI
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HARMONY
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Spec. No.
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6. Environmental Endurance: Provided that measurement shall be carried out after
letting it alone in the room temperature for 1 hour.
Item
Should be satisfied after letting it alone at
+60deg.C+/-2deg.C in humidity of 90% ~ 95% for 240
hours.
A
A
1
Humidity
2
Storage in Low
Temperature
Should be satisfied after letting it alone
at –40deg.C+/-2deg.C for 240 hours.
3
Storage in High
Temperature
Should be satisfied after letting it alone at
+85deg.C+/-2deg.C for 240 hours.
Thermal Shock
Should be satisfied after supplying the following
temperature cycle (25 cycles). (Refer to Fig-4).
Temperature increasing or reducing time within 3
minutes.
4
Specifications
Code
Test Methods
A
A
85+/-2℃
30 min
(Fig-4)
25+/-5℃
2 min
25+/-5℃
2 min
30min
-40+/-2℃
1 CYCLES
Specifications code
A
B
C
Specifications
Frequency variation shall be within +/-5ppm and equivalent resistance shall
be within the specification after the test
More than 90% of lead shall be covered by new solder.
Without mechanical damage such as breaks.
Without electrode peeling.
Electrical characteristics shall be satisfied.
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
Date
Confirm
2012/03/14 F. S. TSAI
Check
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C. L. WANG U. F. CHEN
HARMONY
Country of origin TAIWAN
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Spec. No.
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12
7. Flow Chart
CAP(外 殼 蓋 )
BLANK(晶 片 )
CAP進 料 檢 查
1
Incoming Inspection
of CAP
BASE(基 座 )
BLANK進 料 檢 查
3
4
5
6
BASE進 料 檢 查
Incoming Inspection
of BLANK
2
Incoming Inspection
of BASE
化學蝕刻
Etching
頻率選別
Freq. Sorting
蒸著前洗淨
Cleaning before
Base Plating
7
微蝕刻
8
基礎蒸著
Flash Etching
Base Plating
9
押入接著
10
接著硬化
11
12
13
14
Blank Ass'y
Adhesive Curing
接著檢查
Bonding Check
調整蒸著
Partial Adjustment
中 間 檢 查 ($)
Middle Check
高真空烘烤
High Vacuum Annealing
15
封 止 Sealing
16
強 力 振 Over Drive
17
REFLOW
18
老 化 Aging
19
印 字 +外 觀 檢 查
22
氣 密 檢 查 II(HE)
23
最 終 檢 查 ($)
24
TAPING
25
Taping外 觀 檢 查
26
出貨檢查
Leak Check II
Final Check
Check of Taping
Marking&Check
20
21
($): 特 殊 特 性
(For Special Characteristics)
*Remark: 此 流 程 不 適 用 SMD3225
及其以下小型化之產品
(The process couldn't be available for
SMD3225 and the smaller PKG.)
氣 密 檢 查 I (AIR)
Leak Check I
氣 密 檢 查 II(氦 氣 加 壓 )
Leak Check II
(Helium Pressurization)
QUARTZ CRYSTAL SPECIFICATION
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出貨捆包
Packing to
Shipment/stock
出 貨 Shipment
Tittle HSX530G
Date
27
Outgoing Inspection
Country of origin TAIWAN
FACTORY
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Spec. No.
Rev.
Page
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8. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
H(D)SX530G
PERCENTAGE
47(mg)
ppm
Silicon(Si)
0.21150
99.4050
Gold(Au)
0.06110
28.7170
Fluorinre(F)
0.98700
463.8900
Titanium(Ti)
0.22560
106.0320
Boron(B)
0.06110
28.7170
Cobalt and its compound(Co)
0.04042
18.9974
Lead(Pb)
3.40280
1599.3160
Bismuth(Bi)
0.23500
110.4500
Silver(Ag)
0.08930
41.9710
Chromium and its compound(Cr)
0.07520
35.3440
Zinc(Zn)
0.68620
322.5140
21.14530
9938.2910
Manganese and its compound(Mn)
0.22090
103.8230
Wolfram and its compound(W)
0.24910
117.0770
Nickel and its compound(Ni)
0.17390
81.7330
Iron(Fe)
1.82830
859.3010
Chemical Substance Components
Aluminum(Al)
Tittle HSX530G
QUARTZ CRYSTAL SPECIFICATION
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2012/03/14 F. S. TSAI
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Spec. No.
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ELECTRONICS
CORP.
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14
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