Confidential Degree ：Confidential
Specification of Electret
Condenser Microphone
(RoHS Compliance&Halogen-Free)
Customer Name :
Customer Model :
GoerTek Model :
GoerTek
DESIGN
B4013AM423-098
CUSTOMER APPROVAL
Jery.Yang /July 4,2018
Anna.An /July 4,2018
CHECK
STANDARD
Sweety.Liu /July 4,2018
APPROVAL
Near.An /July 4,2018
Tel : + 86 536 3051234
E- Mail : goertek@goertek.com
Website: http://www.goertek.com
Address: No.268 Dongfang Road, High-Tech Industry
Development District, Weifang, Shandong, P.R.C.
Version ：1.0
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page 1/15
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Restricted
1 Security warning
The information contained in this document is the exclusive property of
GoerTek Inc. and should not be disclosed to any third party without the written
consent of GoerTek Inc.
2 Publication history
Version
Date
Description
Design
1.0
2018.07.04
New Design
Jery.Yang
Approval
Near.An
3 Symbols Show
Symbols
Show
C
Signify Customer's Special Characteristic.
G
Signify GoerTek Special Characteristic.
Version ：1.0
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page 2/15
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Contents
1 Test Condition
4
2 Electrical Characteristics
4
3 Frequency Response Curve and Limits
4
4 Measurement Circuit
5
5 Test setup Drawing
5
6 Mechanical Characteristics
6
6.1 Appearance Drawing
6.2 Weight
6
6
7 Structure of SMD MIC
7
8 Reliability Test
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
Vibration Test
Drop Test
Temperature Test
Humidity Test
Temperature Cycle Test
Temperature Shock Test
ESD Shock Test
Reflow Test
9 Package
8
8
8
8
8
8
8
8
9
9.1 Taping Specification
9.2 Reel Dimension
9.3 The content of box(13'' reel)
9.4 Packing Explain
9
10
10
11
10 Stock and Transportation
11
11 Land Pattern Recommendation
12
11.1 Soldering Surface - Land Pattern
11.2 Metal Mask Pattern
12
12
12 Recommend Soldering
12.1 Soldering Machine Condition
12.2 The pattern of the nozzle
12.3 Reflow Profile
13 Cautions when using SMD MIC
13.1
13.2
13.3
13.4
X-ray inspection
Board wash restrictions
Nozzle restrictions
Others restrictions
14 Output Inspection standard
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13
13
13
14
15
15
15
15
15
15
page 3/15
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PRODUCT SPECIFICATIONS
Type :
Model:
Electret Condenser Microphone
B4013AM423-098
1 Test Condition (Vs=2.0V , RL=2.2kΩ, L=50cm)
Standard Conditions
(Re. IEC 60268-4)
Temperature
Environment Conditions
+15℃～+35℃
25％RH～75%RH
86kPa～106kPa
Judgement Conditions
+20℃±2℃
60％RH～70%RH
86kPa～106kPa
Air pressure
Humidity
2 Electrical and Acoustical Characteristics
Symbol
Test Conditions
Min
Typ
Max
Unit
S
f=1kHz, Pin=1Pa
-45
-42
-39
Output Impedance
Zout
f=1kHz, Pin=1Pa
dB
0dB=1V/Pa
Ω
Directivity
D(θ)
Omnidirectional
Item
Sensitivity
Current Consumption
S/N Ratio
2.2k
dB
500
I
S/N(A)
Decreasing Voltage
Characteristic
Operating Voltage
Range
ΔS
f=1kHz, Pin=1Pa
A-Weighted Curve
58
f=1kHz, Pin=1Pa
Vs=2-1.5V
0
3
dB
1.1
5.0
V
f=1kHz, Pin=94dB
1
%
f=1kHz, Pin=115dB
5
%
f=1kHz, Pin=120dB
10
%
Vs
THD
Distortion
μA
dB
Relative Response (dB)
3 Frequency Response Curve and Limits
+10
+5
0
-5
-10
Version ：1.0
50
100
+2
+2
+2
+2
-2
-2
-2
-2
300
1k
Frequency (Hz)
3k
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8k
+5
-5
10k
20k
page 4/15
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4 Measurement Circuit
Term.1
FET
RL=2.2kΩ
Vs + 2.0V
+
Filter
OUTPUT
C=10μF
Term.2
GND
Circuit of the microphone
5 Test Setup Drawing
Power Amplifier
Free-field 1/2"
Microphone
Audio Analyzer
50cm
Speaker
MIC
Input
Output
Power&Load
Remote Control
Turn Table
Anechoic Room
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6 Mechanical Characteristics
6.1 Appearance Drawing (Unit: mm)
Ø1.5
6-Ø0.25±0.05
Sound Port
Ø2.0
Ø4.0
Ø1.8
Term1.Output(+)
1.3
Ø2.7
Term2.Ground(-)
Ø0.9
Tolerance: ±0.1mm
6.2 Weight
The weight of the MIC is less than 0.2g.
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7 Structure of SMD MIC
PCB (FET)
Holder
Grid Ring
Back Electret
Spacer
Diaphragm
Case
No.
Version ：1.0
Item
Qty.
Material
Vendor
1
PCB
1
KJ
FR-4
2
Holder
1
Yuyuan
HTN
3
Grid Ring
1
Yuyuan
Brass with nickel-plated
4
Back Electret
1
Yinhe
Stainless steel with PTFE
5
Spacer
1
Wanda+GoerTek
PI
6
Diaphragm
1
GoerTek
Stainless ring +PPS
with nickel-plated
7
Case
1
ABE
Brass with nickel-plated
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8
Reliability Test
8.1
Vibration
Test
8.2
Drop
Test
To be no interference in operation after vibrations,10Hz to 55 Hz for 1 minute full amplitude
1.52mm,for 2 hours at three axises in state of standard packing,sensitivity to be within
±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25% ～75%)
To be no interference in operation after dropped to steel plate each one time from 1.5
meter height ,12 times,sensitivity to be within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25% ～75%)
a) After exposure at +85°C for 200 hours,sensitivity to be within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25% ～75%)
8.3
Temperature
b) After exposure at -40°C for 200 hours,sensitivity to be within ±3dB from initial sensitivity.
Test
(The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25% ～75%)
8.4
Humidity
Test
After exposure at +60°C and 90~95% relative humidity for 200 hours,sensitivity to be
within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25% ～75%)
After exposure at -40°C for 30 minutes, at 20°C for 10 minutes, at+85°c for 30 minutes,at
8.5
20°C for 10 minutes,5 cycles,sensitivity to be within ±3dB from initial sensitivity.
Temperature
(The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25% ～75%)
Cycle Test
8.6
After exposure at -40 ℃ for 60 minutes, at+85 ℃ for 60 minutes(change time 20
Temperature seconds)，32 cycles,sensitivity to be within ±3dB from initial sensitivity.
Shock Test (The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25% ～75%)
8.7
The microphone under test must be discharged between each ESD exposure without
ESD Shock ground. (contact:±8kV,air:±15kV)
There is no interference in operation after 10 times exposure.
Test
8.8
Reflow
Test
Version ：1.0
Adopt the reflow curve of item11.3,after two reflows,sensitivity to be within ±3dB from
initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃～+35℃, R.H 25% ～75%)
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9 Package
9.1 Taping Specification
P0
ØD0
E
P2
B
W
A
F
B
A
P1
ØD1
10°
M0
A0
10°
T
B0
N0
K0
A-A
B-B
the dimensions as follows:
ITEM
W
E
F
ØD0
ØD1
DIM(mm)
12.0±0.30
1.75±0.10
5.50±0.05
1.50±0.10
1.55±0.10
ITEM
P0
10P0
P1
A0
B0
DIM(mm)
4.00±0.10
40.00±0.20
8.00±0.10
4.20±0.05
4.20±0.05
ITEM
K0
P2
T
DIM(mm)
1.70±0.10
2.00±0.05
0.35±0.05
Version ：1.0
M0
3.00±0.05
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N0
1.50±0.1
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9.2 Reel Dimension
7〃 reel for sample stage
13〃 reel will be provided for the mass production stage
The following is 13'' reel dimensions (unit:mm)
12.4±0.2
DETAIL A
inner side
06
08
05
03
07
A
Ø21±0.4
Ø330(max)
04
1.9±0.4
Ø100±0.5
Ø13±0.2
06
PS
120°
9.3 The content of box(13'' reel)
Separation Pad
06
04
05
08 03
07
06
PS
Packing (4000PCS)
Plastic Bag (20000PCS)
(336mm*115mm*450mm)
Version ：1.0
5 pcs reels
Plastic Bag (20000PCS)
(336mm*115mm*450mm)
Inner Box (20000PCS)
(340mm*135mm*355mm
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Two Inner Box(40000PCS)
Outer Box(40000PCS)
(370mm*300mm*390mm)
9.4 Packing Explain
9.4.1 The label content of the reel
06
08
07
04
05
03
xx
xx x
xx
xx xxxx x
x
xx
xx xxx xxxx
x
x
xx xxx
x
xx
the content including:
product type, Lot, customer P/N;
and other essential information such as Quantity,
Date etc.
06
PS
9.4.2 The RoHS&HF Label
05
03
04
06
08
07
RoHS & HF
compliance mark
xxxxxx
xxxxxx
06
PS
10 Stock and Transportation
10.1 Keep ECM in warehouse with less than 75% humidity and without sudden temperature
change, acid air, any other harmful air or strong magnetic field.
10.2 The ECM with normal pack can be transported by ordinary conveyances. Please protect
products against moist, shock, sunburn and pressure during transportation.
10.3 Storage Temperature Range: -40 ℃~+85℃
10.4 Operating Temperature Range: -30℃~+70℃
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11 Land Pattern Recommendation (Unit: mm)
11.1 Soldering Surface - Land Pattern
Ø1.8±0.05
Ø2.7±0.05
Ø3.4±0.05
Ø3.8±0.05
Ø0.9±0.05
4-0.2±0.05
11.2 Metal Mask Pattern
120°
Ø0.9±0.05
Ø2.7±0.05
Ø1.8±0.05
Ø3.8±0.05
3-0.8±0.05
3-0.8±0.05
Ø3.4±0.05
Opening for solder cream
- thickness of metal mask:0.1mm
Version ：2.0
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12 Recommend Soldering
12.1 Soldering Machine Condition
Temperature control
8 zones
Heater Type
Hot Air
Solder Type
Lead-free
12.2 The pattern of the nozzle
dimension of nozzle:504
external diameter: 1.5mm;
inside diameter: 1.0mm;
Pick up position:bottom border of microphone
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12.3 Reflow Profile
Temp. °C
Tpeak
T3
T2
T1
t3
t2
t1
tsoak
Time. sec
Pb-free reflow profile requirements for soldering heat resistance
Parameter
Reference
Specification
Average Temperature Gradient in Preheating
---
2.5℃/s
Soak Time
tsoak
2-3 Minutes
Time Above 217 ℃
t1
Max 60s
Time Above 230 ℃
t2
Max 50s
Time Above 250 ℃
t3
Max 10s
Peak Temperature In Reflow
Tpeak
255℃ (-0/+5℃)
Temperature Gradient In Cooling
---
Max -5℃/s
When SMD MIC is soldered on PCB, the reflow profile is set according to solder paste
and the thickness of PCB etc.
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13 Cautions when using SMD MIC
13.1 X-ray inspection
The microphone should not be subjected to X-ray inspection. If it is absolutely
necessary to do inspection using X-ray, the setting conditions with the following
conditions:
Distance: >0.08meter;
Current:
