SFR315A

SHENZHEN HUAYUAN MICRO ELECTRONIC TECHNOLOGY CO. , LTD . Shenzhen Office: TEL: 0755-29881155 FAX:0755-29881157 EMAIL:zxsf_sales@163.com QQ:2109300457 www.szhywd.com APPROVAL SHEET Approval Specification Customer’s Approval Certificate Please return this copy as a certification of your approval TO: Part No.: Checked & Approved by: Customer’s Part No.: Date: BEIJING ZHONGXUN SIFANG SCIENCE & TECHNOLOGY CO.,LTD. Tel: +86-010-58937383 Fax: +86-010-58937263 E-mail： zxsf_sales@163.com QQ: 2109300457 Website: http://www.bjzxsf.net Add: No 201, Block A. Building 3. Yongjie Beilu Yongfeng high-tech industrial base Haidian District Beijing city Part No. : SFR315A Pages : 6 Date : 2013/3/21 Revision : 1.0 Prepared by: Checked by: Approved by: SAW Resonator SFR315A 315.00MHz Features „ „ „ „ „ „ 1-port Resonator Ceramic Package for Surface Mounted Technology (SMT) RoHS compatible Package size 5.00x5.00x1.50mm3 Package Code QCC8C Electrostatic Sensitive Device(ESD) Application Typical Low-Power Transmitter Application Typical Local Oscillator Application Package Dimensions (QCC8C) Please read notes at the end of this document. Pin Configuration -2- 2 Input 6 Output 1,3,4,5,7,8 Ground www.bjzxsf.net 2013/3/21 SAW Resonator SFR315A 315.00MHz Marking · SF SF Trademark R315A R SAW Resonator 315A Part number Test Circuit Equivalent LC Model Temperature Characteristics The curve shown above accounts for resonator contribution only and does not include LC component temperature contributions. Please read notes at the end of this document. -3- www.bjzxsf.net 2013/3/21 SAW Resonator SFR315A 315.00MHz Performance Maximum Rating Item Value Unit V DC ±30 V T -40 ~ +85 ℃ Storage Temperature T stg -55 ~ +125 ℃ RF Power Dissipation P 10 dBm DC Voltage Operation Temperature Electronic Characteristics Test Temperature: 25℃±2℃ Terminating source impedance: 50Ω Terminating load impedance: 50Ω Item Center Frequency Temperature Stability Frequency Aging Maximum Unit 315.00 MHz △fc ±75 KHz IL 1.1 Unloaded Q QU 17824 50Ω Loaded Q QL 1925 Turnover Temperature T0 Turnover Frequency f0 fc Frequency Temperature Coefficient FTC 0.032 ppm/℃ Absolute Value during the First Year |fA| ≤10 ppm/yr Tolerance from 315.00MHz DC Insulation Resistance between Any Two Pins RF Equivalent RLC Model Typical fc Absolute Frequency Insertion Loss(min) Quality Factor Minimum 25 40 1.6 dB 55 ℃ 1.0 MΩ Motional Resistance RM 13.0 Motional Inductance LM 109.1 µH Motional Capacitance CM 2.34 fF Static Capacitance C0 Please read notes at the end of this document. -4- 2.9 3.2 www.bjzxsf.net 20.0 3.5 Ω pF 2013/3/21 SAW Resonator SFR315A 315.00MHz Frequency Response Reliability（The SAW components shall remain electrical performance after tests） No. Test item 1 Temperature Storage 2 Humidity Test Test condition (1) Temperature: 85℃±2℃ , Duration: 250h , Recovery time: 2h±0.5h (2) Temperature: –55℃±3℃ , Duration: 250h ,Recovery time: 2h±0.5h Conditions: 60℃±2℃ , 90~95% RH Duration: 250h Heat cycle conditions: TA=-40℃±3℃, TB=85℃±2℃, t1=t2=30min, Switch 3 Thermal Shock Frequency of vibration: 10~55Hz Amplitude:1.5mm 4 Vibration Fatigue Directions: X,Y and Z Duration: 2h 5 Drop Test Cycle time: 10 times Height: 1.0m Temperature: 245℃±5℃ Duration: 3.0s--5.0s 6 Solder Ability Test time: ≤3min , Cycle time: 100 times , Recovery time : 2h±0.5h. Depth: DIP--2/3 , SMD--1/5 (1)Thickness of PCB:1mm , Solder condition: 260℃±5℃ , Duration: 10±1s 7 Resistance to Soldering Heat (2)Temperature of Soldering Iron: 350℃±10℃ , Duration: 3~4s , Recovery time : 2 ± 0.5h Please read notes at the end of this document. -5- www.bjzxsf.net 2013/3/21 SAW Resonator SFR315A 315.00MHz Recommended Reflow Soldering Diagram Notes 1. As a result of the particularity of inner structure of SAW products, it easy to be breakdown by electrostatic, so we should pay attention to ESD protect in the test. 2. Static voltage between signal load and ground may cause deterioration and destruction of the component. Please avoid static voltage. 3. Ultrasonic cleaning may cause deterioration and destruction of the component. Please avoid ultrasonic cleaning. 4. Only leads of component may be soldered. Please avoid soldering another part of component. 5. There is a close relationship between the device's performance and matching network. The specifications of this device are based on the test circuit shown above. L and C values may change depending on board layout. Values shown are intended as a guide only. Please read notes at the end of this document. -6- www.bjzxsf.net 2013/3/21