MIP25202R2MBE

INPAQ Global RF/Component Solutions MIP 2012-2520 Series Specification Product Name Series Size Power Inductor MIP Series EIAJ 2012-2520 INPAQ Global RF/Component Solutions RoHS Pb Multilayer Power Inductor (MIP Series) Engineering Spec. This product belongs to the industrial grade standard, not the vehicle gauge product! Can not use auto parts, if the customer is not expressly informed and privately used to auto parts, produce any consequences, the original is not responsible for after-sales service, thank you! Features The monolithic construction performs high reliability and ensures a closed magnetic flux in a component avoids magnetic leakage and interference . Allow for higher mounting density. Low DC resistance. Applications Suitable for DVD , DSC , PND , PC , NB , Power Line Shapes and Dimensions 2012 2016 (EIA0805) (EIA0806) (EIA1008) L 2.00±0.20 2.00±0.20 2.50±0.20 W 1.25±0.20 1.60±0.20 2.00±0.20 T 0.90±0.10 0.90±0.10 0.90±0.10 E 0.50±0.30 0.50±0.30 0.50±0.30 TYPE Unit 2520 mm MIP 2012-2520 Series Engineer Specification All Specifications are subject to change without notice. Version: A7 Page 1 of 6 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions Part Number Code MIP 2012 2R2 1 2 3 M 4 B 5 E 6 1 Series Name ， 2 Size Code : The first two digitals: length(mm) the last two digitals: width(mm) 3 Inductance : R = Decimal point 4 Tolerance : M = ±20% ，Unit = μH ， 5 Soldering : Green Parts B= Lead-Free for whole chip 6 Packaging : E = Embossed plastic tape, 7" reel Part Number and Characteristics Table Inductance±20% (μH) Test Freq. (MHz) SRF (MHz) DCR±25% (Ω Ω) Rated Current (mA) MIP2012 1R0MBE MIP2012 2R2MBE 1.00 2.20 1 1 90 70 0.100 0.170 1100 900 MIP2012 3R3MBE 3.30 1 50 0.200 800 MIP2012 4R7MBE 4.70 1 40 0.230 700 MIP2016 2R2MBE 2.20 1 40 0.120 1100 MIP2016 4R7MBE 4.70 1 20 0.160 900 MIP2520 R47MBE 0.47 1 100 0.040 1800 MIP2520 1R0MBE 1.00 1 60 0.055 1600 MIP2520 1R5MBE 1.50 1 50 0.070 1500 MIP2520 2R2MBE 2.20 1 40 0.080 1300 MIP2520 3R3MBE 3.30 1 30 0.100 1200 MIP2520 4R7MBE 4.70 1 25 0.110 1100 MIP2520 6R8MBE 6.80 1 25 0.200 1100 Part Number. 2012 Series 2016 Series 2520 Series •HP4291B-RF Impedance / Material Analyzer Test Instruments and •HP4338A/B Milliohm meter Conditions Test Frequency : 1 MHz / OSC Level : 100mV ：For special part number which is not shown in the above table, please refer to appendix. *2：Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. *1 MIP 2012-2520 Series Engineer Specification All Specifications are subject to change without notice. Version: A7 Page 2 of 6 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions Tape and Reel Specifications Plastic Carrier (E) Taping Dimensions (mm) 2012 2016 2520 Symbol E E E W 8.00 ± 0.10 8.00 ± 0.10 8.00 ± 0.10 P 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 E 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 F 3.50 ± 0.10 3.50 ± 0.10 3.50 ± 0.10 D 1.55 ± 0.05 1.55 ± 0.05 1.55 ± 0.05 D1 1.00 ± 0.05 1.00 ± 0.05 1.00 ± 0.05 Po 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 10Po 40.0 ± 0.20 40.0 ± 0.20 40.0 ± 0.20 P2 2.00 ± 0.10 2.00 ± 0.10 2.00 ± 0.10 Ao 1.40 ± 0.10 1.80 ± 0.10 2.25 ± 0.10 Bo 2.30 ± 0.10 2.20 ± 0.10 2.80 ± 0.10 Ko(T) 1.13 ± 0.10 1.15 ± 0.10 1.35 ± 0.10 t 0.22 ± 0.05 0.22 ± 0.05 0.22 ± 0.05 MIP 2012-2520 Series Engineer Specification All Specifications are subject to change without notice. Version: A7 Page 3 of 6 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions Reel Dimensions 7” Reel Packaging Quantity PART SIZE (EIA SIZE) 2012 (0805) 2016 (0806) 2520 (1008) Qty.(pcs) 3,000 3,000 3,000 BOX 5 reels / inner box 5 reels / inner box 5 reels / inner box Recommended Soldering Conditions MIP 2012-2520 Series Engineer Specification All Specifications are subject to change without notice. Version: A7 Page 4 of 6 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions Land Patterns for Reflow Soldering Solder land information： ： Size(mm) A B C 2012 1.0 ~ 1.2 3.0 ~ 4.0 0.8 ~ 1.1 2016 1.0 ~ 1.2 3.0 ~ 4.0 1.0 ~ 1.5 2520 1.2~1.5 3.5~4.0 1.5~2.0 Reliability and Test Condition Test item Test condition 1. Resistance to Solder Heat 2. 3. Criteria ℃ Solder temperature : 260 ± 5 Flux : Rosin DIP time : 10 ± 1 sec ℃ Solderability 1. Solder temperature : 235 ± 5 2. Flux : Rosin 3. DIP time : 5 ± 1 sec 1. More than 95 % of terminal electrode should be covered with new solder 2. No mechanical damage 3. Inductance value should be within ± 20 % of the initial value * Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. 1. More than 95 % of terminal electrode should be covered with new solder 2. No mechanical damage MIP 2012-2520 Series Engineer Specification All Specifications are subject to change without notice. Version: A7 Page 5 of 6 www.inpaq.com.tw ; www.inpaqgp.com INPAQ Global RF/Component Solutions Test item Test condition ℃ Criteria Adhesive Test 1. Reflow temperature : 245 It shall be Soldered on the substrate applying direction parallel to the substrate 2. Apply force(F) : 5 N 3. Test time : 10 sec 1. No mechanical damage 2. Soldering the products on PCB after the pulling test force > 5 N Temperature Cycle 1. Temperature:-40 ~ 85℃ For 30 minutes each 2. Cycle: 100 cycles 3. Measurement:At ambient temperature 24 hours after test completion 1. No mechanical damage 2. Inductance should be within ±20% of the initial value * Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. 1. Temperature: 85 ± 5℃ 2. Testing time: 1000 hrs 3. Measurement: at ambient temperature 24 hours after test completion 1. No mechanical damage 2. Inductance should be within ±20% of the initial value * Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. High Temperature Resistance ℃ Humidity Rated Current 1. Temperature: 40℃ ± 2 2. Humidity: 90-95 % RH 3. Testing time: 1000 hrs 4. Measurement:At ambient temperature 24 hours after test completion 1. No mechanical damage 2. Inductance should be within ±20% of the initial value * Apply DC 0.4 ~ 0.6A to chip for 1 ~ 3 sec. before to measure inductance. At ambient temperature & humidity Testing time:5 minutes ( under full rated current ) MIP product surface temp below room temperature plus 40℃ ： General Technical Data Operating temperature range : - 40℃ ~ +85℃ Storage Condition : Less than 40℃ and 70% RH Storage Time : 12 months Max. Soldering method : Reflow MIP 2012-2520 Series Engineer Specification All Specifications are subject to change without notice. Version: A7 Page 6 of 6 www.inpaq.com.tw ; www.inpaqgp.com