PRELIMINARY SPECIFICATIONS
GP
SSR050000I3CH
Customer Part No.:
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.: HSO751S/ 50.000MHz
Sample Order No:
Date:
OSCILLATOR
2012/11/19
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
HARMONY ELECTRONICS (SUZHOU) CO.,LTD
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409
號2樓
2F., NO.409, SEC.2, TIDING
BLVD., NEIHU DISTRICT,
TAIPEI CITY 114, TAIWAN
TEL:886-2-26588883
FAX:886-2-26588683
TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路
39 號
No.39, HWA DONG RD.,
DALLIAO DIST.,DAFA
INDUSTRIAL PARK.,
KAOHSIUNG CITY 831,
TAIWAN
TEL: (07)787-1555-6
FAX: (07)787-1557
THAILAND FACTORY:
66MOO 5,
KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE
70110, THAILAND
TEL: (032)221994-6,
200740-1
FAX: (032)200742
Tittle
SHENZHEN FACTORY:
深圳市福永鎮塘尾村塘橋路聚源
工業區
QIAO TANG RD., TANGWEI
VILLAGE FU YONG TOWN
SHENZHEN CITY CHINA
TEL: 0755-27309272 /
27309262
FAX: 0755-27309755
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SUZHOU FACTORY:
蘇州市相城區黃埭鎮安民路 5 號
NO.5 ANMING ROAD,
HUANGDAI TOWN,
XIANGCHENG DISTRCT,
SUZHOU CITY, JIANGSU
PROVINCE
TEL:86-512-67592373
FAX:86-512-67592363
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HSO751S
SPECIFICATION
INDEX
ITEM
PAGE
1. Type •••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
3
2. Output Frequency •••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
3
3. Absolute Maximum Ratings ••••••••••••••••••••••••••••••••••••••••••••••••••
3
4. Electric Specifications •••••••••••••••••••••••••••••••••••••••••••••••••••••••••
3-4
5. Dimensions ••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
5
6. Inside Structure•••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
6
7. Mechanical Performance
••••••••••••••••••••••••••••••••••••••••••••••••••••
6
••••••••••••••••••••••••••••••••••••••••••••••••••
7
8. Environment Performance
9. Supplement••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
8-9
10. Taping and Packing•••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
9-12
11.Flow Chart••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••••
13
12.Environmental Workload Chemical Substance Components List
14
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1. Type Name:
HSO751S
2. Output Frequency:
50.000000MHz
3. Absolute Maximum Ratings:
Item
Symbol
Vdd terminal voltage
Vdd
Input terminal voltage
Vcont
Output terminal voltage
Vout
Output terminal current
Iout
Storage temp. range
Tstr
4.
Value
-0.5 ~ 7.0
-0.5 ~ Vdd+0.5
-0.5 ~ Vdd+0.5
25
-55 ~ 125
Unit
V
V
V
mA
℃
Electric Specifications:
Δf/F
Topr
Vdd
Min
-50
-10
3.0
Value
Typ
25
3.3
Max
+50
+70
3.6
Idd1
-
-
25
mA
Idd2
-
-
0.02
mA
Item
Symbol
Frequency tolerance
Operating temp. range
Supply voltage
Current consumption 1
(#1 pin: open or "H")
Current consumption 2
(#1 pin: "L" level)
Symmetry
Low level output voltage
High level output voltage
Rise & Fall time
Pin #1 options
Output load
Low level input current
High Level input current
Low level input voltage
High level input voltage
Output disable time
Output enable time
Aging
Etc
ppm
℃
V
Condition
Vdd
Temp
3.3+/0.3V
-10~70
℃
Fig1,2 3.3V
60
%
0.1xVdd
V
V
10
ns
YES
C-MOS CL =15 pF (Idd1, Idd2 test at No Load)
μA
-100
μA
100
Vddx0.3
V
Fig3
3.3V
Vddx0.7
V
100
ns
10
ms
-5
5
ppm/year
25±3℃
Duty
40
Vol
Voh
0.9xVdd
Tr & Tf
-
Iil
Iih
Vil
Vih
Tplz
Tpzl
-
Unit
50
-
25±3℃
F :Output Frequency
Δf =Oscillation Frequency – F
Frequency Stability is inclusive of 25℃
Tolerance, operating temperature range, input voltage change,
Load chang, first of aging , shock and vibration.
Moisture Sensitivity Level : Level 1
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Fig. 1) Measurement Circuit :
CL = Include jig & probe capacitance
(Refer to 4)
Switch
H
Open
L
Out term.
Oscillation out
Oscillation out
High Z
Fig. 2) Output Wave Form:
Fig. 3) Input Output Condition:
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5. Dimensions:
Lot No.:
Year : Last digit of the year
Year
Code
2000
2010
0
2001
2011
1
2002
2012
2
2003
2013
3
2004
2014
4
2005
2015
5
2006
2016
6
2007
2017
7
2008
2018
8
2009
2019
9
Month : Alphabet assign below
Month
Code
1
A
2
B
3
C
4
D
5
E
6
F
7
G
8
H
9
J
10
K
11
L
12
M
Marking : Laser marking.
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6.
Inside Structure:
Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
Metalized Pad:
Ni Plating
Au Plating
(2)IC:
IC(Si. Al. Ti.)
(3) Au Bonding Wire:
Au
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) LID:
Fe+Ni+Co
(6) Adhesive
Silver Conductive Silicon Resin
The use prohibition chemistry substance of
Table 1 of DHE-0204-1 (HE-QA-24) is not
included in this item.
7. Mechanical Performance:
Item
1
Natural Drop
2
Vibration
3
Sealing
Tightness
Solderability
4
Drop 3 times from the height of 50cm onto min. 30mm
thickness hard wooden board.
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to
X, Y and Z 3 axes, Duration of 2 hours to each axis.
Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium
leak detector. – Fine Leakage.
After applying ROSIN Flux, dipping in solder bath at
245deg.C+/-5deg.C for 3+/-0.5 sec.
Tittle
A
A
--B
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Specifications
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Test Methods
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8.
1
2
3
4
5
Environment Performance:
Test Methods
Humidity
Temperature 60℃+/-2℃,RH 90~95%, Duration of 240
hours.
Back to room temperature first, then in 1~2 hours, the
component shall be checked.
-40deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
+85deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
-30deg.C +/-2deg.C (30min) ↔ +80deg.C +/-2deg.C
(30min) 25 cycles. Back to the room temperature first, then
in 1~2 hours, the component shall be checked.
+85deg.C +/-5deg.C, +3.3V Vdd Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
Storage in Low
Temperature
Storage in High
Temperature
Temperature
cycles
High
Temperature
Operation
Specifications code
A
B
A
A
A
A
A
Test Methods
Frequency variation shall be within +/-5ppm and equivalent resistance
shall be within the specification after the test
More than 90% of lead shall be covered by new solder.
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9. Supplement:
9.1.Soldering
9.2.Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
9.3.Land Pattern Layout: (Example)
9.4.Solder Iron: (Example)
Bit temp.:350℃ Max. , Time:3sec Max. ,
Each terminal solder a 1 time Max.
9.5.Mounting:
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be
sure of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause
Soldering Process.
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9.6.Cleaning:
Cleaning liquid which corrodes Nickel shall not be used.
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
9.7.Handling:
HSO751S series is designed to withstand Drop and Vibration, however, the crystal
blank might be broken. So, if excess force is given, please check the characteristics
before use.
HSO751S series has C-MOS circuit inside. Please pay attention to static-electricity as
same handling as other C-MOS. devices.
9.8.By-pass Capacitor:
It has no by-pass capacitor integrated. We recommend you to use capacitor (like
ceramic chip capacitor) 0.01μF in-between Vdd and GND.
9.9.Storage:
Please keep away from high temperature and high humidity, which may cause put
solderbility. No direct Sunlight, No dew as well.
10. Taping and Packing:
10.1.Emboss Tape Specifications:
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10.2.Reel Specifications:
(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
16.8+/-0.3
Outer Width
W2
Out Line diameter
B
19.5+/-1.0
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
q
C
120deg
ψ13.2+/-0.5
E
2.4+/-0.2
ITEM
FLANCE
HUB
Center
Core slit
Width
Position
Spindle diameter
Key Ditch
Width
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10.3.Storage:
Temperature+40℃ Max.
Humidity 80% Max.
10.4.Quantity on Reel:
1,000 PCS/REEL
10.5.Label:
Label is following information:
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10.6. PACKAGE:
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11.
Flow Chart:
LID(外 殼 蓋 )
BLANK(晶 片 )
LID進 料 檢 查
1
2
BASE(基 座 )
BLANK進 料 檢 查
Incoming Inspection
of LID
LID洗 淨
7
8
Cleaning of LID
9
4
Incoming Inspection
of BLANK
11
12
13
14
15
BASE進 料 檢 查
Incoming Inspection
of BASE
3
IC進 料 檢 查
Incoming
Inspection of IC
化學蝕刻
Etching
頻率選別
5
Freq. Sorting
IC 搭 載
IC Ass'y
蒸著前洗淨
10
IC
6
Cleaning before
Base Plating
打 金 線 ($)
Wire Bonding
微蝕刻
Flash Etching
基 礎 蒸 著 ($)
Base Plating
押入接著
Blank Ass'y
接著硬化
Adhesive Curing
接 著 檢 查 ($)
Bonding Check
CI 檢 查 (C)
16
17
18
19
CI Inspection
(3rd Overtone: ALL;
F0:Designation Item ONLY)
調整蒸著
27
Partial Plating
中 間 檢 查 ($)
28
Middle Check
超 音 波 洗 淨 (C)
29
U.S Dry Cleaning
氣 密 檢 查 I (AIR)($)
Leak Check I
氣 密 檢 查 II(氦 氣 加 壓 )
Leak Check II
(Helium Pressurization)
氣 密 檢 查 II(HE)($)
Leak Check II
Se am前 外 觀 檢 查 (C)
20
21
22
($): 特 殊 特 性
(For Special Characteristics)
(C): 指 定 製 程
(Specific Assignment)
(Refer to Tip Top system flow setting
when there have special flow)
Appearance Check
(Designation Item ONLY)
溫 度 特 性 檢 查 (C)
30
高真空烘烤
Annealing
in High Vacuum
31
印 字 Marking
32
24
REFLOW
33
25
老 化 Aging
34
Final Check
外觀檢查
Appearance Check
出貨檢查
Outgoing Inspection
Tapping/Packing
DLD檢 查 (C)
出 貨 Shipment
Check of DLD
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熔 接 Seam Seal
23
26
Check of
Temp. Characteristics
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12. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
HSO751S
PERCENTAGE
151(mg)
ppm
Si
0.8758
1322.458
Au
0.4983
752.433
Co & Co Compound
7.1725
10830.475
Mo & Mo Compound
0.4375
660.625
Ag
3.3220
5016.22
Cu
0.4983
752.433
Cr & Cr Compound
0.2718
410.418
33.5069
50595.419
Mn & Mn Compound
0.1963
296.413
W & W Compound
0.9664
1459.264
Ni & Ni Compound
14.2544
21524.144
Fe
25.6096
38670.496
Chemical Substance Components
Al
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REV.
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REASON
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CONTENTS
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