SPECIFICATIONS FOR APPROVAL
GP
Customer Part No.
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.: HSX321S / 12.000MHz
Sample Order No:
EOS-860118-17
X3S012000FK1H-HV
CRYSTAL
Date:
2008/06/12
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409 號 2 樓
2F., NO.409, SEC.2, TIDING BLVD.,
NEIHU DISTRICT, TAIPEI CITY 114,
TAIWAN (R.O.C.)
TEL:886-2-26588883
FAX:886-2-26588683
TAIWAN FACTORY:
工廠:(831)
高雄縣大寮鄉大發工業區華東路 39 號
NO. 39, HWA DONG RD., TA FA IND.
DIST., TA LIAO KAOHSIUNG HSIEN 831,
TAIWAN, R.O.C.
TEL: (07)787-1555-6
FAX: (07)787-1557
Tittle HSX321S
Date
THAILAND FACTORY:
66MOO 5, KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE 70110,
THAILAND
TEL: (032)221994-6, 200740-1
FAX: (032)200742
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SHENZHEN FACTORY:
深圳市福永鎮塘尾村塘橋路聚源工業區
QIAO TANG RD., TANGWEI VILLAGE
FU YONG TOWN SHENZHEN CITY
CHINA
TEL: 0755-7309272 / 7309262
FAX: 0755-7309755
TAIWAN FACTORY
THAILAND FACTORY
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X3S012000FK1H-HV
ELECTRONICS
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Page
1
HSX321S
SPECIFICATION
INDEX
ITEM
PAGE
1. QUARTZ CRYSTAL UNIT SPECIFICATION...........
3
2. MARKING & DIMENSIONS...................
4
3. INSIDE STRUCTURE......................
5
4. EMBOSS CARRIER TAPE&REEL................
6
a. DIMENSIONS OF CARRIER TAPE...............
6
b. DIMENSIONS OF REEL...................
6-7
c. STORAGE CONDITION...................
7
d. STANDARD PACKING QUANTITY...................
7
e. MATERIAL OF TAPE.....................
7
f. LABEL CONTENTS......................
7
g. TAPING DIMENSION.....................
8
h. JOINT OF TAPE.......................
8
i. RELEASE STRENGHT OF COVER TAPE............
8
5. MECHANICAL PERFORMANOE.................
9
6. ENVIRONMENTAL PERFORMANOE...............
9-10
7. SUPPLRMENT........................
10-11
8. FLOW CHARD.........................
12
9. Environmental Workload Chemical Substance Components List.
13
10. TEST DATA..........................
Tittle HSX321S
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1. QUARTZ CRYSTAL UNIT SPECIFICATION
1. Frequency:
12.000000MHz
2. Holder type :
HSX321S
3. Frequency tolerance:
+/-30ppm at 25deg.C +/-3deg.C
4. Equivalent resistance:
80 ohms Max. / SERIES
5. Storage temperature range:
-40 deg.C To +85 deg.C
6. Operable temperature range:
-30 deg.C To +85deg.C
7. Temperature drift:
+/-30 ppm
8. Loading capacitance (CL) :
20.0pF+/- 0.2 pF
9. Drive level:
10 μW+/-2 μW
10. Shunt Capacitance:
2.0pF Max
11. Insulation resistance :
More than 500M ohms at DC 100V
12. Mode of oscillation:
Fundamental
13. Circuit:
Measured in S&A 250B ,HP/E5100A
14. Shocking :
Dropping from 50 cm height 3 times on firm wood
Variation :
-30 deg.C To +85deg.C
Frequency less than +/-5 ppm
Resistance less than +/- 15 ﹪or 2ohms max.
15. Aging:
Less than +/- 5 ppm/Year
16. Holder
HSX321S Seam type
17.Dimensions and marking
Refer to page.4
18.Emboss carrier tape & reel
Refer to page.6 and page.7
19.Note:
Tittle HSX321S
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2. HSX321S MARKING & DIMENSIONS
*Marking should be printed as following:
Logo, Nominal Frequency, Manufactured year & month
*Nominal frequency = integer only
( ex. 14.31818 MHz Æ 14 )
*Manufacturing Lot No.
(Y: year) ex. 2000 shall be marked as ‘ 0 ’ (The last digit of the year)
(M: month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-1).
Marking : Laser marking.
(Table-1)
Jan.
A
Feb.
B
Mar.
C
Apr.
D
May.
E
Jun.
F
Tittle HSX321S
Date
Jul.
G
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Aug.
H
Sep.
J
Oct.
K
Nov.
L
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Dec.
M
Page
4
3. INSIDE STRUCTURE
※Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
Metallized Pad: W
Ni Plating
Au Plating
(2) Cap:
Fe-Ni
(3) Crystal Enclosure Seal:
Seal Seam
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) Adhesive
Silver Conductive Silicon Resin
Adhesive bonding:
upper & lower bonding/lower bonding only
(6) Electrode
Ag
(7) PAD
Alumina Ceramic (W. Ni. Au)
Tittle HSX321S
Date
The use prohibition chemistry
substance of Table 1 of DHE-0204-1
(QA-QM-08) is not included in this
item.
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4. HSX321S EMBOSS CARRIER TAPE & REEL
a.) Dimensions of Carrier Tape
b.) Dimensions of Reel
(Table-2)
(UNIT: mm)
Tittle HSX321S
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MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ178+1/-1
Inner Width
W1
8.0+/-1.5
Outer Width
W2
Out Line diameter
B
11.5+/-0.2
ψ60+1.0/-0.0
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
q
C
120deg
ψ13+/-0.5
E
2.5+/-0.5/-0
ITEM
FLANCE
HUB
Center
Core slit
Width
Position
Spindle diameter
Key Ditch
Width
c.) Storage condition
Temperature: +40deg.C Max.
Relative Humidity: 80% Max.
d.) Standard packing quantity
3,000PCS / REEL
e.) Material of the tape
Tape
Carrier tape
Top tape
Material
A – PET
Polyester
f.) Label contents
.The type of product
.Our specification No.
.Your Part No.
.Lot No.
.Nominal Frequency
.Quantity
.Our Company Name
Sticks label for every reel.
Tittle HSX321S
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g.) Taping dimension
Cover-tape
Leader
Carrier-tape
Cover-tape
Terminal
Carrier-tape
Terminal
The length of cover-tape in the leader is more than 400 mm including empty
embossed area.
After all products were packaged, must remain more than twenty pieces or
400 mm empty area, which should be sealed by cover-tape.
The tip of cover-tape shall be fixed temporary by paper tape and roll around
the core of reel one round.
The empty embossed area which are sealed by top cover-tape must remain
more the 40 mm.
Components
Leader
Emptv compartments
Emptv compartments
Top cover-tape
Embossed Carrier-tape
h.) Joint of tape
The carrier-tape and top cover-tape should not be jointed.
i.) Release strength of cover tape
It has to between 0.1N to 0.7N under following condition.
Pulling direction 165° to 180°
Speed
300mm/min.
Otherwise unless specified.
165°~ 180°
Pulling direction
Other standards shall be based on JIS C 0806-1990.
Tittle HSX321S
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5. Mechanical Performance
5.1.Natural Drop
Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board
The component shall satisfy requirement of the electrical characteristics.
5.2.Vibration
Frequency 10-55Hz, Sine Wave full amplitude of 1.5mm to X,Y and Z 3 axes, Duration of
2 hours to each axis.
The component shall satisfy requirement of the electrical characteristics.
5.3.Sealing Tightness
3
Leak Rate 1.0x10-8 Pa-m /sec. Max. measured by Helium leak detector.
5.4.Solderability
After applying ROSIN Flux, dipping in solder bath at 230℃+/-5℃ for 5 sec.
Over 90% of terminal shall be covered by solder.
6.
Environment Performance
6.1.Humidity
Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours
Back to room temperature first, then in 1~2 hours, the component shall be checked.
The component shall satisfy requirement of the electrical characteristics.
No physical damage
6.2.Storage in Low Temperature
-30℃+/-2℃,Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component shall be checked.
The component shall satisfy requirement of the electrical characteristics.
No physical damage
6.3.Storage in High Temperature
+85℃+/-2℃,Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component shall be checked.
The component shall satisfy requirement of the electrical characteristics.
No physical damage
Tittle HSX321S
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6.4.Temperature cycles
-30℃+/-2℃(30min)↔+85℃+/-2℃(30min) 20 cycles
Back to the room temperature first, then in 1~2 hours, the component shall be checked.
The component shall satisfy requirement of the electrical characteristics.
No physical damage
6.5.VPS
FC-70(the boiling point:+215℃)Vapor for 30 sec
Back to the room temperature first, then in 1~2 hours, the component shall be checked.
The component shall satisfy requirement of the electrical characteristics.
No physical damage
7. Supplement
7.1.Soldering
7.2.Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
Tittle HSX321S
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7.3.Land pattern layout(Example)
7.4.Solder iron (Example)
Bit temp.:350℃max.,Time:3sec max. ,Each terminal solder a 1 time max.
7.5.Mounting
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be sure
of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause Soldering
Process.
7.6.Cleaning
Cleaning liquid which corrodes Nickel shall not be used
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
7.7.Storage
Please keep away from high temperature and high humidity ,which may cause put solderbility. No
direct Sunlight, No dew as well.
Tittle HSX321S
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8. Flow Chard
BASE
2
CAP
BLANK
INCOMING
A
1
3
INCOMING
4
CLEAN BEFORE ETCHING
5
ETCHING
6
SORTING OF FREQ.
7
CLEANING OF BLANK
8
FLASH ETCHING
9
BASE PLATING
19
MARKING
10
BLANK ASS’Y
20
LEAK CHECK Ⅰ
(AIR LEAK)
11
ADHESIVE CURING
21
LEAK CHECK Ⅱ
(He
LEAK)
12
BONDING CHECK
22
FINAL CHECK ($) + TAPING
13
PARTIAL PLATING
23
APPEARANCE CHECK
14
MIDDLE CHECK ($)
15
ANNEALING IN HIGH
24
25
OUTGOING INSPECTION
OUTGOING PACKING
16
INCOMING
SEAM
17
REFLOW
18
AGING
SHIPPING
A
Tittle HSX321S
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($):SPECIAL CHARACTERISTICS
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9. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
H(D)SX321S
PERCENTAGE
Chemical Substance Components
19(mg)
ppm
Si
0.0437
2,300
Au
0.1463
7,700
Co & Co Compound
1.1286
59,400
Mo & Mo Compound
0.0380
2,000
Ag
0.3952
20,800
Cu
0.1102
5,800
Cr & Cr Compound
0.0380
2,000
Al
4.7234
248,600
Mn & Mn Compound
0.0228
1,200
W & W Compound
0.1843
9,700
Ni & Ni Compound
2.8424
149,600
Fe
3.8437
202,300
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REV.
DATE
REASON
No.
0
2008/06/12
New
CONTENTS
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