SSW027000FECHC-T

SPECIFICATIONS FOR APPROVAL GP Customer Part No.: HELE. Part No: Application For: Products: Accepted Model: Type & Freq.: Sample Order No: EOS-G50130-6 SSW027000FECHC-T OSCILLATOR HSO321S / 27.000MHz Date: 2016/06/01 Approved By : HARMONY ELECTRONICS CORP. HARMONY ELECTRONICS (THAILAND) CO., LTD. HARMONY ELECTRONICS (SHENZHEN) CORP., LTD. TAIPEI OFFICE: 公司:(114) 台北市內湖區堤頂大道 2 段 409 號 2 樓 2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN TEL:886-2-26588883 FAX:886-2-26588683 TAIWAN FACTORY: 工廠:(831) 高雄市大寮區大發工業區華東路 39 號 No.39, HWA DONG RD., DALLIAO DIST.,DAFA INDUSTRIAL PARK., KAOHSIUNG CITY 831, TAIWAN TEL: (07)787-1555-6 FAX: (07)787-1557 Tittle THAILAND FACTORY: 66MOO 5, KAONGU-BEOKPRAI RD., T.BEOKPRAI, A. BANPONG, RAJCHABUREE PROVINCE 70110, THAILAND TEL: (032)221994-6, 200740-1 FAX: (032)200742 SHENZHEN FACTORY: 深圳市福永鎮塘尾村橋塘路聚源工業區 QIAO TANG RD., TANGWEI VILLAGE FU YONG TOWN SHENZHEN CITY CHINA TEL: 0755-27309272 / 27309262 FAX: 0755-27309755 Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 1 HSO321S SPECIFICATION INDEX ITEM PAGE 1. Type．．．．．．．．．．．．．．．．．．．．．．．．．．．．．． 3 2. Output Frequency．．．．．．．．．．．．．．．．．．．．．．． 3 3. Absolute Maximum Ratings．．．．．．．．．．．．．．．．．．． 3 4. Electric Specifications．．．．．．．．．．．．．．．．．．．．． 3-4 5. Dimensions．．．．．．．．．．．．．．．．．．．．．．．．．．． 5 6. Inside Structure．．．．．．．．．．．．．．．．．．．．．．．．． 6 7. Mechanical Performance．．．．．．．．．．．．．．．．．．．．． 6 8. Environment Performance．．．．．．．．．．．．．．．．．．．． 7 9. Supplement．．．．．．．．．．．．．．．．．．．．．．．．．．． 8-9 10. Taping and Packing．．．．．．．．．．．．．．．．．．．．．．． 10-12 11. Flow Chart．．．．．．．．．．．．．．．．．．．．．．．．．．． 13 12.Environmental Workload Chemical Substance Components List．． 14 Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 2 1. Type Name： HSO321S 2. Output Frequency： 27.000000MHz 3. Absolute Maximum Ratings： Item Symbol Vdd terminal voltage Vdd Input terminal voltage Vcont Output terminal voltage Vout Output terminal current Iout Storage temp. range Tstr 4. Value -0.5 ~ 4.0 -0.5 ~ Vdd+0.5 -0.5 ~ Vdd+0.5 15 -55 ~ 125 Unit V V V mA deg.C Electric Specifications： Item Symbol Min -30 -30 1.71 Value Typ 25 1.8 Max +30 +85 1.89 Unit Etc Condition Vdd Temp Frequency Stability Δf/F ppm 1.8+/Operating temp. range Topr ℃ 0.09V Supply voltage Vdd V Current consumption 1 Idd1 10 mA (#1 pin: open or "H") Current consumption 2 Idd2 0.01 mA (#1 pin: "L" level) Fig1,2 1.8V Symmetry Duty 40 50 60 % Low level output voltage Vol 0.1xVdd V High level output voltage Voh 0.9xVdd V Rise & Fall time Tr & Tf 7 ns Pin #1 options YES Output load C-MOS CL = 15pF (Idd1, Idd2 test at No Load) Low level input current Iil 10 uA High Level input current Iih 10 uA Low level input voltage Vil Vddx0.3 V High level input voltage Vih Vddx0.7 V Fig3 1.8V Output disable time Tplz 150 nsec Output enable time Tpzl 10 msec Start up time 10 ms Aging -3 3 ppm/year F : Output Frequency Δf =Oscillation Frequency – F Frequency Stability is inclusive of 25℃ Tolerance, operating temperature range, input voltage change, Load change, first of aging, shock and vibration. Moisture Sensitivity Level: Level 1 Tittle -30~85 ℃ 25+/-3 ℃ 25+/-3 ℃ Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 3 Fig. 1) Measurement Circuit ： CL = Include jig & probe capacitance (Refer to 4) Switch H Open L Out term. Oscillation out Oscillation out High Z Fig. 2) Output Wave Form： Fig. 3) Input Output Condition： Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 4 5. Dimensions： 3.2±0.2 Frequency 3 4 Pin Connections 1 OE(Output Enable) 2 GND 3 Output 4 Vdd 2.5±0.2 24.0 H YM 2 1 4 3 1 2 1.75 1.0 Max. 1.2 0.95 1.2 0.9 2 0.7 1 0.9 2.2 3 4 Lot No.： Year: Last digit of the year Year Code 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 0 1 2 3 4 5 6 7 8 9 Month: Alphabet assign below Month 1 2 3 4 5 6 7 8 9 10 11 12 Code A B C D E F G H J K L M Marking: Laser marking Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 5 Inside Structure： 6. 7 5 6 6 5 3 2 4,7 2 4 Reference drawing (1) Base: Alumina Ceramic (Al2O3) Metalized Pad: W Ni Plating Au Plating (2) IC IC (Si. Al.) (3) Au Bonding Wire: Au (4) Crystal Blank Rectangular At-Cut Quartz Crystal Blank (5) LID: Fe+Ni+Co (6) Adhesive Silver Conductive Silicon Resin (7) Electrode 1 3 1 The use prohibition chemistry substance of Table 1 of DHE-0204-1 (HE-QA-24) is not included in this item. 7. Mechanical Performance： 1 Specifications Code Item Test Methods Natural Drop Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board. A Refer to: JIS C 60068-2-6 2 Vibration Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. A Refer to: MIL-HDBK-781A 6.5.2/ JIS C 60068-2-6 3 Sealing Tightness (1) Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak detector. – Fine Leakage. --- (2) Dipping in the FC-40 at +125 +/-5deg.C for 5 minutes, no gas bubble observed from the inside of the can. 4 Solder ability After applying ROSIN Flux, dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. B Refer to: JIS C 60068-2-20 Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 6 8. Environment Performance： Item 1 Specifications Code Test Methods Humidity Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours. Back to room temperature first, then in 1~2 hours, the component shall A be checked. Refer to: JIS C 60068-2-3 2 Storage in Low -40deg.C +/-2deg.C, Duration of 240 hours. Temperature Back to the room temperature first, then in 1~2 hours, the component A shall be checked. Refer to: JIS C 60068-2-1 3 Storage in High +85deg.C +/-2deg.C, Duration of 240 hours. Temperature Back to the room temperature first, then in 1~2 hours, the component A shall be checked. Refer to: JIS C 60068-2-2 4 -30deg.C +/-2deg.C (30min)  +80deg.C +/-2deg.C (30min) 25 Temperature cycles cycles. Temp. increasing or reducing time need to be within 3 minutes. Back to the room temperature first, then in 1~2 hours, the component A shall be checked. Refer to: JIS C 0025 5 High Temperature +85deg.C +/-2deg.C, +1.8 Vdd Duration of 240 hours. Operation Back to the room temperature first, then in 1~2 hours, the component A shall be checked. Refer to: JIS C 60068-2-2 Specifications code Specifications A Frequency variation shall be within +/-5ppm and equivalent resistance shall be within the specification after the test More than 90% of lead shall be covered by new solder. B Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 7 9. Supplement： 9.1. Please stay with our proposed reflow condition and do then soldering 2 times max. ` Available for Lead Free Soldering Temperature 260 deg.C 220 deg.C (3) 160~180deg.C (2) (1) Time (1) Preheat 160~180 deg.C 120sec. (2) Primary heat 220 deg.C 60sec. (3) Peak 260 deg.C 10sec. Max. 9.2.Land Pattern Layout： (Example) 9.3.Solder Iron： (Example) Bit temp.:350deg.C Max. , Time: 3sec Max. , Each terminal solder a 1 time Max. Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 8 9.4.Mounting： This component is designed for automatic insertion. However, you are requested to do the trial with your insertion machine in order to be Sure of proper operation and no damage of component. Please pay attention to board warp which may damage the component and cause Soldering Process. Avoid mounting and processing by Ultrasonic welding because this method has a Possibility of an excessive vibration spreading inside the crystal products and Becoming the cause of characteristic deterioration and not oscillating. 9.5.Cleaning： Cleaning liquid which corrodes Nickel shall not be used. It may cause the problem on the surface, color, marking etc. Ultra-sonic cleaning is possible, however, you are requested to check on your board. Because we only checked as single unit. 9.6.Handling： HSO321S series is designed to withstand Drop and Vibration, however, the crystal blank might be broken. So, if excess force is given, please check the characteristics before use. HSO321S series has C-MOS circuit inside. Please pay attention to static-electricity as same handling as other C-MOS. devices. 9.7.By-pass Capacitor： It has no by-pass capacitor integrated. We recommend you to use capacitor (like ceramic chip capacitor) 0.01μF in-between Vdd and GND. 9.8.Storage： Please keep away from high temperature and high humidity, which may cause put solderbility. No direct Sunlight, No dew as well. Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 9 10. Taping and Packing： 10.1.Emboss Tape Specifications： 10.2.Reel Specifications： Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 10 (Table-2) (UNIT: mm) MARK DIMENSIONS‧ANGLE Diameter A ψ180+0/-3 Inner Width W1 9.3+/-0.3 Outer Width W2 11.3+/-1.0 Out Line diameter B ψ60.5+/-0.5 F1 3.0+0.5/-0 F2 4.0+0.5/-0 F3 5.0+0.5/-0 Q 120deg C ψ13.2+/-0.5 E 3.0+/-0.2 ITEM FLANCE HUB Width Center Core slit Position Spindle diameter Key Ditch Width 10.3.Storage： Temperature+40deg.C Max. Humidity 80% Max. 10.4.Quantity on Reel： 3,000 PCS/REEL 10.5.Label： Label is following information： Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 11 10.6. PACKAGE： TYPE: SPEC. No.: Parts No.: Lot No.: Label Up side(Produce) Q.C PASS H10 FREQ.: Q'TY: MHz PCS ROHS HARMONY ELECTRONICS CORP. Under side(Fixing Hole) One reel quantity: [1000pcs]&[3000pcs] 1 Top and bottom with 2.3cm thickness foam-rubber cushion for protection 2 Carton's Q'TY:1~15 pcs. 3 Carton Type=A,B , C use 4 trigon pillar to fasten the Reel. 4 Need to add 3 pages dry agent in each outer box. use 4 trigon pilla OR Green Product ROHS Compliant A Carton Type B Reel Gree n Pr RO HS od uct Co m plian D C 630/531/ 321/221 Produce Type 840/751 421 211/111 OTHER 15 15 15 1~7 200 200 200 195 200 200 200 195 230/260 230 230 150 t 1.Every Carton with 3 desiccant. 2.Top and bottom with 2.3cm thickness foam -rubber cushion for protection Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 12 11. Flow Chart： LID(外 殼 蓋 ) BLANK(晶 片 ) LID進 料 檢 查 1 2 Incoming Inspection of LID LID洗 淨 BLANK進 料 檢 查 7 8 Cleaning of LID BASE(基 座 ) 9 10 11 12 13 4 Incoming Inspection of BLANK IC BASE進 料 檢 查 IC進 料 檢 查 3 Incoming Inspection of BASE Incoming Inspection of IC 化學蝕刻 Etching 頻率選別 5 Freq. Sorting IC 搭 載 IC Ass'y 晶片排盤 Blank Array 6 打 金 線 ($) Wire Bonding 洗 淨 +微 蝕 刻 Washing+Flash Etching 基礎蒸著 Base Plating 押入接著 Blank Ass'y 14 15 16 17 18 接著硬化 Adhesive Curing 接著檢查 Bonding Check 調 整 蒸 著 /ION Partial Partial Adjustment /Ion Partial 中 間 檢 查 ($) Middle Check 25 高真空烘烤 26 Annealing in High Vacuum 氣 密 檢 查 II(HE) Leak Check II DLD檢 查 Check of DLD 最 終 檢 查 ($) 27 19 溫 度 特 性 檢 查 (C) 20 REFLOW 1 21 老 化 Aging 22 23 Check of Temp. Characteristics (for Specific Freq. ONLY) 外觀檢查 28 Appearance Check 印 字 +外 觀 檢 查 Marking & Check 29 Taping 30 出貨檢查 氣 密 檢 查 I (AIR) Leak Check I Outgoing Inspection 氣 密 檢 查 II (氦 氣 加 壓 ) 24 Final Check 熔 接 Seam Seal Leak Check II (Helium Pressurization) 31 出貨捆包 Packing to Shipment/stock 出 貨 Shipment ($)： 特 殊 特 性 (For Special Characteristics) (C)： 指 定 製 程 (Arranged for customer requirement) Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 13 12. Environmental Workload Chemical Substance Components List Environmental Workload Chemical Substance Components List TYPE D(H)SO321S PERCENTAGE 25.2(mg) ppm WOLFRAM AND ITS COMPOUND(W) 0.21168 53.3434 COBALT AND ITS COMPOUND(Co) 0.96900 244.1880 CHROMIUM AND ITS COMPOUND(Cr) 0.07308 18.4162 SILVER(Ag) 0.15876 40.0075 COPPER(Cu) 0.07812 19.6862 NICKEL AND ITS COMPOUND(Ni) 2.26044 569.6309 MANGANESE AND ITS COMPOUND(Mn) 0.02016 5.0803 MOLYBDENUM AND ITS COMPOUND(Mo) 0.12348 31.1170 SILICON AND ITS COMPOUND(Si) 0.28476 71.7595 ALUMINIUM AND ITS COMPOUND(Al) 7.96320 2006.7264 GOLD(Au) 0.15372 38.7374 IRON(Fe) 3.37176 849.6835 Chemical Substance Components Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 14 REV. DATE REASON No. 0 2016/06/01 NEW CONTENTS - Tittle Country of origin HSO321S SPECIFICATION Date 2016/06/01 Confirm Check Prepare F. S. TSAI C. H. WENG U. F. CHEN HARMONY TAIWAN Spec. No. SSW027000FECHC-T ELECTRONICS CORP. FACTORY Rev. Page 0 15