MCM2012B221FBE

INPAQ Global RF/Component Solutions MCM 2012 B Series Specification Product Name Series Size Chip Common Mode Filter MCM B Series EIAJ 2012 INPAQ Global RF/Component Solutions MCM2012B SERIES (Chip Common Mode Filter) Engineering Specification Features and Application ．Powerful components with composite co-fired material to solve EMI problem for high speed differential signal transmission line as USB, and LVDS, without distortion to high speed signal transmission. 1.PRODUCT DETAIL Imp. Com. Rated DCR (Ω)±25% Current Max. (Ω) @100MHz Max.(mA) Part No. Rated Voltage (V) Withstand Insulation Voltage Resistance (V) Min.(MΩ) MCM2012B670GBE 67 0.40 400 10 25 200 MCM2012B900GBE 90 0.40 400 10 25 200 MCM2012B121GBE 120 0.40 400 10 25 200 MCM2012B161GBE 160 0.50 400 10 25 200 MCM2012B181GBE 180 0.50 400 10 25 200 MCM2012B221FBE 220 0.50 300 10 25 200 Test Instruments •Agilent E4991A RF IMPEDANCE / MATERIAL ANALYZER •HP4338 MILLIOHMMETER • Agilent E5071C ENA SERIES NETWORK ANALYZER •Keithley 2410 1100V SOURCE METER 2.PART NUMBER CODE MCM 1 1 2 3 4 5 6 2012 B 90 0 G B E 3 6 7 8 2 4 5 Series Name Size Code: the first two digitals : length(mm), the last two digitals : width(mm) Material Code Impedance(Ω) ± 25% (ex：900=90Ω ；121=120Ω) Fixed Decimal Point Rated Current Code A=50mA B=80mA C=100mA D=150mA E=200mA G=400mA H=500mA I =600mA J =700mA K=800mA F=300mA 7 Soldering: Green Parts: A— Soldering Lead-Free B— Lead-Free for whole chip 8 Packaging: E - Embossed plastic tape, 7" reel. MCM 2012 B Series Engineer Specification  Version: A23  Page 1 of 9  „ All Specifications are subject to change without notice.  www.inpaq.com.tw ; www.inpaqgp.com  INPAQ Global RF/Component Solutions 3.TYPICAL CHARACTERISTIC MCM2012B670 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 1000 Insertion loss (dB) Impedance (ohm) Differential Mode 100 Common Mode 10 -5 -10 -15 Differential Mode 1 Common Mode -20 1 10 100 1,000 1 10,000 10 100 1,000 10,000 Frequency (MHz) Frequency (MHz) MCM2012B900 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 Insertion loss (dB) Impedance (ohm) 1000 100 Common Mode 10 Differential Mode -5 -10 Differential Mode -15 Common Mode 1 1 10 100 1,000 Frequency (MHz) 10,000 -20 1 10 100 1,000 10,000 Frequency (MHz) MCM 2012 B Series Engineer Specification  Version: A23  Page 2 of 9  „ All Specifications are subject to change without notice.  www.inpaq.com.tw ; www.inpaqgp.com  INPAQ Global RF/Component Solutions MCM2012B121 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 Differential Mode Insertion loss (dB) Impedance (ohm) 1000 Common Mode 100 10 Differential Mode -5 -10 -15 Common Mode 1 -20 1 10 100 1,000 1 10,000 10 100 1,000 10,000 Frequency (MHz) Frequency (MHz) MCM2012B161 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 1000 0 Insertion loss (dB) Impedance (ohm) Differential Mode Common Mode 100 10 -5 -10 -15 Differential Mode Common Mode 1 -20 1 10 100 1,000 Frequency (MHz) 10,000 1 10 100 1,000 10,000 Frequency (MHz) MCM 2012 B Series Engineer Specification  Version: A23  Page 3 of 9  „ All Specifications are subject to change without notice.  www.inpaq.com.tw ; www.inpaqgp.com  INPAQ Global RF/Component Solutions MCM2012B181 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 1000 0 Insertion loss (dB) Impedance (ohm) Differential Mode Common Mode 100 -5 -10 10 Differential Mode -15 Common Mode 1 -20 1 10 100 1,000 1 10,000 10 100 1,000 10,000 Frequency (MHz) Frequency (MHz) MCM2012B221 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 0 1000 Insertion loss (dB) Impedance (ohm) Differential Mode Common Mode 100 10 Differential Mode -5 -10 -15 Common Mode 1 -20 1 10 100 1,000 Frequency (MHz) 10,000 1 10 100 1,000 10,000 Frequency (MHz) MCM 2012 B Series Engineer Specification  Version: A23  Page 4 of 9  „ All Specifications are subject to change without notice.  www.inpaq.com.tw ; www.inpaqgp.com  INPAQ Global RF/Component Solutions 4.SHAPES AND DIMENSIONS TYPE 2012 L 2.00±0.20 W 1.25±0.20 T 1.00±0.10 P 1.60±0.20 C1 0.40±0.20 C2 0.30±0.20 Unit: mm 5.MEASURING CIRCUITS (A):Common mode (B):Differential mode MCM 2012 B Series Engineer Specification  Version: A23  Page 5 of 9  „ All Specifications are subject to change without notice.  www.inpaq.com.tw ; www.inpaqgp.com  INPAQ Global RF/Component Solutions 6.CIRCUIT CONFIGURATION & LAYOUT PAD 7.RECOMMENDED SOLDERING CONDITIONS MCM 2012 B Series Engineer Specification  Version: A23  Page 6 of 9  „ All Specifications are subject to change without notice.  www.inpaq.com.tw ; www.inpaqgp.com  INPAQ Global RF/Component Solutions 8.RELIABILITY AND TEST CONDITION Test item Temperature Cycle Operational Life Biased Humidity Test condition A. Temperature : -40 ~ +85℃ B. Cycle : 100 cycles C. Dwell time : 30minutes A. No mechanical damage B. Impedance value should be within ± 20 % of the initial Measurement : at ambient temperature value 24 hrs after test completion A. Temperature : 85℃ ± 5℃ B. Test time : 1000 hrs C. Apply current : full rated current A. No mechanical damage B. Impedance value should be within ± 20 % of the initial Measurement : at ambient temperature value 24 hrs after test completion A. Temperature : 40 ± 2℃ B. Humidity : 90 ~ 95 % RH C. Test time : 1000 hrs D. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion A. Solder temperature : 260 ± 5℃ Resistance to Solder B. Flux : Rosin Heat C. DIP time : 10 ± 1 sec Steam Aging Test Criteria A. Temperature : 93 ± 2℃ B. Test time : 4 hrs(MCA) Others : 8 hrs C. Solder temperature : 235 ± 5℃ D. Flux : Rosin E. DIP time : 5 ± 1 sec A. No mechanical damage B. Impedance value should be within ± 20 % of the initial value A. More than 95 % of terminal electrode should be covered with new solder B. No mechanical damage C .Impedance value should be within ± 20 % of the initial value More than 95 % of terminal electrode should be covered with new solder MCM 2012 B Series Engineer Specification  Version: A23  Page 7 of 9  „ All Specifications are subject to change without notice.  www.inpaq.com.tw ; www.inpaqgp.com  INPAQ Global RF/Component Solutions 9.TAPE AND REEL SPECIFICATIONS Type：Plastic Carrier Unit：mm Symbol Size Symbol Size W 8.00±0.10 D1 1.00±0.10 P 4.00±0.10 Po 4.00±0.10 E 1.75±0.10 Ao 1.40±0.10 F 3.50±0.05 Bo 2.30±0.10 P2 2.00±0.05 Ko 1.13±0.10 D +0.10 t 0.22±0.05 1.50 -0.00 MCM 2012 B Series Engineer Specification  Version: A23  Page 8 of 9  „ All Specifications are subject to change without notice.  www.inpaq.com.tw ; www.inpaqgp.com  INPAQ Global RF/Component Solutions 10.REEL DIMENSIONS Unit: mm 11.STANDARD QUANTITY FOR PACKAGING Packaging style：Taping Reel packaging quantity：3000 pcs/reel Inner box：5 reel/inner box 12.GENERAL TECHNICAL DATA Operating temperature range : - 40℃ ~ +85℃ Storage Condition : Less than 40℃ and 70% RH Storage Time: 6 months Max. Soldering method: Reflow or Wave Soldering MCM 2012 B Series Engineer Specification  Version: A23  Page 9 of 9  „ All Specifications are subject to change without notice.  www.inpaq.com.tw ; www.inpaqgp.com