BCT4221
USB2.0 Hi-Speed Switches
BCT4221
USB2.0 Hi-Speed Switches
GENERAL DESCRIPTION
FEATURES
The BCT4221 is a high bandwidth, fast
double-pole double-throw (DPDT) analog switch.
Its wide bandwidth and low bit-to-bit skew allow it
to pass high-speed differential signals with good
signal integrity. Each switch is bidirectional and
offers little or no attenuation of the high-speed
signals
at
the
outputs.
Industry-leading
advantages include a propagation delay of less
than 250ps, resulting from its low channel
resistance and low I/O capacitance. Its high
channel-to-channel crosstalk rejection results in
minimal noise interference.
VCC Operating Range: 2.7V-5.5V
Analog Signal Range: 0 to VCC
-3dB Bandwidth: 720MHz
Off Isolation:-38dB @250MHz
Crosstalk Rejection:- 38dB @250MHz
ON-Resistance:6Ω Typical
Extended Temperature Range: –40°C to 85°C
Green QFN2.0X1.5-10L packages
ESD:HBM 8000V
The BCT4221 is available in Green
QFN2.0X1.5-10L packages. It operates over an
ambient temperature range of -40°C to +85°C.
APPLICATIONS
Cell Phones
Hi-Fi Audio Switching
USB 2.0 High Speed Data Switching
USB 3.x Type C Switching
ORDERING INFORMATION
Order Number
Package Type
Temperature Range
BCT4221EGB-TR
QFN2.0X1.5-10L
-40°C to +85°C
Marking
4221
YWTG
QTY/Reel
3000
NOTE 1: Y: year, W: weeks
REV1.4
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BCT4221
USB2.0 Hi-Speed Switches
PIN CONFIGURATION
VCC
1D+
1
1D-
10
9
S
2
8
D+
2D+
3
7
D-
2D-
4
6
/OE
5
GND
TOP VIEW
PIN DESCRIPTION
PIN
NAME
FUNCTION
1
1D+
USB port 1 DATA+
2
1D-
USB Port 1 DATA-
3
2D+
USB port 2 DATA+
4
2D-
USB Port 2 DATA-
5
GND
Power Ground
6
/OE
Outputs enable input, active low.
7
D-
USB data bus DATA-
8
D+
USB data bus DATA+
9
S
10
VCC
Logic Control, 0 select port 1
Power Supply
REV1.4
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BCT4221
USB2.0 Hi-Speed Switches
Truth Table
S1
/OE
PORT 1
PORT 2
0
0
ON
OFF
1
0
OFF
ON
X
1
OFF
OFF
TYPICAL APPLICATION CIRCUIT
VCC
0.1uF
USB 2.0
Controller
1D+
VCC
S
S
1DD+
USB 2.0
Connector
BCT4221
DUSB 2.0
Controller
2D+
2D-
GND
/OE
/OE
REV1.4
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BCT4221
USB2.0 Hi-Speed Switches
ABSOLUTE MAXIMUM RATINGS
VCC to GND................................................................................................................ -0.5V to +6.0V
All Other Pins to GND...........................................................................................-0.5V to (VCC + 0.3V)
Continuous Current (D+/-, 1 D+/-, 2D+/-)................................................................................ ±120mA
Continuous Power Dissipation......................................................................................................0.4W
Operating Temperature Range ....................................................................................-40°C to +85°C
Storage Temperature Range......................................................................................-65°C to +150°C
Junction Temperature...............................................................................................................+150°C
Lead Temperature (soldering, 10s)..........................................................................................+260°C
ESD Protection
Human Body Model…………………..........................................................................................8000V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other
conditions beyond those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION
This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. Broadchip
recommends that all integrated circuits be handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its
published specifications.
Broadchip reserves the right to make any change in circuit design, specification or other related things if
necessary without notice at any time. Please contact Broadchip sales office to get the latest datasheet.
REV1.4
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BCT4221
USB2.0 Hi-Speed Switches
ELECTRICAL CHARACTERISTICS
(VCC = 2.7V to 5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 3.3V,
TA = +25°C.) (Note 2)
PARAMETER
SYM
CONDITIONS
MIN
TYP
MAX UNITS
POWER SUPPLY
Supply Voltage Range
VCC
Supply Current
ICC
2.7
VCC=3.6V, S =0 or VCC ,
D+/-,nD+/- = floating
Analog Signal Range
On-Resistance
On-Resistance Match
On-Resistance Flatness
0.02
0
5.5
V
1
uA
VCC
V
12
Ω
RON
ISW = 30mA, VD+, VD- = 0V
(Note 3)
6
△RON
ISW = 30mA, VD+, VD- =0V
(Note 3,4)
0.2
Ω
1
Ω
RFLAT
ISW = 30mA, VD+, VD- = 0 to
VCC (Note 5)
D+,D-,1D+,1D-,2D+,2DPower off Leakage Current
IOFF
VCC=0V ,VSW = 0 to 3.6V
1
uA
D+,D-,1D+,1D-,2D+,2DOff Leakage Current
IOZ
Switch off, VSW= 0 to VCC
1
uA
Input-Logic High
VIH
VCC =2.7 – 5.5V
1.5
VCC
V
Input-Logic Low
VIL
VCC =2.7 – 5.5V
0
0.4
V
Input Leakage Current
IIN
VIN = 0 to VCC
-1
1
uA
REV1.4
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BCT4221
USB2.0 Hi-Speed Switches
ELECTRICAL CHARACTERISTICS
(VCC = 2.7V to 5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 3.3V,
TA = +25°C.) (Note 2)
PARAMETER
SYM
CONDITIONS
MIN
TYP
MAX UNITS
DYNAMIC CHARACTERISTICS
Turn-On Time
TON
VnD+ or VnD- = 1.5V, RL =
50Ω, CL = 35pF, (Figure 1)
20
50
nS
Turn-Off Time
TOFF
VnD+ or VnD- = 1.5V, RL =
50Ω, CL = 35pF, (Figure 1)
15
50
nS
Break-Before-Make Time
TBBM
VnD+ and VnD- = 1.5V RL =
50Ω, CL = 35pF, (Figure 2)
On-Channel Bandwidth -3dB
BW
Off-Isolation
2
15
nS
RL = 50Ω, (Figure 3)
720
MHz
QIRR
RL = 50Ω, f = 250MHz
(Note 6)
-38
dB
Crosstalk
XTALK
RL = 50Ω, f = 250MHz
(Figure 4)
-38
dB
D+,D- Off-Capacitance
COFF
f = 1MHz, (Figure 5)
5
pF
D+,D- On-Capacitance
CON
f = 1MHz, (Figure 5)
7
pF
NOTES:
Note 2: Devices are 100% tested at TA = +25°C. Limits across the full temperature range are guaranteed by design and correlation.
Note 3: RON and RON matching specifications are guaranteed by design,
Note 4: ΔRON = RON(MAX) - RON(MIN).
Note 5: Flatness is defined as the difference between the maximum and minimum value of on-resistance, as measured over the specified
analog signal ranges.
Note 6: Between any two switches.
REV1.4
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BCT4221
USB2.0 Hi-Speed Switches
Test Diagram
Figure 1. tON/OFF
Figure 2. tBBM (Time Break-Before-Make)
Figure 3. Bandwidth -3dB
REV1.4
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BCT4221
USB2.0 Hi-Speed Switches
Figure 4. Crosstalk
Figure 5. Channel ON/OFF Capacitance
REV1.4
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BCT4221
USB2.0 Hi-Speed Switches
PACKAGE OUTLINE DIMENSIONS
QFN2.0x1.5-10L
PKG
REF
A
A1
A3
D
E
b
b1
b2
L
L1
e
COMMON DIMENSIONS(mm)
UT:ULTRA THIN
MIN
NOM
0.50
0.55
0.00
-0.15 REF
1.95
2.00
1.45
1.50
0.15
0.20
0.20
0.25
0.25
0.30
0.30
0.35
0.35
0.40
0.50 BSC
MAX
0.60
0.05
2.05
1.55
0.25
0.30
0.35
0.40
0.45
REV1.4
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BCT4221
USB2.0 Hi-Speed Switches
TAPING DESCRIPTION
PCB Layout Pattern: QFN2.0x1.5-10L
0.3
0.6
0.6
0.25
0.5
1.8
1.3
RECOMMENDED PCB LAYOUT PATTERN (Unit: mm)
REV1.4
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