CY75-330UH

深圳市首韩科技有限公司 SHENZHEN SHOUHAN TECHNOLOGYCO.,LTD Tel: 0755-27597601 Fax: 0755-27597491 承 认 书 产品名称 Project： 贴片电感 CY75-330UH 韩 科 规格型号 Part No： 有 户 Customer： 技 客 限 公 司 SPECIFICATION FOR APPROVAL 首 贵公司承认印 Approal slgnatures 签 章/Signatures 深 圳 市 料 号/Part No. 日期 Date: 拟制/Drawn 李春风 审核/Check 钟华华 批准/Approved 罗孝金 深圳市首韩科技有限公司 1.Features ①. High performance (Isat) realize by metal dust core . ②. Low profile: Thickness max.2.0～5.0mm. ③. Low loss and low resistance. ④. Capable of corresponding high frequency 1MHz～5MHz. ⑤ Ultra low buzz noise, due to composite construction. ⑥. The products contain no lead and also support lead-free soldering. 司 2.Applications area C D E F 科 技 B 有 A 限 Externl Dimensions (unit : mm ) G 3. 公 Ideally used in NB/Desktop/server/Graphic card, LCD TV/Projector, etc as DC-DC Converter. UNIT: mm A:7.0 ± 0.3 B:7.8 ± 0.3 C:5.0 ± 0.5 D:3.0 E:2.0 F:3.0 G:7.5 75 331 K Code 代码 TOLERANCE 公差 INDUCTANCE VALUE 电感值 深 圳 市 CY 首 4. Product Code 韩 注：印2号（宽2.9*高1.6）宋体 DIMENSIONS 尺寸 SERIAL CODE 系列代码 • 电感值Inductance Value (1R0:1.0uH; 100: 10uH; 101:100uH) Tolerance 公差 J ±5% K ±10% L ±15% M ±20% P ±25% N ±30% 深圳市首韩科技有限公司 5. Electrical Characteristics CY75 type CY75-2R7M NOMINAL INDUCTANCE ( uH ) 1.0 2.7 CY75-3R3M 3.3 100/0.25 19.50m 4.00 CY75-3R9M 3.9 100/0.25 23.40m 4.00 CY75-4R7M 4.7 100/0.25 26.00m CY75-5R6M 5.6 100/0.25 27.30m CY75-6R8M 6.8 100/0.25 32.50m 2.80 CY75-8R2M 8.2 100/0.25 39.00m 2.52 CY75-100K 10 100/0.25 41.60m 2.31 CY75-120K 12 100/0.25 49.40m 2.00 CY75-150K 15 100/0.25 71.50m 1.81 CY75-180K 18 100/0.25 84.50m 1.59 CY75-220K 22 100/0.25 91.00m 1.50 CY75-270K 27 100/0.25 106.60m 1.28 CY75-330K 33 100/0.25 119.60m 1.20 CY75-390K 39 100/0.25 149.50m 1.08 CY75-470K 47 100/0.25 175.50m 1.05 CY75-560K 56 100/0.25 208.00m 930m 68 100/0.25 234.00m 830m 82 100/0.25 273.00m 780m 100 100/0.25 325.00m 730m 120 100/0.25 390.00m 650m CY75-151K 150 100/0.25 520.00m 580m CY75-181K 180 100/0.25 598.00m 510m CY75-221K 220 100/0.25 793.00m 480m CY75-271K 270 100/0.25 884.00m 400m CY75-331K 330 100/0.25 1.13 390m CY75-391K 390 100/0.25 1.30 350m CY75-471K 470 100/0.25 1.68 330m CY75-561K 560 100/0.25 1.90 300m CY75-681K 680 100/0.25 2.47 270m CY75-821K 820 100/0.25 2.86 250m CY75-820K CY75-101K 深 圳 CY75-121K 100/0.25 13.00m 5.20 100/0.25 16.90m 4.60 • Notes 1. All test data is referenced to 25 °C ambient 有 限 公 司 IDC (A)MAX 技 市 CY75-680K DCR (Ω)MAX 科 首 CY75-1R0N Test Freq. (kHz/v) 韩 PART No. 3.80 3.10 深圳市首韩科技有限公司 2. Operating temperature range - 55 °C to + 125 °C 3. Irms (A):DC current (A) that will cause an approximate ΔT of 40 °C(reference ambient temperature is 25 °C) 4. Isat(A):DC current (A) that will cause L0 to drop approximately 30 % 5. The part temperature (ambient + temp rise) should not exceed 125 °C under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6.Absolute maximum voltage 30VDC 司 6.Minimum Packaging and storage D 规 格 尺寸 C B Φ330±2.0 Φ178±2.0 B Φ90 ± 2.0 C 2.3 Standard Quantity (pcs/reel) CY43SX 2000 CY53SX 2000 Standard Quantity (pcs/reel) CY75SX 1000 CY77SX 600 1500 CY105SX 1000 1000 CY106SX 800 韩 CY54SX 1000/盘 深 圳 市 首 CY73SX 21.5 Type 科 Type 技 D • Tape Carrier Packaging: • Tearing Off Force 7" 限 A 13" 有 A 公 • 包装Packing The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions Room Temp. ( )℃ 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed mm/min 300 • Application Notice Storage Conditions To maintain the solderability of terminal electrodes: 1. Temperature and humidity conditions: Less than 30℃ and 70% RH. 2. Recommended products should be used within 6 months form the time of delivery. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils . 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized.