HL-508H203BC

HL-508H203BC Specification 规 格 书 Customer Name： 客户名称： Customer P/N： 客户品号： Factory P/N： 公司品号： HL-508H203BC Sending Date： 送样日期： Client approval Goozo approval Approval 客户审核 Audit Confirmation Approval 鸿利国泽审核 Audit Confirmation 核准 确认 制作 核准 确认 制作 □ Qualified □ Disqualified 接受 不接受 DATE: 日期： Address：Dangui Road NO. 1 Dantu Area Zhenjiang City Jiangsu Province 地址：江苏省镇江市丹徒区丹桂路 1 号 Tel/电话：0511-88786599 Fax/传真：0511-88786599 Web/网址：www.goozo.com.cn 注: 1.此规格书以中英文方式书写,若有冲突以中文版本为准文本. 2.此规格书的最终解释权归属江苏鸿利国泽光电科技有限公司 REV NO.:A/0 DATE:2018/06/20 PAGE:1/6 HL-508H203BC ATTENTION 注意 OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features φ5LAMP LED/5m 外形 Low Power Consumption/低功耗 Ideal For Traffic\Backlight Lighting And Indicator Description/描述 /交通信号、背光、指示用 This devices are made with InGaN /LED Package Dimensions 0.5 typ 2.54 typ 1.5 max 1 5.0 2 25.0min 5.8 7.7 1.0min 1.ANODE 2.CATHODE 1.0 Dimension Tolerance/尺寸 (Unit:mm) Tolerance Grade/公差等级 0.5~3 3~6 6~30 30~120 ±0.1 ±0.2 ±0.3 ±0.5 Chip/晶片 Lens Color/胶体颜色 Emitting Color/ Material/材质 InGaN REV NO.:A/0 发光颜色 Water Clear /无色透明 Blue/蓝色 DATE:2018/06/20 PAGE:2/6 HL-508H203BC ■Absolute Maximum Rating Symbol 符号 Value 数值 Unit 单位 IF 30 mA Peak Forward Current* 峰值正向电流 IFP 100 mA Reverse Voltage 反向电压 Vr 5 V Power Dissipation 功耗 PD 80 mW Electrostatic discharge 抗静电能力 ESD 4000 V Operation Temperature 操作温度 Topr -40∽+85 ℃ Storage Temperature 储存温度 Tstg -40∽+100 ℃ Lead Soldering Temperature*引脚焊接温度 Tsol Max. 260℃ for 5sec Max. Item 项目 Forward Current 正向电流 *IFP Conditions：Pulse Width≤10msec /IFP 正向峰值电流使用条件：脉冲宽度≤10 毫秒 *Tsol Conditions：1.6mm from the base of the epoxy bulb/Tsol 焊接条件：焊接位置离胶体底部 1.6 毫米 ■ Typical Optical/ Electrical Characteristics Item/项目 Luminous Intensity/光强 Ta=25℃ Symbol/ Condition/ Rank/ Min. Typ. Max. Unit 符号 条件 档次 最小值 典型值 最大值 单位 Z 6370 -- 8280 mcd Z1 8280 -- 10750 mcd Z2 10750 -- 14000 mcd VF 2.8 3.2 3.6 V 2θ 1/2 -- 15 -- deg λD 465 -- 475 nm Iv IF=20mA Forward Voltage/正向电压 Viewing Angle/角度 DominantWavelength/主波长 RecommendForwardCurrent/ 推荐使用正向电流 Reverse Current/反向电流 IF(rec) -- -- -- 20 mA IR Vr=5V -- -- 10 uA Notes/注释: Tolerance ：VF±0.1V，λd±2 nm，IV(φV) ±15%，2θ 1/2±15%，X/Y±0.005. 公差：正向电压±0.1V，主波长±2 nm，光强（光通量）±15%，角度±15%，X/Y±0.005. REV NO.:A/0 DATE:2018/06/20 PAGE:3/6 Forward Current Vs. Forward Voltage Relative Luminous Intensity Vs. Wavelength Ta=25℃ 100 75 50 25 0 420 Ta=25℃ 50 Forward Current (mA) Relative Luminous Intensity (%) HL-508H203BC 40 30 20 10 0 460 500 540 1.5 580 2.5 3.0 3.5 4.0 Forward Voltage (V) Wavelength (nm) Forward Current Vs Relative Luminosity Ta=25℃ Forward Current Vs Ambient Temperature 200 Relative Luminosity(%) 50 Forward Current(mA) 2.0 40 30 20 10 175 150 125 100 75 50 25 0 0 0 20 40 60 80 100 0 20 30 40 50 Forward Current (mA) Ambient Temperature Ta (°C) Relative Luminosity Vs Ambient Temperature If=20mA 20° 200 Relative Luminosity (%) 10 10° 0° 10° 20° 30° 30° 40° 40° 150 50° 50° 100 60° 60° 70° 70° 50 80° 80° 0 0 20 40 60 80 100 90° 90° 100% 50% 0% 50% 100% Ambient Temperature Ta (°C) Relative Luminous Intensity vs.Radiation Angle REV NO.:A/0 DATE:2018/06/20 PAGE:4/6 HL-508H203BC ■ Reliability Performance 可靠性 Test Items And Result 测试项目和判定 Test Classification Test Item 测试项目 Test Conditions 测试条件 测试类别 Life Test 寿命测试 Room Temperature DC Operating Life Test 测试持续时间 Sample Size 样品数量 AC/RE 接受/拒收 1000 hrs 22 pcs 0/1 100 cycles 22 pcs 0/1 100 cycles 22 pcs 0/1 60℃±5℃/90% RH IF=5mA 1000 hrs 22 pcs 0/1 Ta=100℃±5℃ 1000 hrs 22 pcs 0/1 Ta=-40℃±5℃ 1000 hrs 22 pcs 0/1 Temp=260℃max T=5sec max 1times 22 pcs 0/1 Load 2.5N(0.25kgf) 0° ~ 90° ~0° 3times 22 pcs 0/1 室温直流寿命测试 Thermal Shock Test 冷热冲击 Temperature Cycle Test 高低温循环实验 Environment Test High Temperature ＆ 环境模拟 High Humidity Test 实验 高温高湿实验 High TemperatureStorage 高温储存 Low TemperatureStorage 低温储存 Resistance to Mechanica Test Soldering Heat 机械测试 Lead Integrity 耐焊接实验 引脚折弯实验 REV NO.:A/0 Ta=25℃±5℃，IF=20mA Test Duration 100℃±5℃ 5min ↑↓ -40℃±5℃ 5min. 100℃±5℃ 30min ↑↓5min -40℃±5℃ 30min. DATE:2018/06/20 PAGE:5/6 HL-508H203BC ■ Dip Soldering/焊接 TEMPERATURE( °C) 300 Max:260℃,5sec. Suggest:2~3sec. 250 200 150 100 Fluxing 50 30 Preheat 10 20 30 40 50 60 70 80 90 100 110 120 TIME(sec.) 1. Please avoid any external stress applied to the lead-frames and epoxy while the LEDs are at high temperature,especially during soldering/在高温焊接过程中，不可有任何外力施加在 LED 的引脚、环氧上； 2. DIP soldering and hand soldering should not be done more than one time/浸焊、手工焊接次数不可超过 1 次； 3. After soldering, avoid the epoxy lens from mechanical shock or vibration until the LEDs are back to room temperature/焊接后，在 LED 温度恢复到室温的过程中，不可受到震动或其它外力的冲击； 4. Avoid rapid cooling during temperature ramp-down process/在 LED 降温过程中，避免急剧的冷却； 5. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs/LED 在焊接过程中，应尽可能的降低焊接温度，以减少高温对 LED 的损伤； ■ IRON Soldering/手动焊接 300℃ Within 3 sec.,One time only/300℃，3 秒，1 次； REV NO.:A/0 DATE:2018/06/20 PAGE:6/6