SP3051-04HTG

SP3051-04HTG LOW CAPACITANCE TVS DIODE ARRAY Features ● ● ● ● ● ● Ultra low leakage: nA level Operating voltage: 5V Low clamping voltage Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±30kV Contact discharge: ±30kV – IEC61000-4-4 (EFT) 40A (5/50ns) – IEC61000-4-5 (Lightning) 25A (8/20μs) RoHS Compliant Dimensions SOT-26 AEC -Q101 qualified. Pin Configuration Applications ● ● ● ● ● ● USB 2.0 power and data line Set-top box and digital TV Digital video interface (DVI) Notebook Computers SIM Ports 10/100/1000 Ethernet Mechanical Characteristics ● Package: SOT-26 ● Lead Finish: Lead Free ● UL Flammability Classification Rating 94V-0 ● Quantity Per Reel:3,000pcs ● Reel Size:7inch ● Device Marking: SRV05 Absolute Maximum Ratings(Tamb=25°C unless otherwise specified) Parameter Peak Pulse Power (8/20µs) ESD per IEC 61000−4−2 (Air) Symbol Ppp Value Unit 500 W ±30 VESD Kv ±30 ESD per IEC 61000−4−2 (Contact) Operating Temperature Range TJ -55 to +125 ℃ Storage Temperature Range TSTJ -55 to +150 ℃ Rev : 01.06.2018 1/8 www.leiditech.com SP3051-04HTG Electrical Characteristics(TA=25°C unless otherwise specified) Parameter Reverse Working Voltage Breakdown Voltage Symbol Min Typ VRWM VBR Max Unit 5 V 6 Test Condition V IT = 1mA, Pin 5 to Pin 2 Reverse Leakage Current IR 1 µA VRWM = 5V, Pin 5 to Pin 2 Forward Voltage VF 1.2 V IF = 15mA Clamping Voltage VC 12 V IPP = 1A (8 x 20µs pulse), any I/O pin to ground Clamping Voltage VC 20 V IPP = 25A (8 x 20µs pulse), any I/ O pin to ground Junction Capacitance CJ 1.5 pF VR = 0V, f = 1MHz, between I/O pins Junction Capacitance CJ 3.0 pF VR = 0V, f = 1MHz, any I/O pin to ground 5.0 Note 1: I/O pins are Pin 1, 3, 4 and 6 Rev : 01.06.2018 2/8 www.leiditech.com SP3051-04HTG Typical Performance Characteristics (TA=25°C unless otherwise Specified) Junction Capacitance_Cj (pF) 5 4 Line to GND 3 2 Line to Line 1 0 0 1 2 3 4 Reverse Voltage_VR (V) 5 Junction Capacitance vs. Reverse Voltage Peak Pulse Power vs. Pulse Time 120 % of Rated Power 100 80 60 40 20 0 0 25 50 75 100 125 Ambient Temperature_Ta(℃) 150 Power Derating Curve Clamping Voltage vs. Peak Pulse Current 100 % of Peak Pulse Current 90 80 70 60 50 40 30 20 10 0 0 20 40 Time_t(uS) 60 80 Note：Data is taken with a 10x attenuator ESD Clamping Voltage 8 X 20μs Pulse Waveform 8 kV Contact per IEC61000−4−2 Rev : 01.06.2018 3/8 www.leiditech.com SP3051-04HTG Typical Application The SP3051-04HTG is designed to protect four data lines from transient ov-evoltages r by clamping them to fixed reference. When the voltage on the protected line exceeds the reference voltage (plus diode VF) the steering diodes are for ward biased, conducting the transient current away from the sensitive circuitry. Data lines are connected at pins 1, 3, 4 and 6. The negative reference (REF1) is connected at pin 2. This pin should be connected directly to a ground plane on the board for best results. The path length is kept as short as possible to minimize parasitic inductance. The positive reference (REF2) is connected at pin 5. I/O 1 To Protected IC I/O 2 6 1 2 5 3 4 VCC I/O 3 I/O 4 To Protected IC SP3051-04HTG on Video Interface Application VCC 6 5 4 1 2 3 VCC 6 1 Rev : 01.06.2018 5 2 4 3 4/8 www.leiditech.com SP3051-04HTG SP3051-04HTG on USB Port Application Vbus D+ D- USB Port Vbus 6 5 4 1 2 3 GND USB Controller Vbus D+ D- USB Port GND SP3051-04HTG on SIM Port Application I/O Clock SIM Reset Vcc GND Rev : 01.06.2018 6 5 4 1 2 3 5/8 www.leiditech.com SP3051-04HTG SP3051-04HTG on Digital Visual Interface (DVI) Application PC Graphics Card Flat Panel Display 5 2 3 4 3 1 6 2 6 1 5 RX0RX0+ 4 TX0TX0+ 5 2 3 4 3 LCD 1 6 2 6 1 5 RX1RX1+ RX2RX2+ 4 TX1TX1+ TX2TX2+ VGA TCTC+ RCRC+ DM Transmitter TMDS Receiver SP3051-04HTG on Ethernet 10/100 (Differential mode) Application TX+ TX+ TX- TXRX+ RJ45 Connector Coupling Transformer RX+ RX- RX1 6 2 5 3 4 VCC GND Rev : 01.06.2018 6/8 www.leiditech.com SP3051-04HTG SP3051-04HTG on T1/E1 Interface Application R1 RTIP RRING VCC T1 R2 6 5 4 1 2 3 T1/E1 Tranceiver R3 TTIP TRING Rev : 01.06.2018 T2 R4 7/8 www.leiditech.com SP3051-04HTG SOT-26 Package Outline & Dimensions Inches Symbol Min. A θ Nom. Max. Min. Nom. Max. 0.035 - 0.057 0.90 - 1.45 A1 0.000 - 0.006 0.00 - 0.15 A2 0.035 0.045 0.051 0.90 1.15 1.30 b 0.010 - 0.020 0.25 - 0.50 - 0.009 0.08 - 0.22 c 0.003 D 0.110 0.114 0.122 2.80 2.90 3.10 E1 0.060 0.063 0.069 1.50 1.60 1.75 E 0.110 BSC 2.80 BSC e 0.037 BSC 0.95 BSC e1 0.075 BSC 1.90 BSC L 0.012 0.018 0.024 0.30 0.45 0.60 L1 θ Soldering Footprint Millimeters (0.024) 0° - (0.60) 10° 0° - 10° aaa 0.004 0.10 bbb 0.008 0.20 ccc 0.008 0.20 Symbol Inches Millimeters C (0.098) (2.50) G 0.055 1.40 P 0.037 0.95 X 0.024 0.60 Y 0.043 1.10 Z 0.141 3.60 Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : 01.06.2018 8/8 www.leiditech.com