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GT24C512B-2UDLI-TR

GT24C512B-2UDLI-TR

  • 厂商:

    GIANTEC(聚辰)

  • 封装:

    UDFN8L_2X3MM

  • 描述:

    GT24C512B-2UDLI-TR

  • 数据手册
  • 价格&库存
GT24C512B-2UDLI-TR 数据手册
GT24C512B Advanced GT24C512B 2-WIRE 512K Bits Serial EEPROM Copyright © 2014 Giantec Semiconductor Inc. (Giantec). All rights reserved. Giantec reserves the right to make changes to this specification and its products at any time without notice. Giantec products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for critical medical or surgical equipment, aerospace or military, or other applications planned to support or sustain life. It is the customer's obligation to optimize the design in their own products for the best performance and optimization on the functionality and etc. Giantec assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and prior placing orders for products. Giantec Semiconductor, Inc. A2 www.giantec-semi.com 1/21 GT24C512B Table of Contents 1. 2. 3. 4. Features ...................................................................................................................................................................... 3 General Description .............................................................................................................................................. 3 Functional Block Diagram ................................................................................................................................. 4 Pin Configuration.................................................................................................................................................... 5 4.1 8-Pin SOIC, TSSOP and MSOP ............................................................................................................. 5 4.2 8-Lead UDFN .......................................................................................................................................... 5 4.3 Pin Definition ........................................................................................................................................... 5 4.4 Pin Descriptions ...................................................................................................................................... 5 5. Device Operation.................................................................................................................................................... 6 5.1 2-WIRE Bus ............................................................................................................................................ 6 5.2 The Bus Protocol .................................................................................................................................... 6 5.3 Start Condition ........................................................................................................................................ 6 5.4 Stop Condition......................................................................................................................................... 6 5.5 Acknowledge ........................................................................................................................................... 6 5.6 Reset ....................................................................................................................................................... 6 5.7 Standby Mode ......................................................................................................................................... 6 5.8 Device Addressing .................................................................................................................................. 6 5.9 Write Operation ....................................................................................................................................... 7 5.10 Read Operation..................................................................................................................................... 8 5.11 ECC (Error Correction Code) and Write cycling ................................................................................... 8 5.12 Diagrams ............................................................................................................................................... 9 5.12 Timing Diagrams ................................................................................................................................. 12 6. Electrical Characteristics ............................................................................................................................... 13 6.1 Absolute Maximum Ratings .................................................................................................................. 13 6.2 Operating Range................................................................................................................................... 13 6.3 Capacitance .......................................................................................................................................... 13 6.4 Reliability ............................................................................................................................................... 13 6.5 DC Electrical Characteristic .................................................................................................................. 14 6.5 AC Electrical Characteristic .................................................................................................................. 15 7. Ordering Information.......................................................................................................................................... 16 8. Top Markings .......................................................................................................................................................... 17 8.1 SOIC Package ...................................................................................................................................... 17 8.2 TSSOP Package ................................................................................................................................... 17 8.3 UDFN Package ..................................................................................................................................... 17 9. Package Information .......................................................................................................................................... 18 9.1 SOIC ..................................................................................................................................................... 18 9.2 TSSOP .................................................................................................................................................. 19 9.3 UDFN .................................................................................................................................................... 20 10. Revision History ................................................................................................................................................. 21 Giantec Semiconductor, Inc. A2 www.giantec-semi.com 2/21 GT24C512B 1. Features  Two-Wire Serial Interface, I2CTM Compatible –     Page write mode – Bi-directional data transfer protocol Up to 128 bytes per page write Wide-voltage Operation  Self timed write cycle with auto clear: 5ms (max.) –  Filtered inputs for noise suppression  With ECC function  High-reliability VCC = 1.7V to 5.5V Speed: 1 MHz (1.7V) Standby current (max.): 1 A, 1.7V  Operating current (max.): 1.5 mA, 1.7V  Hardware Data Protection – Write Protect Pin – – Endurance: 4 million cycles Data retention: 100 years  Industrial temperature grades  Sequential & Random Read Features  Packages: SOIC, TSSOP and UDFN  Memory organization: 65,536 x 8 bits  Lead-free, RoHS, Halogen free, Green  Page Size: 128 bytes 2. General Description The GT24C512B are EEPROM devices that use the Identification Page (128 bytes) which can be written and industrial standard 2-wire interface for communications. The (later) permanently locked in Read-only mode. This GT24C512B contains a memory array of 512K-bits Identification Page offers flexibility in the application board (65,536x8), which is organized in 128-byte per page. production line, as the Identification Page can be used to The EEPROM can operate in a wide voltage range from store unique identification parameters and/or parameters 1.7V to 5.5V which fits most application. This product can specific to the production line. provide a low-power 2-wire EEPROM solution. The device Under no circumstance, the device will be hung up. In order is offered in Lead-free, RoHS, halogen free or Green. The to refrain the state machine entering into a wrong state available package types are 8-pin SOIC, TSSOP and during power-up sequence or a power toggle off-on UDFN. condition, a power on reset circuit is embedded. During The GT24C512B is compatible with the industrial standard power-up, the device does not respond to any instructions 2-wire bus protocol. If in case the bus is not responded, a until the supply voltage (VCC) has reached an acceptable new sent Op-code command will reset the bus and the stable level above the reset threshold voltage. Once VCC device will respond correctly. The simple bus consists of the passes the power on reset threshold, the device is reset Serial Clock wire (SCL) and the Serial Data wire (SDA). and enters into the Standby mode. This would also avoid Utilizing such bus protocol, a Master device, such as a any inadvertent Write operations during power-up stage. microcontroller, can usually control one or more Slave During power-down process, the device will enter into devices, alike this GT24C512B. The bit stream over the standby mode, once VCC drops below the power on reset SDA line includes a series of bytes, which identifies a threshold voltage. In addition, the device will be in standby particular Slave device, an instruction, an address within mode after receiving the Stop command, provided that no that Slave device, and a series of data, if appropriate. The internal write operation is in progress. Nevertheless, it is GT24C512B also has a Write Protect pin (WP) to allow illegal to send a command unless the VCC is within its blocking any write operations over specified memory area. operating level. The GT24C512B also offers an additional page, named the s Giantec Semiconductor, Inc. A1 www.giantec-semi.com 3/21 GT24C512B 3. Functional Block Diagram 8 SDA 5 SCL 6 WP 7 X DECODER VCC HIGH VOLTAGE GENERATOR TIMING & CONTROL CONTROL LOGIC SLAVE ADDRESS REGISTER & COMPARATOR A0 1 A1 2 A2 3 WORD ADDRESS COUNTER ACK Y DECODER CLOCK DI/O GND 4 DATA REGISTER nMOS Giantec Semiconductor, Inc. A2 EEPROM ARRAY www.giantec-semi.com 4/21 GT24C512B 4. Pin Configuration 4.1 8-Pin SOIC, TSSOP and MSOP 4.2 8-Lead UDFN Top View Top View A0 1 8 VCC A0 1 8 VCC A1 2 7 WP A1 2 7 WP A2 3 6 SCL A2 3 6 SCL GND 4 5 SDA GND 4 5 SDA 4.3 Pin Definition Pin No. Pin Name I/O Definition 1 A0 I Device Address Input 2 A1 I Device Address Input 3 A2 I Device Address Input 4 GND - Ground 5 SDA I/O 6 SCL I Serial Clock Input 7 WP I Write Protect Input 8 VCC - Power Supply Serial Address and Data input and Data out put 4.4 Pin Descriptions SCL single bus system. When A0, A1, and A2 are left floating, This input clock pin is used to synchronize the data transfer the inputs are defaulted to zero. to and from the device. WP SDA WP is the Write Protect pin. While the WP pin is connected The SDA is a bi-directional pin used to transfer addresses to the power supply of GT24C512B, the entire array and data into and out of the device. The SDA pin is an open becomes Write Protected (i.e. the device becomes Read drain output and can be wired with other open drain or open only). When WP is tied to Ground or left floating, the normal collector outputs. However, the SDA pin requires a pull-up write operations are allowed. resistor connected to the power supply. VCC A0, A1, A2 Supply voltage The A0, A1 and A2 are the device address inputs. GND Typically, the A0, A1, and A2 pins are for hardware Ground of supply voltage addressing and a total of 8 devices can be connected on a Giantec Semiconductor, Inc. A2 www.giantec-semi.com 5/21 GT24C512B 5. Device Operation The GT24C512B serial interface supports communications 2-wire bus transmission on is accidentally interrupted (e.g. a using industrial standard 2-wire bus protocol, such as I2C. power loss), or needs to be terminated mid-stream. The 5.1 2-WIRE Bus reset is initiated when the Master device creates a Start The two-wire bus is defined as Serial Data (SDA), and condition. To do this, it may be necessary for the Master Serial Clock (SCL). The protocol defines any device that device to monitor the SDA line while cycling the SCL up to sends data onto the SDA bus as a transmitter, and the nine times. (For each clock signal transition to High, the receiving devices as receivers. The bus is controlled by Master checks for a High level on SDA.) Master device that generates the SCL, controls the bus 5.7 Standby Mode access, and generates the Start and Stop conditions. The While in standby mode, the power consumption is minimal. GT24C512B is the Slave device. The GT24C512B enters into standby mode during one of 5.2 The Bus Protocol the following conditions: a) After Power-up, while no Data transfer may be initiated only when the bus is not busy. Op-code is sent; b) After the completion of an operation and During a data transfer, the SDA line must remain stable followed by the Stop signal, provided that the previous whenever the SCL line is high. Any changes in the SDA line operation is not Write related; or c) After the completion of while the SCL line is high will be interpreted as a Start or any internal write operations. Stop condition. 5.8 Device Addressing The state of the SDA line represents valid data after a Start The Master begins a transmission on by sending a Start condition. The SDA line must be stable for the duration of condition, then sends the address of the particular Slave the High period of the clock signal. The data on the SDA line devices to be communicated. The Slave device address is 8 may be changed during the Low period of the clock signal. bits format as shown in Figure. 5-5. There is one clock pulse per bit of data. Each data transfer The four most significant bits of the Slave address are fixed is initiated with a Start condition and terminated by a Stop (1010) for GT24C512B. condition. The next three bits, A0, A1 and A2, of the Slave address are 5.3 Start Condition specifically related to EEPROM. Up to eight GT24C512B The Start condition precedes all commands to the device units can be connected to the 2-wire bus. and is defined as a High to Low transition of SDA when SCL The last bit of the Slave address specifies whether a Read is High. The EEPROM monitors the SDA and SCL lines and or Write operation is to be performed. When this bit is set to will not respond until the Start condition is met. 1, Read operation is selected. While it is set to 0, Write 5.4 Stop Condition operation is selected. The Stop condition is defined as a Low to High transition of After the Master transmits the Start condition and Slave SDA when SCL is High. All operations must end with a Stop address byte appropriately, the associated 2-wire Slave condition. device, GT24C512B, will respond with ACK on the SDA line. 5.5 Acknowledge Then GT24C512B will pull down the SDA on the ninth clock After a successful data transfer, each receiving device is cycle, signaling that it received the eight bits of data. required to generate an ACK. The Acknowledging device The GT24C512B then prepares for a Read or Write pulls down the SDA line. operation by monitoring the bus. 5.6 Reset The GT24C512B contains a reset function in case the Giantec Semiconductor, Inc. A2 www.giantec-semi.com 6/21 GT24C512B 5.9 Write Operation can be initiated immediately. This involves issuing the Start 5.9.1 Byte Write condition followed by the Slave address for a Write In the Byte Write mode, the Master device sends the Start condition and the Slave address information (with the R/W set to Zero) to the Slave device. After the Slave generates an ACK, the Master sends the byte address that is to be written into the address pointer of the GT24C512B. After operation. If the EEPROM is still busy with the Write operation, no ACK will be returned. If the GT24C512B has completed the Write operation, an ACK will be returned and the host can then proceed with the next Read or Write operation. receiving another ACK from the Slave, the Master device transmits the data byte to be written into the address memory location. The GT24C512B acknowledges once more and the Master generates the Stop condition, at which time the device begins its internal programming cycle. While this internal cycle is in progress, the device will not respond to any request from the Master device. 5.9.2 Page Write The GT24C512B is capable of 128-byte Page-Write operation. A Page-Write is initiated in the same manner as a Byte Write, but instead of terminating the internal Write cycle after the first data word is transferred, the Master device can transmit up to 127 more bytes. After the receipt of each data word, the EEPROM responds immediately with an ACK on SDA line, and the seven lower order data word address bits are internally incremented by one, while the higher order bits of the data word address remain constant. If a byte address is incremented from the last byte of a page, it returns to the first byte of that page. If the Master device should transmit more than 128 bytes prior to issuing the Stop condition, the address counter will “roll over,” and the previously written data will be overwritten. Once all 128 bytes are received and the Stop condition has been sent by the Master, the internal programming cycle begins. At this point, all received data is written to the GT24C512B in a single Write cycle. All inputs are disabled until completion of the internal Write cycle. 5.9.3 Acknowledge (ACK) Polling The disabling of the inputs can be used to take advantage of the typical Write cycle time. Once the Stop condition is issued to indicate the end of the host's Write operation, the GT24C512B initiates the internal Write cycle. ACK polling Giantec Semiconductor, Inc. A2 www.giantec-semi.com 7/21 GT24C512B 5.10 Read Operation device terminates the sequential Read operation by pulling Read operations are initiated in the same manner as Write SDA High (no ACK) indicating the last data word to be read, operations, except that the (R/W) bit of the Slave address is followed by a Stop condition. The data output is sequential, set to “1”. There are three Read operation options: current with the data from address n followed by the data from address read, random address read and sequential read. address n+1,n+2 ... etc. The address counter increments by 5.10.1 Current Address Read one automatically, allowing the entire memory contents to The GT24C512B contains an internal address counter which maintains the address of the last byte accessed, incremented by one. When the EEPROM receives the Slave Addressing Byte with a Read operation (R/W bit set to “1”), it will respond an ACK and transmit the 8-bit data byte stored at address location n+1. The Master should not acknowledge the transfer but should generate a Stop condition so the GT24C512B discontinues transmission. The address “roll over” during read is from the last byte of the last memory page, to the first byte of the first page. The address “roll over” during write is from the last byte of the current page to the first byte of the same page. (Refer to Figure 5-8. Current Address Read Diagram.) 5.10.2 Random Address Read Selective Read operations allow the Master device to select at random any memory location for a Read operation. The Master device first performs a 'dummy' Write operation by sending the Start condition, Slave address and byte address of the location it wishes to read. After the GT24C512B acknowledges the byte address, the Master device resends the Start condition and the Slave address, this time with the R/W bit set to one. The EEPROM then responds with its ACK and sends the data requested. The Master device does not send an ACK but will generate a Stop condition. (Refer to Figure 5-9. Random Address Read Diagram.) be serially read during sequential Read operation. When the memory address boundary of the array is reached, the address counter “rolls over” to address 0, and the device continues to output data. (Refer to Figure 5-10. Sequential Read Diagram). 5.11 ECC (Error Correction Code) and Write cycling The Error Correction Code (ECC) is an internal logic function which is transparent for the I2C communication protocol. The ECC logic is implemented on each group of four EEPROM bytes [1]. Inside a group, if a single bit out of the four bytes happens to be erroneous during a Read operation, the ECC detects this bit and replaces it with the correct value. The read reliability is therefore much improved. Even if the ECC function is performed on groups of four bytes, a single byte can be written independently. In this case, the ECC function also writes the three other bytes located in the same group [1]. As a consequence, the maximum cycling budget is defined at group level and the cycling can be distributed over the 4 bytes of the group: the sum of the cycles seen by byte0, byte1, byte2 and byte3 of the same group must remain below the maximum value defined in 6.4 Reliability. Note: 1. A group of four bytes is located at addresses [4*N, 4*N+1, 4*N+2, 4*N+3], where N is an integer. 5.10.3 Sequential Read Sequential Reads can be initiated as either a Current Address Read or Random Address Read. After the GT24C512B sends the initial byte sequence, the Master device now responds with an ACK indicating it requires additional data from the GT24C512B. The EEPROM continues to output data for each ACK received. The Master Giantec Semiconductor, Inc. A2 www.giantec-semi.com 8/21 GT24C512B 5.12 Diagrams Figure 5-1. Typical System Bus Configuration VCC SDA SCL Master Transmitter/Receiver GT24CXX Figure 5-2. output Acknowledge SCL from Master 1 8 9 Data Output from Transmitter TAA Data Output from Receiver TAA ACK SDA STOP CONDITION SCL START CONDITION Figure 5-3. Start and Stop Conditions s Giantec Semiconductor, Inc. A1 www.giantec-semi.com 9/21 GT24C512B Figure 5-4. Data Validity Protocol Data Change SCL Data Stable Data Stable SDA Figure 5-5. Slave Address Bit 7 6 5 4 3 2 1 0 1 0 1 0 A2 A1 A0 R/W Device Address W R I T E Figure 5-6. Byte Write S T A R T SDA Bus Activity Word Address A C K M S B Word Address A C K S T O P Data A C K A C K L M S S B B R/W Figure 5-7. Page Write S T A R T Device Address SDA Bus Activity M S B W R I T E Word Address(n) Word Address(n) A A A C C C K K K Data(n+1) A C K Data(n+127) A C K A C K L M S S B B R/W Giantec Semiconductor, Inc. A2 Data(n) S T O P www.giantec-semi.com 10/21 GT24C512B Figure 5-8. Current Address Read S T A R T R E A D Device Address S T O P Data A C K SDA Bus Activity M S B L S B N O A C K R/W Figure 5-9. Random Address Read S T A R T W R I T E Device Address SDA Bus Activity Word Address(n) A C K M S B S T A R T Word Address(n) A C K Device Address R E A D A C K S T O P Data n A C K N O L S B R/W A C K DUMMY WRITE Figure 5-10. Sequential Read Device Address SDA Bus Activity R E A D Data Byte n A C K Data Byte n+1 A C K S T O Data Byte n+x P Data Byte n+2 A C K A C K N O R/W Giantec Semiconductor, Inc. A2 A C K www.giantec-semi.com 11/21 GT24C512B 5.12 Timing Diagrams Figure 5-11. Bus Timing TR TF THIGH TLOW TSU:STO SCL TSU:STA THD:STA TSU:DAT THD:DAT TBUF SDAIN TAA TDH SDAOUT TSU:WP THD:WP WP Figure 5-12. Write Cycle Timing SCL SDA ACK Word n TWR STOP Condition Giantec Semiconductor, Inc. A2 START Condition www.giantec-semi.com 12/21 GT24C512B 6. Electrical Characteristics 6.1 Absolute Maximum Ratings Symbol Parameter Value Unit VS Supply Voltage -0.5 to VCC + 1 V VP Voltage on Any Pin –0.5 to VCC + 1 V TBIAS Temperature Under Bias –55 to +125 °C TSTG Storage Temperature –65 to +150 °C IOUT Output Current 5 mA Note: Stress greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condition outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 6.2 Operating Range Range Ambient Temperature (TA) VCC Industrial –40°C to +85°C 1.7V to 5.5V Note: Giantec offers Industrial grade for Commercial applications (0C to +70C). 6.3 Capacitance Symbol Parameter[1, 2] Conditions Max. Unit CIN Input Capacitance VIN = 0V 6 pF CI/O Input / Output Capacitance VI/O = 0V 8 pF Notes: [1] Tested initially and after any design or process changes that may affect these parameters and not 100% tested. Test conditions: TA = 25°C, f = 1 MHz, VCC = 5.0V. [2] 6.4 Reliability Ambient Temperature (TA) Ta=+25°C Symbol Parameter Min. Unit End Endurance 4 million Program / Erase Cycles DR Data Retention 100 Years [1] Note: The write cycle endurance is defined for group of four bytes located at addresses [4*N, 4*N+1, 4*N+2, 4*N+3] where N is an integer. The Write cycle endurance is defined by characterization and qualification. [2] A Write cycle is executed when either a Page Write, a Byte write, a Write Identification Page or a Identification Page instruction is decoded. When using the Byte Write, the Page Write or the Write Identification Page, refer also to 5.11 ECC (Error Correction Code) and Write cycling Giantec Semiconductor, Inc. A2 www.giantec-semi.com 13/21 GT24C512B 6.5 DC Electrical Characteristic Industrial: TA = –40°C to +85°C, VCC = 1.7V ~ 5.5V Symbol Parameter[1] VCC Test Conditions Min. Typ. Max. Unit 1.7 5.5 V VCC Supply Voltage VIH Input High Voltage 0.7*VCC VCC+1 V VIL Input Low Voltage -0.5 0.3* VCC V ILI Input Leakage Current 5V -- 2 μA ILO Output Leakage Current 5V -- 2 μA VIN = VCC max VOL1 Output Low Voltage 1.7V IOL = 0.15 mA — 0.2 V VOL2 Output Low Voltage 3V IOL = 2.1 mA — 0.4 V ISB1 Standby Current 1.7V VIN = VCC or GND — 0.2 1 μA ISB2 Standby Current 5.5V VIN = VCC or GND — 0.5 1 μA ICC1 Read Current 1.7V Read at 400KHz — 0.5 mA 5.5V Read at 1 MHz 1.0 mA ICC2 Write Current 1.7V Write at 1 MHz 1.0 mA 5.5V Write at 1 MHz 1.2 mA — Note: The parameters are characterized but not 100% tested. Giantec Semiconductor, Inc. A2 www.giantec-semi.com 14/21 GT24C512B 6.5 AC Electrical Characteristic Industrial: TA = –40°C to +85°C, Supply voltage = 1.7V to 5.5V Symbol Parameter [1] [2] 1.7VVCC
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