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ESD05V14T-MS

ESD05V14T-MS

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOT143

  • 描述:

    ESD05V14T-MS

  • 数据手册
  • 价格&库存
ESD05V14T-MS 数据手册
www.msksemi.com ESD05V14T-MS Semiconductor Feature Compiance Applications 350 W Peak Power per Line (tp = 8/20μs) Ethernet - 10/100 Base T SOT-143 package Fire wire ESD Protection > 15 kV Wireless communications Unidirectional configurations USB interface Protects 2 I/O Ports & Power Supply Low clamping voltage RoHS Compliant in Lead-Free Versions Transient protection for data lines to IEC 61000-4-2(ESD) ±15KV(air) ±8KV(contact); IEC 61000-4-4 (EFT) 40A (5/50ns) Mechanical Characteristics Lead finish:100% matte Sn(Tin) 1 4 2 3 Mounting position: Any Qualified max reflow temperature:260℃ Device meets MSL 1 requirements Pure tin plating: 7 ~ 17 um Pin flatness:≤3mil SOT-143 Electrical characteristics per line@( unless otherwisespecified) Parameter Symbol Conditions Min. Reverse Stand-off Voltage VRWM Reverse Breakdown Voltage VBR It = 1mA Reverse Leakage Current IR VRWM =5.0V, T=25℃ Clamping Voltage VC Clamping Voltage Typ. Max. Units 5 V 8.5 V 1 μA IPP = 1A, tP = 8/20μs 12.5 V VC IPP=5A, tP = 8/20μs 24.0 V Capacitance Between IO and GND CJ VR=0V, f = 1MHz 3.0 pF Capacitance Between IO and I/O CJ VR=0V, f = 1MHz 1.5 pF 6 Absolute maximum rating@25℃ Rating Symbol Value Units Peak Pulse Power (tp=8/20μs) Ppp 350 W Peak Pulse Power (tp=8/20μs) Ipp 9 A Operating Temperature TJ -55 to +150 ℃ Storage Temperature TSTG -55 to +150 ℃ www.msksemi.com ESD05V14T-MS Semiconductor Compiance Typical Characteristics@ Ta=25℃ unless otherwise specified Soldering Parameters www.msksemi.com ESD05V14T-MS Semiconductor Compiance PACKAGE MECHANICAL DATA Symbol θ Inches Min. Millimeters Nom. Max. Min. Nom. Max. A 0.031 A1 A2 - 0.048 0.80 0.000 - 0.008 0.013 0.020 0.035 0.042 0.75 - 1.22 - 0.15 0.90 1.07 b 0.011 - 0.020 0.30 - 0.51 b1 0.029 - 0.037 0.76 - 0.94 c 0.003 - 0.008 0.08 - 0.20 D 0.110 0.114 0.120 2.80 2.90 3.04 E 0.082 0.093 0.104 2.10 2.37 2.64 E1 0.047 0.051 0.055 1.20 1.30 1.40 e 0.075 1.92 BSC e1 0.008 0.20 BSC L 0.015 0.020 0.024 0.40 0.50 L1 (0.021) (0.54) N 4 4 θ 0° - 8° 0° - aaa 0.006 0.15 bbb 0.008 0.20 ccc 0.004 0.10 0.60 8° REEL SPECIFICATION P/N ESD05V14T-MS PKG SOT-143 QTY 3000 www.msksemi.com ESD05V14T-MS Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, products must not be exported without obtaining the export license from theauthorities concerned such in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
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