Confidential Degree : Confidential
Restricted
1 Security warning
The information contained in this document is the exclusive property of
GoerTek Inc. and should not be disclosed to any third party without the written
consent of GoerTek Inc.
2 Publication history
Version
Date
Description
Design
Approval
1.0
2017.04.01
New Design
Lein
Near
3 Symbols Show
Symbols
Show
C
Signify Customer's Special Characteristic.
G
Signify GoerTek Special Characteristic.
Version :1.0
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page 2/14
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Contents
1 Test Condition
4
2 Electrical Characteristics
4
3 Frequency Response Curve and Limits
4
4 Measurement Circuit
5
5 Test setup Drawing
5
6 Mechanical Characteristics
6
6.1 Appearance Drawing
6.2 Weight
6
6
7 Reliability Test
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7
Vibration Test
Drop Test
Temperature Test
Humidity Test
Temperature Cycle Test
Temperature Shock Test
ESD Shock Test
Reflow Test
8 Package
7
7
7
7
7
7
7
7
8
8.1 Taping Specification
8.2 Reel Dimension
8.3 The content of box(13'' reel)
8.4 Packing Explain
9 Stock and Transportation
8
9
9
10
10
10 Land Pattern Recommendation
11
10.1 Soldering Surface - Land Pattern
10.2 Metal Mask Pattern
11
11
11 Recommend Soldering
11.1 Soldering Machine Condition
11.2 The pattern of the nozzle
11.3 Reflow Profile
12 Cautions when using SMD MIC
12.1
12.2
12.3
12.4
X-ray inspection
Board wash restrictions
Nozzle restrictions
Others restrictions
13 Output Inspection standard
Version :1.0
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12
12
12
13
14
14
14
14
14
14
page 3/14
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4 Measurement Circuit
Term.1
FET
RL=2.2K
+
390 Ω
Vs + 2.0V
OUTPUT
C=10μF
10 nF
-
GND
Term.2
Circuit of the microphone
5 Test setup Drawing
Power Amplifier
Free-field 1/2"
Microphone
Audio Analyzer
50cm
Speaker
MIC
Input
Output
Power&Load
Remote Control
Turn Table
Anechoic Room
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7
Reliability Test
7.1
Vibration
Test
7.2
Drop
Test
To be no interference in operation after vibrations,10Hz to 55 Hz for 1 minute full amplitude
1.52mm,for 2 hours at three axises in state of standard packing,sensitivity to be within
±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 25% ~75%)
To be no interference in operation after dropped to steel plate each one time from 1.5
meter height ,12 times,sensitivity to be within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 25% ~75%)
a) After exposure at +85°C for 200 hours,sensitivity to be within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 25% ~75%)
7.3
Temperature
b) After exposure at -40°C for 200 hours,sensitivity to be within ±3dB from initial sensitivity.
Test
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 25% ~75%)
7.4
Humidity
Test
After exposure at +60°C and 90~95% relative humidity for 200 hours,sensitivity to be
within ±3dB from initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 25% ~75%)
After exposure at -40°C for 30 minutes, at 20°C for 10 minutes, at+85°c for 30 minutes,at
7.5
20°C for 10 minutes,5 cycles,sensitivity to be within ±3dB from initial sensitivity.
Temperature
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 25% ~75%)
Cycle Test
7.6
After exposure at -40 ℃ for 60 minutes, at+85 ℃ for 60 minutes(change time 20
Temperature seconds),32 cycles,sensitivity to be within ±3dB from initial sensitivity.
Shock Test (The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 25% ~75%)
7.7
The microphone under test must be discharged between each ESD exposure without
ESD Shock ground. (contact:±8kV,air:±15kV)
There is no interference in operation after 10 times exposure.
Test
7.8
Reflow
Test
Version :1.0
Adopt the reflow curve of item11.3,after two reflows,sensitivity to be within ±3dB from
initial sensitivity.
(The measurement to be done after 2 hours of conditioning at +15 ℃~+35℃, R.H 25% ~75%)
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8.2 Reel Dimension
7〃 reel for sample stage
13〃 reel will be provided for the mass production stage
The following is 13'' reel dimensions (unit:mm)
12.4±0.2
DETAIL A
inner side
06
08
05
03
07
A
Ø21±0.4
Ø330(max)
04
1.9±0.4
Ø100±0.5
Ø13±0.2
120°
8.3 The content of box(13'' reel)
Separation Pad
06
04
05
08 03
07
Packing (4000PCS)
Plastic Bag (20000PCS)
(336mm*115mm*450mm)
Version :1.0
5 pcs reels
Plastic Bag (20000PCS)
(336mm*115mm*450mm)
Inner Box (20000PCS)
(340mm*135mm*355mm
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11 Recommend Soldering
11.1 Soldering Machine Condition
Temperature control
8 zones
Heater Type
Hot Air
Solder Type
Lead-free
11.2 The pattern of the nozzle
dimension of nozzle:504
external diameter: 1.5mm;
inside diameter: 1.0mm;
Pick up position:bottom border of microphone
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11.3 Reflow Profile
Temp. °C
Tpeak
T3
T2
T1
t3
t2
t1
tsoak
Time. sec
Pb-free reflow profile requirements for soldering heat resistance
Parameter
Reference
Specification
Average Temperature Gradient in Preheating
---
2.5℃/s
Soak Time
tsoak
2-3 Minutes
Time Above 217 ℃
t1
Max 60s
Time Above 230 ℃
t2
Max 50s
Time Above 250 ℃
t3
Max 10s
Peak Temperature In Reflow
Tpeak
255℃ (-0/+5℃)
Temperature Gradient In Cooling
---
Max -5℃/s
When SMD MIC is soldered on PCB, the reflow profile is set according to solder paste
and the thickness of PCB etc.
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12 Cautions when using SMD MIC
12.1 X-ray inspection
The microphone should not be subjected to X-ray inspection. If it is absolutely
necessary to do inspection using X-ray, the setting conditions with the following
conditions:
Distance: >0.08meter;
Current:
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