GPU450HF120D2SE
PreliminaryData
1200V/450A 2 in one-package
Features:
1200V/450A,VCE(sat)(typ)=2.60V
SPT(Soft Punch Through)technology
Lower losses
Higher system efficiency
Excellent short-circuit capability
Square RBSOA
General Applications:
Daxin’s IGBTs offer ultrafast switching speed
for application such as welding, inductive
heating, UPS and other high frequency applications
Equivalent Circuit Schematic
Absolute Maximum Ratings of IGBT
VCES
Collector to Emitter Voltage
1200
V
VGES
Continuous Gate to Emitter Voltage
±30
V
IC
Continuous Collector Current
TC = 25°C
900
TC = 100°C
450
A
ICM
Pulse Collector Current
TJ = 150°C
900
A
PD
Maximum Power Dissipation (IGBT)
TC = 25°C,
TJ = 150°C
1360
W
tsc
Short Circuit Withstand Time
> 10
µs
TJ
Maximum IGBT Junction Temperature
150
°C
TJOP
Maximum Operating Junction Temperature Range
-40 to +150
°C
Tstg
Storage Temperature Range
-40 to +125
°C
1200
V
Absolute Maximum Ratings of Freewheeling Diode
VRRM
Repetitive Peak Reverse Voltage
IF
Diode Continuous Forward Current
IFM
Diode Maximum Forward Current
-1-
www.daxin-semi.com
Preliminary Data
TC = 25°C
900
TC = 100°C
450
A
900
Rev.1
A
2018
GPU450HF120D2SE
Electrical Characteristics of IGBT at TJ = 25°C (Unless Otherwise Specified)
Parameter
Test Conditions
Min
1200
BVCES
Collector to Emitter Breakdown
Voltage
VGE = 0V, IC = 1mA
ICES
Collector to Emitter
Leakage Current
VGE = 0V,VCE = VCES
IGES
Gate to Emitter Leakage Current
VGE = ±30V, VCE = 0V
VGE(th)
Gate Threshold Voltage
IC = 2mA, VCE = VGE
VCE(sat)
Collector to Emitter Saturation
Voltage (Module Level)
IC = 450A,
VGE = 15V
TJ = 25°C
Typ
Max
Unit
V
4.5
2.60
5
mA
400
nA
5.7
V
2.80
V
TJ = 125°C
3.00
Switching Characteristics of IGBT
td(on)
tr
TJ = 25°C
65
TJ = 125°C
70
TJ = 25°C
110
TJ = 125°C
120
TJ = 25°C
520
TJ = 125°C
580
TJ = 25°C
100
TJ = 125°C
130
TJ = 25°C
20.5
TJ = 125°C
31.0
TJ = 25°C
35.0
TJ = 125°C
52.0
TJ = 25°C
4560
nC
TJ = 25°C
2.5
Ω
TJ = 25°C
21.5
TJ = 25°C
3.30
TJ = 25°C
1.90
ns
Turn-on Delay Time
Turn-on Rise Time
td(off)
tf
Turn-off Delay Time
Turn-off Fall Time
Eon
ns
ns
VCC = 900V
IC = 450A
RG = 1.1Ω
VGE = ±15V
Inductive Load
ns
Turn-on Switching Loss
Eoff
mJ
mJ
Turn-off Switching Loss
Qg
Total Gate Charge
Rgint
Integrated gate resistor
Cies
Input Capacitance
f = 1M;
Vpp = 1V
VCE = 25V
VGE = 0V
f = 1MHz
Coes
Output Capacitance
Cres
Reverse Transfer
Capacitance
RθJC
Thermal Resistance, Junction-to-Case (IGBT)
-2-
www.daxin-semi.com
nF
0.092
Rev.1
2018
°C/W
GPU450HF120D2SE
Electrical and Switching Characteristics of Freewheeling Diode
VF
Diode Forward Voltage
IF = 450A ,
VGE = 0V
Diode Reverse Recovery
Time
trr
Diode Peak Reverse
Recovery Current
Irr
IF = 450A,
di/dt=8500A/µs,
Vrr = 600V,
Diode Reverse Recovery
Energy
Err
RθJC
1.90
TJ = 125°C
1.90
TJ = 25°C
230
TJ = 125°C
400
TJ = 25°C
450
2.20
V
ns
Diode Reverse Recovery
Charge
Qrr
TJ = 25°C
A
TJ = 125°C
760
TJ = 25°C
58.0
TJ = 125°C
85.0
TJ = 25°C
18.0
TJ = 125°C
29.5
nC
mJ
Thermal Resistance, Junction-to-Case (Diode)
0.095
°C/W
Module Characteristics
Parameter
Min.
Typ.
Max.
Unit
Viso
Isolation Voltage
(All Terminals Shorted),f = 50Hz, 1minute
RθCS
Case-To-Sink(Conductive Grease Applied)
M
Power Terminals Screw: M6
3.0
5.0
N·m
M
Mounting Screw: M6
4.0
6.0
N·m
G
Weight
-3-
2500
V
0.1
°C/W
315
www.daxin-semi.com
Rev.1
g
2018
GPU450HF120D2SE
Fig 1. output characteristic IGBT,
IC=f(VCE),VGE=15V
Fig 2. output characteristic IGBT,
IC=f(VCE),Tj=125℃
Fig 3. transfer characteristic IGBT,
IC=f(VGE),VCE=20V
Fig 4. switching losses IGBT, Eon=f(Ic),Eoff=f(Ic),
VGE=±15V,RGon=1.1Ω,RGoff=1.1Ω,VCE=600V
-4-
www.daxin-semi.com
Rev.1
2018
GPU450HF120D2SE
Fig 5. switching losses IGBT, Eon=f(RG),Eoff=f(RG),
VGE=±15V,IC=300A,VCE=600V
Fig 7. reverse bias safe operating area IGBT,
IC=f(VCE),VGE=±15V,RGoff=3.3Ω,Tvj=125℃
-5-
www.daxin-semi.com
Fig 6. transient thermal impedance IGBT , Zthjc=f(t)
Fig 8. forward characteristic of Diode ,
IF=f(VF)
Rev.1
2018
GPU450HF120D2SE
Internal Circuit:
Package Dimension
Dimensions in Millimeters
-6-
www.daxin-semi.com
Rev.1
2018
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