SFI0603-050E101NP-LF 数据手册
SFI Electronics Technology
SMD Transient Voltage Suppressors
Approval Sheet
Customer Information
Customer
Part Name
Part No.
Model No.
COMPANY
PURCHASE
R&D
Vendor Information
Name
SFI Electronics Technology Inc.
Part Name
Chip TVS
Part No.
SFI0603-050E101NP-LF
Lot No.
SFI Electronics Technology Inc.
ADDRESS : No.6, Lane 340, Shan-Ying Road, Guishan, Tao Yuan, Taiwan
TEL : 886-3-3506998
FAX : 886-3-3507689
Quality Control
E-mail : sfi@sfi.com.tw
Document Control
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SMD Transient Voltage Suppressors
PART NO. SFI0603-050E101NP-LF
1.1 Technology Data
Symbol
Value
Unit
Maximum allowable continuous AC voltage at 50-60Hz
VRMS
3.3
V
Maximum
continuous DC voltage
PART allowable
NO. SFI0402-050E050PP-LF
VDC
5
V
Varistor breakdown voltage
Vv
15~25
V
Typical
capacitance
value measured at 1MHz
PART
NO. SFI0603ML120C-LF
C
100
pF
Typical capacitance value tolerance
t
±30
%
Maximum allowable clamping voltage
VC
36
V
Leakage current at VDC (at initial state)
ILDC
<
1
μA
Leakage current at VDC (after ESD test)
ILDCA
<
2
μA
Response time
Trise
<
1
ns
Operation ambient temperature
TOPT
-50~+85
℃
Storage temperature range
TSTG
-50~+125
℃
IEC61000-4-2
Level 4
1.2 Reference Data
ESD testing
1.3 Other Data
Body
ZnO
End termination
Ag/Ni/Sn
Packaging
Reel
Complies with standard
IEC61000-4-2
Complies with RoHs standard
Yes
Lead content
<
Marking
1000
ppm
None
Notes :
*1 The varistor breakdown voltage was measured at 1mA.
*2 The clamping voltage was measured at 8/20μs standard current.
*3 The leakage current was measured at working voltage.
*4 The components shall be employed within 1 year, in the nitrogen condition.
Part No.
SFI0603-050E101NP-LF
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SMD Transient Voltage Suppressors
2. Size
Model
0603(1608)
Length(L)
1.60±0.15
Width(W)
0.80±0.10
Thickness(T)
0.90 max.
Termination(a)
0.30±0.10
3. ESD Wave Form
IEC61000-4-2 Standards
SEVERITY LEVEL
AIR DIRCHARGE
DIRECT
DISCHARGE
1
2KV
2KV
2
4KV
4KV
3
8KV
6KV
4
15KV
8KV
IEC61000-4-2 compliant ESD current pulse waveform
4. Environment Reliability Test
Characteristic
Test Method and Description
High Temperature
Storage
The specimen shall be subjected to 125±2℃ for 1000±2 hours without load and then
stored at room temperature and normal humidity for one or two hours. The change of
varistor voltage shall be within 10%.
Temperature Cycle
The temperature cycle of specified
temperature shall be repeated five times and
then stored at room temperature and normal
humidity for one or two hours. The change of
varistor voltage shall be within 10% and
mechanical damage shall be examined.
High Temperature
Load
Damp Heat Load/
Humidity Load
Low Temperature
Storage
Part No.
Temperature
Period
1
-40±3℃
30±3min
2
room temperature
1 hour
3
125±3℃
30±3min
4
room temperature
1 hour
After being continuously applied the maximum allowable voltage at 85±2℃ for
1000±2 hours, the specimen shall be stored at room temperature and normal
humidity for one or two hours. The change of varistor voltage shall be within 10%.
The specimen should be subjected to 40±2℃ and 90~95% RH, the maximum
allowable voltage applied for 1000±2 hours and then stored at room temperature and
normal humidity for one or two hours. The change of varistor voltage shall be within
10%.
The specimen should be subjected to -40±2℃ for 1000±2 hours without load and
then stored at room temperature and normal humidity for one or two hours. The
change of varistor voltage shall be within 10%.
SFI0603-050E101NP-LF
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5. Soldering Recommendations
5.1 Recommended solder pad layout
(Unit : mm)
0603
A
B
C
0.9~1.2
0.9~1.2
0.8~1.0
5.2 The SIR test of the solder paste shall be done (Based on JIS-Z-3284)
5.3 Steel plate and foot distance printing
Foot distance printing (mm)
Steel plate thickness (mm)
≧ 0.65mm
0.18mm
0.50~0.65mm
0.15mm
0.40~0.50mm
0.12mm
≦ 0.40mm
0.10mm
5.4 The IR reflow and temperature of soldering for Pb free process
Temperature ( ℃ )
Peak Temp 260℃(3~10sec)
250
225
Peak Temp 245 ℃
(10~20sec)
200
175
150
125
100
Pre-Heat 175 ℃
(60~120sec)
75
25
01:00:00
02:00:00
03:00:00
04:00:00
Time (min)
☆ IR reflow Pb free process suggestion profile
(1) The solder recommend is Sn96.5/Ag3.5 and thickness recommend as shown in table 5.3
(2) Ramp-up rate (217℃ to peak) +3℃/second max.
(3) Temp. maintain at 175±25℃ 180 seconds max.
(4) Temp. maintain above 217℃ 60~150 seconds
Part No.
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SMD Transient Voltage Suppressors
(5) Peak temperature range 245 +20/-10℃ within 5℃ of actually peak temperature (tp) 10~20
seconds
(6) Ramp down rate -6℃/second max.
※Perform adequate test in advance as the reflow temperature profile will vary according to the
conditions of the manufacturing process and the specification of the reflow furnace.
5.5 Resistance to soldering heat and high temperature resistance : 260℃, 10sec 3 times
5.6 Hand soldering
In hand soldering of the varistors, large temperature gradient between preheated the varistors and
the tip of soldering iron may cause electrical failures and mechanical damages such as cracking or
breaking of the devices. The soldering shall be carefully controlled and carried out, so that the
temperature gradient is kept minimum with following recommended conditions for hand soldering.
5.6.1 Recommended soldering condition 1 (with preheating)
(1) Solder
0.12~0.18mm thread solder (Sn96.5:Ag3.5) with soldering flux in the core
rosin-based and non-activated flux is recommended.
(2) Preheating
The varistors shall be preheated so that temperature gradient between the devices and
the tip of soldering iron is 150℃ or below.
(3) Soldering iron
Rated power of 20W max. with 3mm soldering tip in diameter
Temperature of soldering iron tip 380℃max., 3~5sec (The required amount of solder
shall be melted in advance on the soldering tip.)
(4) Cooling
After soldering, the varistors shall be cooled gradually at room ambient temperature.
5.6.2 Recommended soldering condition 2 (without preheating)
(1) Solder iron tip shall not directly touch to ceramic dielectrics.
(2) Solder iron tip shall be fully preheated before soldering while soldering iron tip to the
external electrode of varistors.
5.7 Post soldering cleaning
5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have
influences on the electrical characteristic and the reliability (such as humidity resistance) of
the varistors which have been mounted on the board. It shall be confirmed that the
characteristic and the reliability of the devices are not affected by the applied cleaning
conditions.
5.7.2 When an ultrasonic cleaning is applied to the mounted varistors on PC boards. Following
conditions are recommended for preventing failures or damages of the devices due to the
large vibration energy and the resonance conditions caused by the ultrasonic waves.
(1) Frequency 29MHz max.
(2) Radiated power 20W/liter max.
(3) Period 5 minutes max.
Part No.
SFI0603-050E101NP-LF
http://www.sfi.com.tw
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SMD Transient Voltage Suppressors
6. Packaging Specification
6.1 Carrier tape and transparent cover tape should be heat-sealed to carry the products, and the reel should be
used to reel the carrier tape.
6.2 The adhesion of the heat-sealed cover tape shall be 40 +20/-15 grams.
6.3 Both the head and the end portion of the taping shall be empty for reel package and SMT auto-pickup
machine. And a normal paper tape shall be connected in the head of taping for the operator to handle.
(Unit : mm)
Symbol
A0
±0.05
B0
±0.05
K0
±0.05
D
+0.10
-0.05
P
±0.10
P2
±0.10
P0
±0.10
W
±0.10
E
±0.10
F
±0.05
0603
1.05
1.90
0.95
1.56
4.00
2.00
4.00
8.00
1.75
3.50
Part No.
SFI0603-050E101NP-LF
http://www.sfi.com.tw
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SMD Transient Voltage Suppressors
7. Reel Dimension
(Unit : mm)
Symbol
A
B
C
D
E
W
W1
0603
178.0±1.0
60.0±0.5
13.0±0.2
21.0±0.2
2.0±0.5
9.0±0.5
1.5±0.1
8. Standard Packaging
Size
0603
Pcs
4000
Part No.
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