XTSD02GLGEAG

SD NAND XTSD01G/XTSD02G/XTSD04G/XTSD08G XTSD01G/XTSD02G/XTSD04G/XTSD08G SD NAND Datasheet 深圳市芯天下技术有限公司 XTX Technology Limited Tel: (86 755) 28229862 Fax: (86 755) 28229847 Web Site: http://www.xtxtech.com/ Technical Contact: fae@xtxtech.com * Information furnished is believed to be accurate and reliable. However, XTX Technology Limited assumes no responsibility for the consequences of use of such information or for any infringement of patents of other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of XTX Technology Limited. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. XTX Technology Limited products are not authorized for use as critical components in life support devices or systems without express written approval of XTX Technology Limited. The XTX logo is a registered trademark of XTX Technology Limited. All other names are the property of their respective own. Rev V3.1 May 15, 2019 Page 1 SD NAND XTSD01G/XTSD02G/XTSD04G/XTSD08G CONTENTS 1. Introduction ........................................................................................................................................................... 3 2. Product List ............................................................................................................................................................ 3 3. Features ................................................................................................................................................................. 3 4. Physical Characteristic Temperature ..................................................................................................................... 3 5. Pin Assignments..................................................................................................................................................... 4 6. Usage ..................................................................................................................................................................... 5 6.1. Product Protocol ......................................................................................................................................... 5 6.2. DC Characteristics ....................................................................................................................................... 5 7. Package Dimensions .............................................................................................................................................. 6 8. Ordering Information ............................................................................................................................................ 7 9. Revision History ..................................................................................................................................................... 9 Rev V3.1 May 15, 2019 Page 2 SD NAND XTSD01G/XTSD02G/XTSD04G/XTSD08G 1. Introduction XTX SD NAND is an embedded storage solution designed in a LGA8 package form. The operation of SD NAND is similar to an SD card which is an industry standard. SD NAND consists of NAND flash and a high performance controller. 3.3V supply voltage is required for the NAND area (VCC). SD NAND is fully compliant with SD2.0 interface, which allows most of general CPU to utilize. SD NAND has high performance at a competitive cost, high quality and low power consumption. 2. Product List Capacity 1Gb 2Gb 4Gb 8Gb Part number XTSD01GLGEAG XTSD01GDLGEGA XTSD01GCLGEGA XTSD01GBLGEGA XTSD02GLGEAG XTSD04GLGEAG XTSD04GCLGEGA XTSD08GLGEAG XTSD08GCLGEGA Package LGA8 (Land Grid Array) LGA8 (Land Grid Array) LGA8 (Land Grid Array) LGA8 (Land Grid Array) LGA8 (Land Grid Array) LGA8 (Land Grid Array) LGA8 (Land Grid Array) LGA8 (Land Grid Array) LGA8 (Land Grid Array) Size 8x6mm 8x6mm 8x6mm 8x6mm 8x6mm 8x6mm 8x6mm 8x6mm 8x6mm 3. Features  Support up to 50Mhz clock frequency  Support 1/4 bit mode  Built-in HW ECC Engine and highly reliable NAND management mechanism  Write speed up to class 8  Smaller package LGA8 (Land Grid Array) 4. Physical Characteristic Temperature  Operation Conditions Temperature Range: Ta = -30 to +85 degrees centigrade  Storage Conditions Temperature Range: Tstg = -40 to +85 degrees centigrade Rev V3.1 May 15, 2019 Page 3 SD NAND XTSD01G/XTSD02G/XTSD04G/XTSD08G 5. Pin Assignments 1 2 Rev V3.1 8 Top View 7 3 6 4 5 Pin No. Pin name (SD mode) Pin name (SPI mode) 1 2 3 4 5 6 7 8 SD2, I/O pin SD3, I/O pin CLK, clock signal Vss, ground CMD, command signal SD0, I/O pin SD1, I/O pin Vdd, power supply NC, no connection /CS, chip select CLK, clock signal Vss, groud DI, data in DO, data out NC, no connection Vdd, power supply May 15, 2019 Page 4 SD NAND XTSD01G/XTSD02G/XTSD04G/XTSD08G 6. Usage 6.1. Product Protocol As SD NAND is the realize SD2.0 standard product, thus please refer to the SD2.0 related protocol : SD Physical Layer Specification Version 2.00. 6.2. DC Characteristics Item Symbol MIN MAX Unit High Level Low Level VDD VIH VIL 2.7 VDD*0.625 VSS-0.3 3.6 VDD+0.3 VDD*0.25 V V V High Level VOH VDD*0.75 -- V Low Level VCL -- VDD*0.125 V -- 20* Supply voltage Input voltage Note IOH=-2mA, VDD=VDDmin IOL=2ma, VDD=VDDmin VDD=3.6V, clock 25MHz VDD=3.0V, clock STOP, Ta=25°C Output voltage Standby Current(*) Write Read Input voltage setup Time Operation Current(*) Icc1 mA I I Vrs -- 0.2 ---- 30 30 250 mA 3.6V/25MHz,50MHz ms Note: Standby current max 20mA with CLOCK 25Mhz only based on 100 pcs samples Peak Voltage and Leak Current Item Symbol Peak voltage on all lines Input Leakage Current for all pins Output Leakage Current for all outputs MIN MAX Unit -0.3 -10 -10 VDD+0.3 10 10 V uA uA Note Signal Capacitance Item Symbol MIN MAX Unit Pull up Resistance Total bus capacitance for each signal line Card Capacitance for signal pin Pull up Resistance inside card (pin1) Capacity Connected to Power line RCMD/RDAT 10 100 k CL - 40 pF CCARD - 10 pF RDAT3 10 90 k CC - 5 pF Note 1 card CHOST+CBUS≤30pF Note: WP pull-up (Rwp) Value is depend on the Host Interface drive circuit. Rev V3.1 May 15, 2019 Page 5 SD NAND XTSD01G/XTSD02G/XTSD04G/XTSD08G 7. Package Dimensions LGA8 (8*6mm) (Land Grid Array) Dimensions Symbol A b D E 0.85 0.55 7.95 5.95 Mm Norm 0.90 0.60 8.00 6.00 Max 0.65 8.05 6.05 Unit Min Rev V3.1 0.95 May 15, 2019 e L 0.75 1.27 0.80 0.85 Page 6 SD NAND XTSD01G/XTSD02G/XTSD04G/XTSD08G 8. Ordering Information The ordering part number is formed by a valid combination of the following XT SD XXX A LG E G A Company Prefix XT = XTX Product Family SD = 2.7~ 3.6V SD2.0 NAND in package form Product Density 01G = 1Gbit (128MByte) 02G = 2Gbit (256MByte) 04G = 4Gbit (512MByte) 08G = 8Gbit (1GByte) Internal Version A , B, C, D or optional Product Package LG = LGA8 (Land Grid Array) Temperature Grade E = Extended (-30℃ to +85℃) Green Code G = Green/Reach Package Product Carrier U = Tube; T = Tape & Reel; A = Tray Rev V3.1 May 15, 2019 Page 7 SD NAND XT SD XXX XTSD01G/XTSD02G/XTSD04G/XTSD08G LG E A G Company Prefix XT = XTX Product Family SD = 2.7~ 3.6V SD2.0 NAND in package form Product Density 01G = 1Gbit (128MByte) 02G = 2Gbit (256MByte) 04G = 4Gbit (512MByte) 08G = 8Gbit (1GByte) Product Package LG = LGA8 (Land Grid Array) Temperature Grade E = Extended (-30℃ to +85℃) Product Carrier U = Tube; T = Tape & Reel; A = Tray Green Code G = Green/Reach Package Rev V3.1 May 15, 2019 Page 8 SD NAND XTSD01G/XTSD02G/XTSD04G/XTSD08G 9. Revision History Version No. Change Description Date V1.0 Initial release, part number is based on extended temperature, WSON 8*6mm package, tape & reel packing , 1Gb/2Gb/4Gb density were included . 2017/1/10 V1.1 Add 8Gb density , and correct some typos ; 2017/1/10 V2.1 Part number change from PNSDxxGWS to PNSDxxGLG; Package change from WSON8 to LGA8 ; Package dimension b change from 0.7mm to 0.6mm ; Package dimension picture updated without the dissipating pad ; Add a page for part number description ; 2017/1/22 V2.2 Modify part number description; Page head re-layout ; 2017/1/23 V2.3 Add SPI mode pin description 2017/2/1 V2.4 Set default Part number and PNSDxxGLGEAG (tray packing) 2017/2/14 V2.5 Part number update from PNSDxxxx to XTSDxxxx 2017/3/3 V2.6 Rename company name to XTX 2017/3/23 V2.7 Revise page #8,9 & 10 register table to include 8Gb, add cover page & page 2018/4/2 V2.8 Revise page #7 leakage unit error correction to uA. 2018/4/25 V2.9 Revise OPN to new ordering format & add new OPN, include manual content option 2018/10/23 V3.0 Remove the Incomplete SD protocol and correct the ordering information 2019/2/27 V3.1 Revise the ordering information 2019/5/15 Rev V3.1 May 15, 2019 Page 9