LSGN04R025/LSGC04R025
Lonten N-channel 40V, 120A, 2.5mΩ Power MOSFET
Description
Product Summary
These N-Channel enhancement mode power field
VDSS
40V
effect transistors are using split gate trench DMOS RDS(on),max@ VGS=10V
2.5mΩ
technology. This advanced technology has been
120A
ID
especially tailored to minimize on-state resistance,
provide superior switching performance, and with
stand high energy pulse in the avalanche and
Pin Configuration
commutation mode. These devices are well suited
for high efficiency fast switching applications.
Features
40V,120A, RDS(on),max =2.5mΩ@VGS = 10V
Improved dv/dt capability
Fast switching
100% EAS Guaranteed
Green device available
Applications
Motor Drives
UPS
DC-DC Converter
Pb
N-Channel MOSFET
Absolute Maximum Ratings T
C
= 25°C unless otherwise noted
Parameter
Symbol
Value
Unit
40
V
120
A
81
A
IDM
360
A
Gate-Source voltage
VGSS
±18
V
Avalanche energy
EAS
225
mJ
Power Dissipation ( TC = 25°C )
PD
57.6
W
Storage Temperature Range
TSTG
-55 to +150
°C
Operating Junction Temperature Range
TJ
-55 to +150
°C
Value
Unit
1.67
°C/W
Drain-Source Voltage
VDSS
Continuous drain current ( TC = 25°C )
1)
ID
Continuous drain current ( TC = 100°C )
Pulsed drain current
2)
3)
Thermal Characteristics
Parameter
Symbol
Thermal Resistance, Junction-to-Case
Version 0.3 , May-2019
RθJC
1
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LSGN04R025/LSGC04R025
Package Marking and Ordering Information
Device
Device Package
Marking
LSGN04R025
PPAK5X6
LSGN04R025
LSGC04R025
TO-220
LSGC04R025
Electrical Characteristics
Parameter
TJ = 25°C unless otherwise noted
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Static characteristics
Drain-source breakdown voltage
BVDSS
VGS=0 V, ID=250uA
40
---
---
V
Gate threshold voltage
VGS(th)
VDS=VGS, ID=250uA
1.0
---
2.2
V
Drain-source leakage current
IDSS
VDS=40 V, VGS=0V, TJ = 25°C
---
---
1
μA
Gate leakage current, Forward
IGSSF
VGS=18 V, VDS=0 V
---
---
100
nA
Gate leakage current, Reverse
IGSSR
VGS=-18 V, VDS=0 V
---
---
-100
nA
Drain-source on-state resistance
RDS(on)
VGS=10 V, ID=50 A
---
---
2.5
mΩ
VGS=4.5 V, ID=20 A
---
---
5
mΩ
Forward transconductance
gfs
VDS =10V , ID=20A
---
131
---
S
---
3210
---
---
2130
---
---
343
---
---
9
---
Dynamic characteristics
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Turn-on delay time
td(on)
Rise time
tr
VDD = 15V,VGS=10V, ID = 20A
---
4
---
Turn-off delay time
td(off)
RG=1.6Ω
---
45
---
Fall time
tf
---
7
---
---
7
---
---
17.5
---
---
67
---
VDS = 15 V, VGS = 0 V,
F = 1MHz
pF
ns
Gate charge characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
Gate charge total
Qg
VDS=15V, ID=15A,
VGS= 10 V
nC
Drain-Source diode characteristics and Maximum Ratings
Continuous Source Current
IS
---
---
120
A
Pulsed Source Current
ISM
---
---
360
A
---
0.85
1.2
V
---
---
26
ns
---
---
95
nC
4)
Diode Forward Voltage
VSD
Reverse Recovery Time
trr
Reverse Recovery Charge
Qrr
VGS=0V, IS=40A, TJ=25℃
IS=IF, di/dt=100A/us, TJ=25℃
5)
Notes:
1: The maximum junction current rating is package limited.
2: Repetitive Rating: Pulse width limited by maximum junction temperature.
3: VDD=23V, VGS=10V, L=0.5mH, IAS=30A, RG=25Ω, Starting TJ=25℃.
4: Pulse Test:Pulse Width ≤300μs, Duty Cycle≤2%.
5: Guaranteed by design, not subject to production.
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LSGN04R025/LSGC04R025
Electrical Characteristics Diagrams
Fig 1: Output Characteristics
Fig 2: Transfer Characteristics
VGS=3.5V, 4V, 4.5V, 8V,10V
From Bottom to Top
Common Source
Tc = 25°C
Pulse test
VGS=3V
125℃
25℃
Figure 4. Gate Charge Waveform
Figure 3. Capacitance Characteristics
VDS=15V
ID=15A
Ciss
Coss
Crss
Figure 6. Rdson-Drain Current
Figure 5. Body-Diode Characteristics
VGS=4.5V
Tc =125°C
Tc = 25°C
VGS=10V
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LSGN04R025/LSGC04R025
Fig 8: Rdson-Junction Temperature(℃)
Fig 7: Rds(on) vs Gate Voltage
Figure 10. Maximum Safe Operating Area
Figure 9. BVdss vs. Junction temperature
DC
Figure 11. Normalized Maximum Transient Thermal Impedance (RthJC)
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LSGN04R025/LSGC04R025
Test Circuit & Waveform
Figure 12. Gate Charge Test Circuit & Waveform
Figure 13. Resistive Switching Test Circuit & Waveforms
Figure 14. Unclamped Inductive Switching (UIS) Test Circuit & Waveform
Figure 15. Diode Recovery Circuit & Waveform
Version 0.3 , May-2019
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LSGN04R025/LSGC04R025
Mechanical Dimensions for PPAK5×6
COMMON DIMENSIONS
MILLIMETERS
SYMBOL
INCHS
MIN
NOM
A
1
1.1
1.2
0.039
0.043
0.047
b
0.3
0.4
0.5
0.012
0.016
0.020
C
0.154
0.254
0.354
0.006
0.010
0.014
D1
5
5.2
5.4
0.197
0.205
0.213
D2
3.8
4.1
4.25
0.150
0.161
0.167
E1
5.95
6.15
6.35
0.234
0.242
0.250
E2
5.66
5.86
6.06
0.223
0.231
0.239
E4
3.52
3.72
3.92
0.139
0.146
0.154
e
MAX
MIN
1.27 BSC
NOM
MAX
0.050 BSC
H
0.4
0.5
0.6
0.016
0.020
0.024
L
0.5
0.6
0.7
0.020
0.024
0.028
L1
-
-
0.12
K
1.14
1.29
1.44
0.045
0.051
0.005
0.057
PPAK5×6 Part Marking Information
Lonten Logo
Lonten
LSGN04R025
Part Number (Not marked on the engineering sample)
ABYWW99
“99”
Manufacturing code
“AB”
Foundry & Assembly code
“YWW”
Date Code
Calendar Year
Calendar Week
Week Code
2018
G
Workweek 01
01
2019
H
Workweek 02
02
2020
I
Workweek 03
03
2021
J
Workweek 04
04
2022
K
Workweek 05
05
2023
L
Workweek 06
06
2024
M
…..
…..
Version 0.2 ,May- 2019
Year Code
6
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LSGN04R025/LSGC04R025
TO-220 PACKAGE INFORMATION
COMMON DIMENSIONS
SYMBOL
MM
INCH
MIN
NOM
MAX
MIN
NOM
MAX
A
4.37
4.57
4.70
0.172
0.180
0.185
A1
1.25
1.30
1.40
0.049
0.051
0.055
A2
2.20
2.40
2.60
0.087
0.094
0.102
b
0.70
0.80
0.95
0.028
0.031
0.037
b2
1.17
1.27
1.47
0.046
0.050
0.058
c
0.45
0.50
0.60
0.018
0.020
0.024
D
15.10
15.60
16.10
0.594
0.614
0.634
D1
8.80
9.10
9.40
0.346
0.358
0.370
D2
5.50
-
-
0.217
-
-
E
9.70
10.00
10.30
0.382
0.394
0.406
E3
7.00
-
-
0.276
-
-
e
2.54BCS
e1
0.1BSC
5.08BCS
0.2REF
H1
6.25
6.50
6.85
0.246
0.256
0.270
L
12.75
13.50
13.80
0.502
0.531
0.543
L1
-
3.10
3.40
-
0.122
0.134
ØP
3.40
3.60
3.80
0.134
0.142
0.150
Q
2.60
2.80
3.00
0.102
0.110
0.118
TO-220 Part Marking Information
Lonten Logo
Lonten
Part Number
LSGC04R025
“AB”
Foundry & Assembly code
ABYWW99
“99”
Manufacturing code
“YWW”
Date Code
Calendar Year
Calendar Week
Week Code
2018
G
Workweek 01
01
2019
H
Workweek 02
02
2020
I
Workweek 03
03
2021
J
Workweek 04
04
2022
K
Workweek 05
05
2023
L
Workweek 06
06
2024
M
…..
…..
Version 0.2 ,May- 2019
Year Code
7
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LSGN04R025/LSGC04R025
Disclaimer
The content specified herein is for the purpose of introducing LONTEN's products (hereinafter "Products"). The
information given in this document shall in no event be regarded as a guarantee of conditions or characteristics.
Examples of application circuits, circuit constants and any other information contained herein illustrate the standard
usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits
for mass production.
LONTEN does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of the Products or technical information described in this document.
The Products are not designed or manufactured to be used with any equipment, device or system which requires
an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or
create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclearreactor controller, fuel-controller or other safety device). LONTEN shall bear no responsibility in any way for use of
any of the Products for the above special purposes.
Although LONTEN endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard them against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a LONTEN product.
The content specified herein is subject to change for improvement without notice. When using a LONTEN product,
be sure to obtain the latest specifications.
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