SMD1206P035TF/30

SMD1206 HF Series Surface Mount PTC Devices SMD1206 HF Series Surface Mount PTC Devices Description The 1206 series provides miniature surface mount overcurrent protection with holding current from 0.05A to 2.0A. This series is suitable for wide range of applications in modern electronics where space is limited. Features y RoHS compliant and lead-free y Low profile y Halogen-free y Fast response to fault current y Compact design saves board space y Compatible with high temperature solders Applications y Mobile Internet Device (MID) y Set-top-box and HDMI y Battery PCM y Game console port protection y USB hubs, ports and peripherals y General electronics Agency Approval and Environmental Compliance Agency File Number Regulation Standard E201431  2011/65/EU R50099121  IEC 61249-2-21:2003 Electrical Characteristics Part Number Ihold (A) Itrip (A) Vmax (Vdc) Imax (A) Pd typ (W) SMD1206P005TF SMD1206P005TF/30 SMD1206P010TF SMD1206P010TF/30 SMD1206P012TF SMD1206P016TF SMD1206P020TF/24 SMD1206P025TF SMD1206P025TF/24 SMD1206P035TF/16 SMD1206P035TF/30 SMD1206P050TF SMD1206P050TF/15 SMD1206P050TF/24 SMD1206P075TFT SMD1206P075TF/13.2 SMD1206P075TF/16 SMD1206P110TFT SMD1206P150TFT SMD1206P175TF SMD1206P200TF 0.05 0.05 0.10 0.10 0.125 0.16 0.20 0.25 0.25 0.35 0.35 0.50 0.50 0.50 0.75 0.75 0.75 1.10 1.50 1.75 2.00 0.15 0.15 0.25 0.25 0.29 0.37 0.42 0.50 0.55 0.75 0.75 1.00 1.00 1.00 1.50 1.50 1.50 2.20 3.00 3.50 3.50 60 30 60 30 30 30 24 16 24 16 30 6 15 24 8 13.2 16 8 8 6 6 10 40 10 40 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.6 0.8 0.8 0.8 0.8 Maximum Time To Trip Current Time (A) (Sec.) 0.25 0.25 0.50 0.50 1.00 1.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 1.50 1.50 1.50 1.50 0.20 0.30 0.10 0.08 0.08 0.10 0.10 0.10 0.10 0.10 0.20 0.20 0.20 0.10 0.30 0.50 1.50 Resistance Rmin () R1max () 3.600 3.600 1.500 1.500 1.500 1.200 0.650 0.550 0.550 0.300 0.300 0.150 0.150 0.150 0.090 0.090 0.090 0.040 0.040 0.020 0.018 20.000 20.000 10.000 10.000 6.000 4.500 2.600 2.300 2.300 1.200 1.200 0.700 0.750 0.750 0.290 0.350 0.290 0.210 0.120 0.090 0.080 Agency Approval 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 2 of 10 2017/01/03 Revision: K SMD1206 HF Series Surface Mount PTC Devices Note on Electrical Characteristics „ Vocabulary Ihold = Hold current: maximum current device will pass without tripping in 23ºC still air. Itrip = Trip current: minimum current at which the device will trip in 23 ºC still air. Vmax = Maximum voltage device can withstand without damage at rated current (I max) Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd typ = Typical power dissipated from device when in the tripped state at 23 ºC still air. Rmin = Minimum resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 23 ºC measured one hour after tripping or reflow soldering of 260 ºC for 20 sec. „ Value specified is determined by using the PWB with 0.030”*1.5oz copper traces. „ Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. „ Specifications are subject to change without notice. Polymeric PTC Selecting Guide „ Determine the following operating parameters for the circuits: y Normal operating current (Ihold) Ɂ Maximum interrupt current (Imax) y Maximum circuit voltage (Vmax) Ɂ Normal operating temperature surrounding device (minºC/maxºC) y Surface Mount Device (SMD) Ɂ Axial Leaded Device (ALD) y Radial Leaded Device (RLD) Ɂ DISC Device ! !! „ Select the device form factor and dimension suitable for the application: !! Ɂ Other Customized Form Factors !! !! „ Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure the circuit’s requirement does not exceed the device rating. „ Check that PPTC device’s trip time (time-to-trip) will protect the circuit. „ Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range. „ Verify the performance and suitability of the chosen PPTC device in the application. „ Mechanical Stress y PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied. „ Chemical Pollutants y Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices, and shall not be used or applied. „ Electronic and Thermal Effect y PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by, among others, incorrect pin-connection of a connector) or over-extensive trip events may occur. y PTTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open circuit, in which case the voltage at such PPTC devices may reach a hazardous level. y Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to the PPTC devices. y Conductive material contamination, such as metal particle, may induce shortage, flame or arcing. y Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices, which shall not be used under such circumstances. „ General y Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual applications will be met. y The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or mechanical procedures and/or conditions non-conformant to those recommended by manufacturer. y Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection to avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices. y Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with.  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 3 of 10 2017/01/03 Revision: K SMD1206 HF Series Surface Mount PTC Devices Thermal Derating Curve Percentage of Rated Current 200.00 150.00 100.00 50.00 0.00 -40.00 0.00 40.00 80.00 120.00 Device Ambient Temperature (ɗ ) Thermal Derating Chart Recommended Hold Current (A) at Ambient Temperature (ºC) Ambient Operation Temperature Part Number -40 ºC -20 ºC 0 ºC 23 ºC 40 ºC 50 ºC 60 ºC 70 ºC 85 ºC SMD1206P005TF 0.076 0.068 0.060 0.050 0.043 0.039 0.034 0.030 0.023 SMD1206P005TF/30 0.076 0.068 0.060 0.050 0.043 0.039 0.034 0.030 0.023 SMD1206P010TF 0.156 0.139 0.120 0.100 0.083 0.074 0.065 0.056 0.042 SMD1206P010TF/30 0.156 0.139 0.120 0.100 0.083 0.074 0.065 0.056 0.042 SMD1206P012TF 0.18 0.16 0.14 0.125 0.10 0.09 0.08 0.07 0.05 SMD1206P016TF 0.22 0.20 0.18 0.16 0.14 0.12 0.10 0.09 0.08 SMD1206P020TF/24 0.28 0.25 0.23 0.20 0.17 0.15 0.14 0.12 0.09 SMD1206P025TF 0.37 0.33 0.29 0.25 0.22 0.20 0.17 0.15 0.12 SMD1206P025TF/24 0.37 0.33 0.29 0.25 0.22 0.20 0.17 0.15 0.12 SMD1206P035TF/16 0.50 0.45 0.40 0.35 0.30 0.27 0.24 0.21 0.15 SMD1206P035TF/30 0.50 0.45 0.40 0.35 0.30 0.27 0.24 0.21 0.15 SMD1206P050TF 0.71 0.64 0.57 0.50 0.42 0.39 0.35 0.31 0.25 SMD1206P050TF/15 0.71 0.64 0.57 0.50 0.42 0.39 0.35 0.31 0.25 SMD1206P050TF/24 0.71 0.64 0.57 0.50 0.42 0.39 0.35 0.31 0.25 SMD1206P075TFT 1.14 1.01 0.88 0.75 0.65 0.59 0.54 0.49 0.41 SMD1206P075TF/13.2 1.14 1.01 0.88 0.75 0.65 0.59 0.54 0.49 0.41 SMD1206P075TF/16 1.14 1.01 0.88 0.75 0.65 0.59 0.54 0.49 0.41 SMD1206P110TFT 1.64 1.46 1.30 1.10 0.92 0.83 0.80 0.65 0.52 SMD1206P150TFT 2.20 1.99 1.77 1.50 1.34 1.23 1.10 1.01 0.84 SMD1206P175TF 2.50 2.25 2.00 1.75 1.55 1.45 1.35 1.25 1.10 SMD1206P200TF 2.60 2.44 2.35 2.00 1.78 1.67 1.50 1.45 1.10  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 4 of 10 2017/01/03 Revision: K SMD1206 HF Series Surface Mount PTC Devices Average Time-Current Curve 100.00 A炼SMD1206P005TF E C A B炼SMD1206P010TF B F 10.00 Time to Trip (Sec.) SMD1206P005TF/30 D SMD1206P010TF/30 C炼SMD1206P012TF D炼SMD1206P016TF E炼SMD1206P020TF/24 1.00 F炼SMD1206P025TF SMD1206P025TF/24 0.10 0.01 0.10 1.00 10.00 Faulct Current (Amp.) Average Time-Current Curve 100.00 A炼SMD1206P035TF/16 A SMD1206P035TF/30 B炼SMD1206P050TF B H Time to Trip (Sec.) 10.00 SMD1206P050TF/15 FG D C SMD1206P050TF/24 E C炼SMD1206P075TFT D炼SMD1206P075TF/13.2 1.00 SMD1206P075TF/16 E炼SMD1206P110TFT F炼SMD1206P150TFT 0.10 G炼SMD1206P175TF H炼SMD1206P200TF 0.01 0.10 1.00 10.00 Faulct Current (Amp.)  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 5 of 10 2017/01/03 Revision: K SMD1206 HF Series Surface Mount PTC Devices Soldering Parameters Profile Feature Average Ramp-Up Rate (Tsmax to TP) Preheat -Temperature Min (Tsmin) -Temperature Max (Tsmax) -Time (Tsmin to Tsmax) Time maintained above: -Temperature (TL) -Time (tL) Peak Temperature (TP) Time within 5ºC of actual Peak Temperature (tP) Ramp-Down Rate Time 25ºC to Peak Temperature Storage Condition Pb-Free Assembly 3ºC/second max. 150ºC 200ºC 60-180 seconds 217ºC 60-150 seconds 260ºC 20-40 seconds 6 ºC /second max. 8 minutes max. 0ºC ~35ºC, ʀ70%RH y Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free y Recommended maximum paste thickness is 0.25mm (0.010 inch) y Devices can be cleaned using standard industry methods and solvents. Note 1: All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 6 of 10 2017/01/03 Revision: K SMD1206 HF Series Surface Mount PTC Devices Physical Dimensions (mm.) P : Polytronics/ Polystar Logo Part identification Figure 2 Part Number SMD1206P005TF SMD1206P005TF/30 SMD1206P010TF SMD1206P010TF/30 SMD1206P012TF SMD1206P016TF SMD1206P020TF/24 SMD1206P025TF SMD1206P025TF/24 SMD1206P035TF/16 SMD1206P035TF/30 SMD1206P050TF SMD1206P050TF/15 SMD1206P050TF/24 SMD1206P075TFT SMD1206P075TF/13.2 SMD1206P075TF/16 SMD1206P110TFT SMD1206P150TFT SMD1206P175TF SMD1206P200TF A B C D E Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 3.40 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.50 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 0.65 0.65 0.65 0.65 0.65 0.65 0.50 0.50 0.50 0.45 0.50 0.45 0.45 0.75 0.40 0.75 0.75 0.30 0.50 0.80 0.80 1.25 1.10 1.25 1.10 1.45 1.45 1.00 1.00 1.00 0.75 1.00 0.75 0.75 1.25 0.60 1.25 1.25 0.60 1.00 1.80 1.60 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 Environmental Specifications Operating Temperature -40ºC to +85 ºC Maximum Device Surface Temperature in Tripped State 125ºC Passive Aging Humidity Aging Thermal Shock +85ºC , 1000 hours ±5% typical resistance change +85ºC , 85%R.H. 1000 hours ±5% typical resistance change MIL-STD-202 Method 107G +85ºC /-40ºC 20 times -30% typical resistance change Vibration MIL-STD-202, Method 215 No change MIL-STD-883C, Method 2007.1, Condition A No change Moisture Sensitivity Level Level 1, J-STD-020C Solvent Resistance  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 7 of 10 2017/01/03 Revision: K SMD1206 HF Series Surface Mount PTC Devices Packaging Quantity and Marking Recommended Pad Layout (mm.) 1.80 1.80 1.00 Part Number SMD1206P005TF 1.00 Marking Quantity E 3000 SMD1206P005TF/30 J 3000 SMD1206P010TF H 3000 SMD1206P010TF/30 K 3000 SMD1206P012TF 1 3000 SMD1206P016TF 01 3000 SMD1206P020TF/24 2 4000 SMD1206P025TF 02 4000 SMD1206P025TF/24 02 4000 SMD1206P035TF/16 03 4000 SMD1206P035TF/30 33 3000 SMD1206P050TF 05 4000 SMD1206P050TF/15 5 4000 SMD1206P050TF/24 F 3000 SMD1206P075TFT 07 4000 SMD1206P075TF/13.2 07 3000 SMD1206P075TF/16 71 3000 SMD1206P110TFT C 4000 SMD1206P150TFT 15 3000 SMD1206P175TF 17 2000 SMD1206P200TF 20 2000 ˖ġ 8 mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3) Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 8 of 10 2017/01/03 Revision: K SMD1206 HF Series Surface Mount PTC Devices Tape Specifications: EIA-481 (mm.) P020TF/24, P025TF P005TF, P005TF/30 P175TF P025TF/24, 035TF/16 P010TF, P010TF/30 P200TF P050TF, P050TF/15 P012TF, P016TF P075TFT, P110TFT P035TF/30, P050TF/24 P075TF/13.2 P075TF/16 P150TFT W F E1 D0 D1 P0 P1 P2 A0 B0 T K0 8.20 +0.10/-0.30 8.15 +0.15/-0.30 8.20 +0.10/-0.30 3.50 ± 0.05 3.50 ± 0.05 3.50 ± 0.05 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 1.55 ± 0.05 1.55 ± 0.05 1.55 ± 0.05 1.00 ± 0.10 1.00 ± 0.10 1.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 1.95 ± 0.10 1.92 ± 0.10 1.95 ± 0.10 3.65 ± 0.10 3.65 ± 0.10 3.65 ± 0.10 0.20 ± 0.10 0.25 ± 0.10 0.25 ± 0.10 0.87 ± 0.10 1.30 ± 0.10 1.70 ± 0.10 Leader min. 390 390 390 Trailer min. 160 160 160 Reel Dimensions: EIA-481 (mm.) C D H W Ø178 ± 1.0 Ø60.2 ± 0.5 11.0 ± 0.5 9.0 ± 1.5  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 9 of 10 2017/01/03 Revision: K SMD1206 HF Series Surface Mount PTC Devices Part Number System SMD 1206 P  TF T / Special Voltage Rating (Optional) Thickness Version (Optional) Lead- Free Holding Current Rating Polytronics Symbol Device Dimensions: Length/Width (Unit: 1/100 inch) Surface Mount Device Cross Reference Polytronics / EVERFUSE® Cross Reference TE Connectivity / PolySwitch® Bourns / Multifuse® SMD1206P005TF SMD1206P005TF/30 SMD1206P010TF SMD1206P010TF/30 SMD1206P012TF nanoSMDC012F MF-NSMF012 SMD1206P016TF nanoSMDC016F - SMD1206P020TF/24 nanoSMDC020F MF-NSMF020 SMD1206P025TF nanoSMDC025F - SMD1206P025TF/24 - - SMD1206P035TF/16 nanoSMDC035F MF-NSMF035 - - SMD1206P035TF/30 SMD1206P050TF SMD1206P050TF/15 SMD1206P075TFT nanoSMDM050F - nanoSMDC050F/13.2 MF-NSMF050 nanoSMDC075F MF-NSMF075 - - SMD1206P075TF/13.2 - - SMD1206P110TFT nanoSMDC110F MF-NSMF110 SMD1206P150TFT nanoSMDC150F MF-NSMF150 SMD1206P175TF - - SMD1206P200TF nanoSMDC200F MF-NSMF200 SMD1206P075TF/16 “EVERFUSE” is a registered trademark of Polytronics Technology Corp. “Multifuse” is a registered trademark of Bourns, Inc. “PolySwitch” is a registered trademark of TE Connectivity Ltd.  㖗䫠ⷩ䦸⭟ⷌ㥔⛹⌧ⷌ㥔㝘⛂巖 24-1 噆 No. 24-1 Industry E. Rd. IV, Hsinchu Science Park, Hsinchu 300, Taiwan. TEL: +886-3-5643931 FAX: +886-3-5644624 http://www.pttc.com.tw Page: 10 of 10 2017/01/03 Revision: K