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Low profile:Thickness max.3.0mm
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Thin type of on-board power supply module for
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⑥ Material Type;
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⑤ The Material Code;
④ Inductance Value:2R2=2.2µH;
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17
S 1
⑤ ⑥
④
-
2R2
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-
③
③ Dimensions(unit:mm):6.0x6.0x3.0;
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0630
②
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Suggested pad layout
Dimensions are in mm
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①
(C)3.0±0.3
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8,4
The rated current as listed is either the saturation current or the
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3,5
3,7
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cooling provision all affect the part temperature.Part temperature
MC W
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component.PWB trace size and thickness, airflow and other
should be verified in the end application.
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(D)3.0Max
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The part temperature (ambient + temp rise ) should not exceed
125℃ under the worst case operating conditions.Circuit design,
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(F)1,6±0.3
Operat between temperature range -55℃ to +125℃
heating current depending on which value is lower.
(E)0~0.15
(B)6,6±0.2
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(A)6.95±0.35
Isat :DC current (A) that will cause L0 to drop approximately 20%
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DC/DC converters for laptop motherboards/CPU
Idc: DC current (A) that will cause an approximate △T of 40℃
② Mold Categories:W;
※ Application
Voltage regulator VRM for server
Test Condition:100KHz,1.0Vrms
※ Regulation of Part number
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100% lead (Pb) free meet RoHS standards
※ Dimensions in inches (unit:mm)
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Low loss and low resistance
All test data is reference to 25℃ ambient.
① Molding Choke;
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High performance (Isat) realizde by metal dust core.
Capable of corresponding high frequency (3MHz)
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※Note:
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※ Features
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MCW-0630-XXX-S1 Series
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