AP6275P

AP6275P Datasheet 正基科技股份有限公司 SPECIFICATION PRODUCT NAME：AP6275P REVISION：0.6 DATE：Mar 19th , 2020 Customer APPROVED Company Representative Signature PREPARED 保存期限:最新版本 REVIEW PM QA APPROVED DCC ISSUE C-RD-047C AP6275P Data Sheet Address: 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 Website: http://www.ampak.com.tw AP6275P Datasheet Revision Revision Date Description Revised By 0.1 2018/12/10 - Preliminary Richard 0.2 2018/12/11 - Modify Dimension Richard 0.3 2019/05/09 - Modify information Benson - Modify footprint define - Modify Label - Add ESD Specification - Add External 37.4MHz X`tal characteristics 0.4 2019/11/27 0.5 2020/03/06 -Modify RF Specification Jason 2020/03/19 - Modify DC Characteristics - Modify Storage temperature - Add PCM UART Timing Jason 0.6 AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 i Jason http://www.ampak.com.tw AP6275P Datasheet Contents 1. Introduction ........................................................................................................... 2 1.1 Overview ........................................................................................................ 2 1.2 Product Features ............................................................................................. 3 2. General Specification .............................................................................................. 4 2.1 General Specification ....................................................................................... 4 2.2 DC Characteristics ........................................................................................... 4 2.2.1 Absolute Maximum Ratings...................................................................... 4 2.2.2 Recommended Operating Rating .............................................................. 5 3. Wi-Fi RF Specification ............................................................................................. 6 3.1 2.4GHz RF Specification ................................................................................... 6 3.2 5GHz RF Specification ...................................................................................... 8 4. Bluetooth Specification ......................................................................................... 14 4.1 Bluetooth Specification .................................................................................. 14 5. Pin Definition ....................................................................................................... 15 5.1 Pin Outline ................................................................................................... 15 5.2 Pin Assignment ............................................................................................. 15 6. Dimensions .......................................................................................................... 17 6.1 Module Dimensions ...................................................................................... 17 6.2 Recommended footprint .............................................................................. 18 7. External clock reference ........................................................................................ 19 8. Host Interface Timing Diagram .............................................................................. 20 8.1 Power-up Sequence Timing Diagram ............................................................... 20 8.2 PCIe Interface Description .............................................................................. 22 8.3 PCM Interface Description ............................................................................. 25 9. Recommended Reflow Profile ............................................................................... 30 10. Package Information ............................................................................................. 31 10.1 Label .......................................................................................................... 31 10.2 Dimension .................................................................................................. 32 10.3 MSL Level / Storage Condition ...................................................................... 34 AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 ii http://www.ampak.com.tw AP6275P Datasheet 1. Introduction 1.1 Overview The AMPAK Technology® AP6275P is a fully Wi-Fi and Bluetooth functionalities module with seamless roaming capabilities and advance security, also it could interact with different vendors’ 802.11a/b/g/n/ac/ax 2x2 Access Points with MIMO standard and can accomplish up to speed of 1200Mbps with dual stream in 802.11ax to connect the wireless LAN. Furthermore AP6275P included PCIe interface for Wi-Fi, UART/ PCM interface for Bluetooth. In addition, this compact module is a total solution for a combination of Wi-Fi + BT technologies. The module is specifically developed for tablet, OTT box and portable devices. AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 2 http://www.ampak.com.tw AP6275P Datasheet 1.2        Product Features Lead Free design which is compliant with ROHS requirements. TX and RX low-density parity check (LDPC) support for improved range and power efficiency. Dual-stream spatial multiplexing up to 1200 Mbps data rate. 20, 40, 80 MHz channels with optional SGI. (1024 QAM modulation) IEEE 802.11ax beam forming. Client MU-MIMO. Supports 2 antennas with two for shared BT and WLAN port. - Supports PCI express revision 3.0 and power management running at Gen1 speeds.  BT host digital interface: - HCI UART (up to 4 Mbps) - PCM for audio data  Complies with Bluetooth Core Specification Version 5.0 with provisions for supporting future specifications. With Bluetooth Class 1 or Class2 transmitter operation. Supports extended synchronous connections (eSCO), for enhanced voice quality by allowing for retransmission of dropped packets.   Adaptive frequency hopping (AFH) for reducing radio frequency interference. A simplified block diagram of the module is depicted in the figure above. AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 3 http://www.ampak.com.tw AP6275P Datasheet 2. General Specification 2.1 General Specification Model Name AP6275P Product Description 2T2R 802.11 ax/ac/a/b/g/n Wi-Fi + BT 5.0 Module Dimension L x W: 15 x 13(typical) mm H: 1.55(Maximum) mm WiFi Interface Support PCIe v3.0 compliant and runs at Gen1 speeds. BT Interface UART / PCM Operating temperature -30°C to 85°C Storage temperature -40°C to 85°C Operating Humidity 10% to 95% Non-Condensing Storage Humidity 5% to 95% Non-Condensing Note: The optimal RF performance specified in the data sheet, however, is guaranteed only -10 °C to +55 °C and 3.2V < VBAT < 3.6V without derating performance. Humidity 2.2 DC Characteristics 2.2.1 Absolute Maximum Ratings Symbol VBAT VDDIO Description Min. Max. Unit Input supply Voltage -0.5 4.5 V Digital/ Bluetooth/ I/O Voltage -0.5 2.07 V Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Symbol Condition ESD Rating Unit ESD_HAND_HBM Human body model contact discharge per JEDEC EID/JESD22-A114 1.5 kV ESD_HAND_CDM Charged device model contact discharge per JEDEC EIA/JESD22-C101 250 V AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 4 http://www.ampak.com.tw AP6275P Datasheet 2.2.2 Recommended Operating Rating The module requires two power supplies: VBAT and VDDIO. Voltage rails Min. Typ. Max. Unit VBAT 3.0 3.3 3.8 V VDDIO 1.68 1.8 1.98 V VBAT current consumption 1200mA(Peak), when VBAT = 3.3V The module requires two power supplies: other Digital I/O Pins. For VDDIO=1.8V Min. Max. Unit VIH 0.65×VDDIO N/A V VIL N/A 0.4×VDDIO V VOH output@2mA VDDIO-0.4 N/A V VOL output@2mA N/A 0.4 V AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 5 http://www.ampak.com.tw AP6275P Datasheet 3. Wi-Fi RF Specification 3.1 2.4GHz RF Specification Conditions : VBAT=3.3V ; VDDIO=1.8V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11b/g/n & Wi-Fi compliant Frequency Range 2.400 GHz ~ 2.4835 GHz (2.4GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch13 802.11b : DQPSK、DBPSK、CCK 802.11 g/n : OFDM /64-QAM、16-QAM、QPSK、BPSK 802.11ax : OFDMA /1024-QAM、256-QAM、64-QAM、16-QAM、QPSK、 Modulation BPSK Output Power , tolerance ± 1.5 dB The transmit EVM quality & spectrum mask are compliant with IEEE 802.11 standard 1Mbps 802.11b 2Mbps 19.5 5.5Mbps 19.5 11Mbps 19.5 19.5 24Mbps 36Mbps 19.5 18.5 18.5 18 MCS0~2 MCS3 MCS4 MCS5 MCS6 802.11n 19.5 18.5 18.5 18 18 20MHz MCS7 HE0~2 HE3 HE4 HE5 HE6 802.11ax 19.5 18.5 18.5 18 18 20MHz HE7 HE8 HE9 HE10 HE11 17.5 16.5 16.5 15 15 6、9Mbps 802.11g 19.5 12、18Mbps 48Mbps 54Mbps 18 17.5 Note: The specifications of RF output power are subject to change to fulfill the safety regulation and requirements in end-user product. Sensitivity, tolerance ± 2 dB CCK modulation PER ≦ 8%、OFDM modulation PER ≦ 10% Data Rate 802.11b Spec.(dBm) 1Mbps -98 2Mbps -93 5.5Mbps -91 11Mbps -89 AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 6 http://www.ampak.com.tw AP6275P Datasheet Data Rate Spec.(dBm) Data Rate Spec.(dBm) 6Mbps -93 24Mbps -85 9Mbps -92 36Mbps -82 12Mbps -91 48Mbps -78 18Mbps -88 54Mbps -76 Data Rate Spec.(dBm) Data Rate Spec.(dBm) 6Mbps -95 24Mbps -87 9Mbps -94 36Mbps -84 12Mbps -93 48Mbps -81 18Mbps -90 54Mbps -78 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0 -93 MCS4 -81.5 MCS1 -89 MCS5 -79 MCS2 -87 MCS6 -76 MCS3 -84 MCS7 -76 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0 -93 MCS5 -80 802.11n_20MHz MCS1 -92 MCS6 -78 MIMO MCS2 -90 MCS7 -76 MCS3 -87 MCS8 -72 MCS4 -83 MCS15 -73 Data Rate Spec.(dBm) Data Rate Spec.(dBm) HE0 -93 HE6 -76 HE1 -89 HE7 -76 HE2 -87 HE8 -72 HE3 -84 HE9 -70 HE4 -81.5 HE10 -65 HE5 -79 HE11 -61.5 802.11g SISO 802.11g MIMO 802.11n_20MHz SISO 802.11ax_20MHz SISO Maximum Input Level 802.11b : -10 dBm 802.11g/n/ax : -20 dBm AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 7 http://www.ampak.com.tw AP6275P Datasheet 3.2 5GHz RF Specification Conditions : VBAT=3.3V ; VDDIO=1.8V ; Temp:25°C Feature Description WLAN Standard IEEE 802.11a/n/ac/ax & Wi-Fi compliant Frequency Range 5.15~5.35GHz、5.47~5.725GHz、5.725~5.85GHz (5GHz UNII Band) Number of Channels 5.15~5.35GHz：Ch36 ~ Ch64 5.47~5.725GHz：Ch100 ~ Ch140 5.725~5.85GHz：Ch149 ~ Ch165 802.11a : OFDM /64-QAM、16-QAM、QPSK、BPSK 802.11n : OFDM /64-QAM、16-QAM、QPSK、BPSK 802.11ac : OFDM /256-QAM、OFDM /64-QAM、16-QAM、QPSK、BPSK 802.11ax : OFDMA/ 1024-QAM、 OFDM /256-QAM、OFDM /64-QAM、 16-QAM、QPSK、BPSK Modulation Output Power , tolerance ± 2 dB The transmit EVM quality & spectrum mask are compliant with IEEE 802.11 standard Frequency (MHz) 6~9Mbps 12~18Mbps 24Mbps 36Mbps 5150~5350 16.5 16.5 16 16 5470~5720 16.5 16.5 16 16 5725~5845 16.5 16.5 16 16 48Mbps 54Mbps 5150~5350 15.5 15.5 5470~5720 15.5 15.5 5725~5845 15.5 15.5 Frequency (MHz) MCS0~2 MCS3 MCS4 MCS5 5150~5350 16 16 15.5 15.5 5470~5720 16 16 15.5 15.5 802.11n 5725~5845 16 16 15.5 15.5 20MHz Frequency (MHz) MCS6 MCS7 5150~5350 14.5 14.5 5470~5720 14.5 14.5 5725~5845 14.5 14.5 802.11a Frequency (MHz) AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 8 http://www.ampak.com.tw AP6275P Datasheet Frequency (MHz) MCS0~2 MCS3 MCS4 MCS5 5150~5350 16 16 15 15 5470~5720 16 16 15 15 802.11n 5725~5845 16 16 15 15 40MHz Frequency (MHz) MCS6 MCS7 5150~5350 14.5 14.5 5470~5720 14.5 14.5 5725~5845 14.5 14.5 Frequency (MHz) MCS0~2 MCS3 MCS4 MCS5 5150~5350 16 16 15.5 15.5 5470~5720 16 16 15.5 15.5 802.11ac 5725~5845 16 16 15.5 15.5 20MHz Frequency (MHz) MCS6 MCS7 MCS8 5150~5350 14.5 14.5 12 5470~5720 14.5 14.5 12 5725~5845 14.5 14.5 12 Frequency (MHz) MCS0~2 MCS3 MCS4 MCS5 5150~5350 16 15 15 15 5470~5720 16 15 15 15 802.11ac 5725~5845 16 15 15 15 40MHz Frequency (MHz) MCS6 MCS7 MCS8 MCS9 5150~5350 14.5 14.5 12 10 5470~5720 14.5 14.5 12 10 5725~5845 14.5 14.5 12 10 Frequency (MHz) MCS0~2 MCS3 MCS4 MCS5 5150~5350 16 15 14 14 5470~5720 16 15 14 14 802.11ac 5725~5845 16 15 14 14 80MHz Frequency (MHz) MCS6 MCS7 MCS8 MCS9 5150~5350 14.5 14.5 10 10 5470~5720 14.5 14.5 10 10 5725~5845 14.5 14.5 10 10 AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 9 http://www.ampak.com.tw AP6275P Datasheet Frequency (MHz) HE0~2 HE3 HE4 HE5 5150~5350 16.5 15.5 15.5 15.5 5470~5720 16.5 15.5 15.5 15.5 5725~5845 16.5 15.5 15.5 15.5 Frequency (MHz) HE6 HE7 HE8 HE9 5150~5350 14.5 14.5 12 12 5470~5720 14.5 14.5 12 12 5725~5845 14.5 14.5 12 12 Frequency (MHz) HE10 HE11 5150~5350 10 10 5470~5720 10 10 5725~5845 10 10 Frequency (MHz) HE0~2 HE3 HE4 HE5 5150~5350 16 15 15 15 5470~5720 16 15 15 15 5725~5845 16 15 15 15 Frequency (MHz) HE6 HE7 HE8 HE9 802.11ax 5150~5350 14.5 14.5 12 10 40MHz 5470~5720 14.5 14.5 12 10 5725~5845 14.5 14.5 12 10 Frequency (MHz) HE10 HE11 5150~5350 8 8 5470~5720 8 8 5725~5845 8 8 Frequency (MHz) HE0~2 HE3 HE4 HE5 5150~5350 16 15 15 15 5470~5720 16 15 15 15 5725~5845 16 15 15 15 Frequency (MHz) HE6 HE7 HE8 HE9 802.11ax 5150~5350 14.5 14.5 10 10 80MHz 5470~5720 14.5 14.5 10 10 5725~5845 14.5 14.5 10 10 Frequency (MHz) HE10 HE11 5150~5350 9 9 5470~5720 9 9 5725~5845 9 9 802.11ax 20MHz Note: The specifications of RF output power are subject to change to fulfill the safety regulation and requirements in end-user product. AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 10 http://www.ampak.com.tw AP6275P Datasheet Sensitivity, tolerance ± 2 dB OFDM modulation PER ≦ 10% Data Rate Spec.(dBm) Data Rate Spec.(dBm) 6Mbps -90.5 24Mbps -83 9Mbps -90 36Mbps -80 12Mbps -88 48Mbps -75 18Mbps -86 54Mbps -73 Data Rate Spec.(dBm) Data Rate Spec.(dBm) 6Mbps -92 24Mbps -86 9Mbps -91 36Mbps -83 12Mbps -90 48Mbps -78 18Mbps -89 54Mbps -77 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0 -90 MCS4 -79 MCS1 -88 MCS5 -76 MCS2 -86 MCS6 -73 MCS3 -83 MCS7 -72 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0 -92 MCS5 -78 802.11n_20MHz MCS1 -91 MCS6 -76 MIMO MCS2 -89 MCS7 -75 MCS3 -86 MCS8 -89 MCS4 -82 MCS15 -70 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0 -88 MCS4 -77 MCS1 -86 MCS5 -72 MCS2 -83 MCS6 -70 MCS3 -80 MCS7 -69 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0 -88 MCS5 -75 802.11n_40MHz MCS1 -88 MCS6 -73 MIMO MCS2 -86 MCS7 -72 MCS3 -83 MCS8 -86 MCS4 -79 MCS15 -67 802.11a SISO MIMO802.11a MIMO 802.11n_20MHz SISO 802.11n_40MHz SISO AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 11 http://www.ampak.com.tw AP6275P Datasheet Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0 -90 MCS5 -75 802.11ac_20MHz MCS1 -88 MCS6 -73 SISO MCS2 -86 MCS7 -70 MCS3 -83 MCS8 -68 MCS4 -79 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0,NSS=1 -92 MCS6,NSS=1 -76 MCS1,NSS=1 -91 MCS7,NSS=1 -75 MCS2,NSS=1 -88 MCS8,NSS=1 -72 MCS3,NSS=1 -85 MCS0,NSS=2 -88 MCS4,NSS=1 -82 MCS8,NSS=2 -65 MCS5,NSS=1 -77 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0 -88 MCS5 -72 802.11ac_40MHz MCS1 -86 MCS6 -70 SISO MCS2 -83 MCS7 -69 MCS3 -80 MCS8 -65 MCS4 -76 MCS9 -64 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0,NSS=1 -90 MCS6,NSS=1 -73 MCS1,NSS=1 -88 MCS7,NSS=1 -72 MCS2,NSS=1 -86 MCS8,NSS=1 -68 MCS3,NSS=1 -82 MCS9,NSS=1 -66 MCS4,NSS=1 -79 MCS0,NSS=2 -86 MCS5,NSS=1 -77 MCS9,NSS=2 -60 Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0 -85 MCS5 -68 802.11ac_80MHz MCS1 -82 MCS6 -67 SISO MCS2 -79 MCS7 -65 MCS3 -76 MCS8 -62 MCS4 -73 MCS9 -61 802.11ac_20MHz MIMO 802.11ac_40MHz MIMO AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 12 http://www.ampak.com.tw AP6275P Datasheet 802.11ac_80MHz MIMO 802.11ax_20MHz SISO 802.11ax_40MHz SISO 802.11ax_80MHz SISO Maximum Input Level Data Rate Spec.(dBm) Data Rate Spec.(dBm) MCS0,NSS=1 -87 MCS6,NSS=1 -70 MCS1,NSS=1 -85 MCS7,NSS=1 -68 MCS2,NSS=1 -82 MCS8,NSS=1 -66 MCS3,NSS=1 -79 MCS9,NSS=1 -63 MCS4,NSS=1 -76 MCS0,NSS=2 -83 MCS5,NSS=1 -71 MCS9,NSS=2 -58 Data Rate Spec.(dBm) Data Rate Spec.(dBm) HE0 -90 HE6 -73 HE1 -88 HE7 -70 HE2 -86 HE8 -68 HE3 -83 HE9 -64 HE4 -79 HE10 -59 HE5 -75 HE11 -57 Data Rate Spec.(dBm) Data Rate Spec.(dBm) HE0 -90 HE6 -73 HE1 -88 HE7 -70 HE2 -86 HE8 -68 HE3 -83 HE9 -64 HE4 -79 HE10 -60 HE5 -75 HE11 -55 Data Rate Spec.(dBm) Data Rate Spec.(dBm) HE0 -90 HE6 -73 HE1 -88 HE7 -70 HE2 -86 HE8 -68 HE3 -83 HE9 -61 HE4 -79 HE10 -57 HE5 -75 HE11 -53 802.11a/n/ac/ax : -30 dBm AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 13 http://www.ampak.com.tw AP6275P Datasheet 4. Bluetooth Specification 4.1 Bluetooth Specification Conditions : VBAT=3.3V ; VDDIO=1.8V ; Temp:25°C Feature Description General Specification Bluetooth Standard BDR、EDR(2、3Mbps)、LE(1Mbps)、LE2(2Mbps) Host Interface UART Frequency Band 2402 MHz ~ 2480 MHz Number of Channels 79 channels for classic、40 channels for BLE Modulation GFSK, π/4-DQPSK, 8DPSK RF Specification Output Power , tolerance ± 1.5 dB CL1 (dBm) BDR Output Power 8 EDR Output Power 6 BLE Output Power 7 Sensitivity, tolerance ± 1.5 dB Sensitivity @ BER=0.1% for GFSK (1Mbps) -88 dBm Sensitivity @ BER=0.01% for π/4-DQPSK (2Mbps) -91 dBm Sensitivity @ BER=0.01% for 8DPSK (3Mbps) -85 dBm Sensitivity @ BER=0.01% for LE (1Mbps) -90 dBm Sensitivity @ BER=0.01% for 2LE (2Mbps) -91 dBm GFSK (1Mbps):-20dBm Maximum Input Level π/4-DQPSK (2Mbps) :-20dBm 8DPSK (3Mbps) :-20dBm Note*：The Bluetooth BDR output power is able to be configured by firmware (hcd file). AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 14 http://www.ampak.com.tw AP6275P Datasheet 5. Pin Definition 5.1 Pin Outline 5.2 Pin Assignment NO Name Type Description 1 GND － Ground connections 2 WL_ANT0 I/O RF I/O port0 3 GND － Ground connections 4 GND － Ground connections 5 GND － Ground connections 6 GND － Ground connections 7 GND － Ground connections 8 GND － Ground connections 9 WL_ANT1 I/O RF I/O port1 10 GND － Ground connections 11 GND － Ground connections 12 PCIE_PREST_L I PCIe host indication to reset the device 13 XTAL_XOP I Xtal oscillator input 14 XTAL_XON O Xtal oscillator output 15 WL_REG_ON I Low asserting reset for WiFi core AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 15 http://www.ampak.com.tw AP6275P Datasheet 16 WL_HOST_WAKE O WLAN to wake-up HOST 17 NC － Floating (Don’t connected to ground) 18 NC － Floating (Don’t connected to ground) 19 BT_PCM_OUT O PCM Data output 20 BT_PCM_IN I PCM data input 21 BT_PCM_SYNC I/O PCM sync signal 22 BT_PCM_CLK I PCM clock 23 GND － Ground connections 24 PCIE_PME_L OD PCI power management event output 25 CBUCK_0P9 I Internal Buck voltage generation pin 26 CSR_VLX O Internal Buck voltage generation pin 27 GND － Ground connections 28 ASR_VLX O Internal Analog Buck voltage generation pin 29 ABUCK_1P12 I Internal Analog Buck voltage generation pin 30 GND － Ground connections 31 LPO_IN I External Low Power Clock input (32.768KHz) 32 GND － Ground connections 33 PCIE_RCLK_N I PCI Express differential clock input-Negative 34 VDDIO P I/O Voltage supply input 35 PCIE_RCLK_P I PCI Express differential clock input-Positive 36 VBAT P Main power voltage source input 37 PCIE_CLKREQ_L OD PCIe clock request 38 BT_REG_ON I Low asserting reset for Bluetooth core 39 GND － Ground connections 40 BT_UART_TXD O Bluetooth UART serial data output 41 BT_UART_RXD I Bluetooth UART serial data input 42 BT_UART_RTS_N O Bluetooth UART request to send 43 BT_UART_CTS_N I Bluetooth UART clear to send 44 PCIE_RX_N I PCI Express receive data-Negative 45 PCIE_RX_P I PCI Express receive data-Positive 46 PCIE_TX_N O PCI Express transmit data-Negative 47 PCIE_TX_P O PCI Express transmit data-Positive 48 NC － Floating (Don’t connected to ground) 49 BT_WAKE I HOST wake-up Bluetooth device 50 BT_HOST_WAKE O Bluetooth device to wake-up HOST AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 16 http://www.ampak.com.tw AP6275P Datasheet 6. Dimensions 6.1 Module Dimensions Note, X = 1.55mm AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 17 http://www.ampak.com.tw AP6275P Datasheet 6.2 Recommended footprint  Solder paste layer design is generally the same as recommended footprint. (錫膏層設計通常建議和焊墊尺寸相同)  If soldering quality with good wetting on upright side is essential for PQC, how to optimize the aperture design in the stencil to adjust the amount of solder paste would be crucial. In addition, a kind of stencil design with stepped thickness in partial area would be considered if the thickness of stencil is about 0.1mm or thinner. Please optimize the stencil design by manufacture engineer or contact AMPAK FAE for assistance. (如果模組吃錫品質考量側面爬錫，如何優化鋼網開孔設計以調整適當的錫膏量是非常重要的。 尤其鋼網的厚度大約是 0.1mm 或更薄時，可考慮局部加厚鋼網的設計。請諮詢製程工程師以優 化鋼網的設計,或是聯絡正基科技技術支持團隊). AMPAK Technology Inc. 3F., No.15-1, Zhonghua Rd., Hukou Township, Hsinchu County, Taiwan, 30352 18 http://www.ampak.com.tw AP6275P Datasheet 7. External clock reference External LPO signal characteristics Parameter Specification Units Nominal input frequency 32.768 kHz Frequency accuracy +/-25 ppm Duty cycle 30 - 70 % 1.8±0.09 V Square-wave or sine-wave - Input signal amplitude Signal type  Input impedance >100k