Thin Film Chip Fuse
Document No
TCFS-XX0S004I
Issued date
2012/11/26
Page
1/20
1. Scope
This specification applies for the fuse series of thin film chip fuse made by TA-I.
Over Coat
2. Construction
Conductor
Sn Plating
Ceramic Substrate
Fuse Element
Cu / Ni Plating
3. Type Designation
CFS
06
V5
T
R50
2
Rated
Voltage
Chip Fuse
Packaging
Size
V6:63V
04:0402(1005)
06:0603(1608)
12:1206(3216)
V5:50V
T: Paper Tape (5K/10K)
Rated
Current
R50:0.5A
1R0:1A
V3:32V
TA-I TECHNOLOGY CO., LTD
Thin Film Chip Fuse
Document No
TCFS-XX0S004I
Issued date
2012/11/26
Page
2/20
4. Dimensions
Unit: mm
Type
(Inch Size code)
CFS04
(0402)
CFS06
(0603)
CFS12
(1206)
Dimensions (mm)
L
W
C
d
t
1.0±0.1
0.52±0.05
0.2±0.1
0.25±0.1
0.35±0.05
1.6±0.1
0.8±0.10
0.3±0.2
0.35±0.2
0.45±0.10
3.1±0.1
1.55±0.10
0.5±0.3
0.50±0.2
0.60±0.10
5. Applications and ratings
Part
Designation
CFS04V3TR50
CFS04V3TR80
CFS04V3T1R0
CFS04V3T1R25
CFS04V3T1R50
CFS04V3T1R60
CFS04V3T2R0
CFS04V3T2R50
CFS04V3T3R0
CFS04V3T3R15
CFS04V3T4R0
Rated
Marking
Current
F
K
L
M
P
N
S
T
3
U
W
0.50A
0.80A
1.00A
1.25A
1.50A
1.60A
2.00A
2.50A
3.00A
3.15A
4.00A
Fusing
Time
Open within
5sec.at250%
rated current
Resistance
(mΩ)
Body
Rated Breaking
Temperature
Voltage Capacity
rising
Tolerance±25%
300
78
75
44
34.5
29.5
23
18
15
14
10
DC 32V
DC32V
35A
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