B5819WL

B5817WL THRU B5819WL SCHOTTKY BARRIER RECTIFIERS PINNING Features PIN • Metal silicon junction, majority carrier conduction • Guarding for overvoltage protection DESCRIPTION 1 Cathode 2 Anode 1 2 • Low power loss, high efficiency • High current capability • low forward voltage drop • High surge capability • For use in low voltage, high frequency inverters, Weight：17mg，0.0006 oz Simplified outline SOD-123FL and symbol free wheeling, and polarity protection applications Maximum Ratings and Electrical characteristics Ratings at 25 °C ambient temperature unless otherwise specified. Symbols B5817WL B5818WL B5819WL Units Maximum Repetitive Peak Reverse Voltage V RRM 20 30 40 V Maximum RMS voltage V RMS 14 21 28 V Maximum DC Blocking Voltage V DC 20 30 40 V Parameter Maximum Average Forward Rectified Current I F(AV) 1 A Peak Forward Surge Current, 8.3ms Single Half Sine-wave Superimposed On Rated Load (JEDEC method) at TL = 70°C I FSM 25 A Maximum Instantaneous Forward Voltage at 1 A Maximum Instantaneous Forward Voltage at 3.1 A VF Maximum Instantaneous Reverse Current at TA = 25°C Rated DC Reverse Voltage TA = 100°C IR 1 10 mA RθJA RθJL 50 15 °C/W Cj 110 pF T j , T stg -55 ~ +125 °C 0.375" (9.5 mm) Lead Length at T L = 90°C Typical Thermal Resistance Typical Junction Capacitance Storage and Operating Junction Temperature Range REV.08 1 of 4 0.45 0.75 0.55 0.875 0.6 0.9 V B5817WL THRU B5819WL Fig.2 Typical Reverse Characteristics Instaneous Reverse Current ( μA) Fig.1 Forward Current Derating Curve Average Forward Current (A) 1.2 1.0 0.8 0.6 0.4 Single phase half-wave 60 Hz resistive or inductive load 0.2 0.0 20 60 40 80 100 120 140 10 4 10 3 T J =125°C 10 2 T J =75°C 10 1 T J =25°C 10 0 0 Lead Temperature (°C) 80 100 500 5° C =2 TJ 12 5°C 0.5 Junction Capacitance ( pF) 1.0 TJ = 0.2 0.1 0 30 0.1 0.2 0.3 0.4 0.5 0.6 100 50 20 10 0.1 10 1 100 Instaneous Forward Voltage (V) Reverse Voltage (V) Fig.5 Maximum Non-Repetitive Peak Forward Surage Current Fig.6- Typical Transient Thermal Impedance 8.3 ms Single Half Sine Wave (JEDEC Method) 25 20 15 10 05 00 1 200 0.7 Transient Thermal Impedance（ °C /W） Instaneous Forward Current (A) Peak Forward Surage Current (A) 60 Fig.4 Typical Junction Capacitance Fig.3 Typical Forward Characteristic 10 100 Number of Cycles at 50Hz REV.08 40 20 Percent of Rated Peak Reverse Voltage（%） 100 10 1 0.1 0.01 0.1 1 10 t, Pulse Duration（sec） 2 of 4 100 B5817WL THRU B5819WL PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD123FL ∠ALL ROUND C A ∠ALL ROUND VM D E A g Top View mil Bottom View A C D E e g HE max 1.1 0.20 2.9 1.9 1.1 0.9 3.8 min 0.9 0.12 2.6 1.7 0.8 0.7 3.5 max 43 7.9 114 75 43 35 150 min 35 4.7 102 67 31 28 138 UNIT mm g pad e E A pad HE ∠ 7° The recommended mounting pad size Marking 2.0 (79) 1.2 (47) Type number 1.2 (47) 1.2 (47) Unit： mm (mil) REV.08 3 of 4 Marking code B 5817WL SJ B 5818WL SK B 5819WL SL B5817WL THRU B5819WL Recommended condition of flow soldering 300 Preliminary Heating Soldering Cooling (in air) Temperature of Soldering (°C) 265°C 250 245°C 200 150 120°C 100 100°C 50 0 2 to 5 min more than 1 min less than 10s R ecommended condition of reflow soldering Temperature of Soldering (°C) 300 Peak Temperature 245 to 260°C, 10s max. 250 Reflow Heating Rate 1 to 5°C / s 200 150 100 50 Pre Heating Rate 1 to 5°C / s Preliminary Heating 130 to 170°C, 50 to 120s Soldering 230°C 20 to 30s Cooling more than 60s 0 2 times max. Recommended peak temperature is over 245 °C. If peak temperature is below 245 °C, you may adjust the following parameters; time length of peak temperature (longer), time length of soldering (longer), thickness of solder paste (thicker) • Condition of hand soldering Temperature: 320°C Time: 3s max. Times: one time • Remark: Lead free solder paste (96.5Sn/3.0Ag/0.5Cu) REV.08 4 of 4