SRV05-4-N

SRV05-4-N ESD Protection Diode Array »Features ■ 45Watts peak pulse power (tp = 8/20μs) ■ SOT23-6 package ■ Solid-state silicon-avalanche technology ■ Low clamping voltage ■ Low leakage current ■ Low capacitance (Cj=0.3pF typ. IO to IO) ■ Protection one data/power line to: ■ IEC 61000-4-2 ±12kV contact ±15kV air ■ IEC 61000-4-4 (EFT) 40A(5/50ns) ■ IEC 61000-4-5 (Lightning) 3.5A(8/20μs) »Applications »Mechanical Data ■ Ethernet ■ SOT23-6 package ■ Digital Visual Interface (DVI) ■ Molding compound flammability rating: UL 94V-0 ■ USB2.0 ■ Packaging: Tape and Reel ■ Notebook and PC Computers ■ RoHS/WEEE Compliant »Schematic & PIN Configuration Pin 5 Pin 1 Pin 4 Pin 3 Pin 6 I/O 1 6 I/O GND Vcc I/O 3 4 I/O GND Revision 2018 www.born-tw.com 1/4 SRV05-4-N »Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power ( tp =8/20μs) PPP 45 Watts Peak Pulse Current ( tp =8/20μs )(note1) Ipp 3.5 A VESD 15 12 kV Lead SolderingTemperature TL 260(10seconds) ℃ Junction Temperature TJ -55 to + 125 ℃ StorageTemperature Tstg -55 to + 125 ℃ ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2(Contact) »Electrical Characteristics Parameter Symbol Reverse Stand-Off Voltage Conditions Min Typical Max Units 5.0 V 6.8 8.5 V 50 500 nA 3.5 A V VRWM VBR IT=1mA Reverse LeakageCurrent IR VRWM=5V,T=25℃ Peak Pulse Current IPP tp =8/20μs Clamping Voltage VC IPP=3.5A,tp=8/20μs 10 13 VR = 0V, f = 1MHz IO to IO 0.2 0.25 VR = 0V, f =1MHz IO to GND 0.36 0.5 Reverse BreakdownVoltage Junction Capacitance Cj 6 pF »Electrical Parameters (TA = 25°C unless otherwisenoted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP V RWM IR V BR IT I IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ V RWM VC VBR VRWM Breakdown Voltage @ IT IT IR IR IT VRWM VBR VC V Test Current IPP Note:. 8/20μs pulsewaveform. Revision 2018 www.born-tw.com 2/4 SRV05-4-N »Typical Characteristic Curves Fig.1 Peak Pulse Power RatingCurve Fig.2 Pulse DeratingCurve 110 Peak Pulse Power –PPP(KW) 10 1 45w 8/20μs waveform 0.1 0.01 0.1 1 10 100 Pulse Duration tp (μs) 1000 Fig.3 PulseWaveform-8/20μs 120 100%IPP , 8μS 150 100% 90% 30ns 80 50%IPP, 20μS e-t 60 Percent of IPP Percent of IPP 25 50 75 100 1 Ambient Temperature—TA(℃) Fig.4 PulseWaveform-ESD(IEC61000-4-2) 100 40 20 0 100 80 r o ) PP (P 60 r e w 40 P o d 20 te R a 0 0 60ns 10% 0 5 10 15 20 25 30 tr 0.7 to 1ns 0 30 Time (μs) 60 Time (ns) Fig.5 Eye Diagram - HDMI mask at 3.4Gbpsper channel Fig.6 Insertion Loss S21 - I/O toGND 2 2.5GHz @ -1dB Horizontal: 50 ps/div Vertical: 200 mV/div Insertion Loss (dB) 0 -2 -4 4GHz @ -3dB -6 -8 -10 100k 1M 10M 100M 1G 10G Frequency (Hz) Revision 2018 www.born-tw.com 3/4 SRV05-4-N »Outline Drawing – SOT23-6 DIMENSIONS PACKAGE OUTLINE INCHES MIN MAX MILLIMETER MIN MAX A 0.041 0.049 1.050 1.250 A1 0.000 0.004 0.000 0.100 A2 0.041 0.045 1.050 1.150 D 0.111 0.119 2.820 3.020 E 0.059 0.067 1.500 1.700 E1 0.104 0.116 2.650 2.950 b 0.012 0.020 0.300 0.500 SYMBOL E E1 b SEE DETAIL A e e e1 D 0.2 A 0.950(BSC) e1 0.071 0.079 1.800 2.000 L 0.012 0.024 0.300 0.600 θ 0 ｏ 8 ｏ 0 ｏ 8 ｏ θ A2 0.037(BSC) c L A1 1.0 0.039 1.4 3.6 0.055 0.141 1.9 0.074 0.7 0.028 0.95 0.037 Notes 1. This land pattern is for reference purposes only consult your manufacturing group to ensure your company's manufacturing guidelines are met. Reference ipc-sm-782a.. »Marking V5L »Ordering information Order code SRV05-4-N Revision 2018 Package SOT23-6 Base qty 3k www.born-tw.com Delivery mode Tape and reel 4/4