AGM308S
100% EAS Guaranteed
Green Device Available
Super Low Gate Charge
Excellent CdV/dt effect decline
Advanced high cell density Trench
technology
Product Summary
BVDSS
RDSON
30V
ID
6.5mΩ
13A
SOP-8 Pin Configuration
D
DD
Description
AGM308S is the high cell density trenched
N-ch MOSFETs, which provide
excellentRDSON and gate charge for most
of the synchronous buck converter
applications.
S G
SS
Package Marking and Ordering Information
Device
Device Marking
AGM308S
Device Package
AGM308S
Reel Size
3000
---mm
---mm
SOP-8
Quantity
Tape width
●Absolute Maximum Ratings(TC =25℃)
Parameter
Symbol
Rating
Unit
VDS
30
V
VGS
±20
V
ID
13
A
IDM
32
A
PD@TC=25℃
3.1
W
PD@TA=25℃
0.69
W
TJ
-55 to 150
℃
Storage Temperature
TSTG
-55 to 150
℃
Single Pulse Avalanche
Energy@L=0.1mH
EAS
43
mJ
Avalanche Current@L=0.1mH
IAS
28
A
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
②
①
Total Power Dissipation
②
Total Power Dissipation
Operating Junction Temperature
●Thermal resistance
Symbol
Min.
Typ.
Max.
Unit
Thermal resistance, junction - case②
RthJC
-
-
40
°C/W
Thermal resistance, junction - ambient
RthJA
-
-
180
°C/W
Soldering temperature, wavesoldering for 10s
Tsold
-
-
265
°C
Parameter
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1
VER2.6
AGM308S
●Electronic Characteristics
Parameter
Symbol
Condition
Min.
Drain-Source Breakdown
Voltage
BVDSS
VGS =0V,ID =250uA
30
Gate Threshold Voltage
VGS(TH)
VGS =V DS, ID =250uA
1.2
Drain-Source Leakage Current
IDSS
Gate- Source Leakage Current
IGSS
Static Drain-source On
Resistance
RDS(ON)
Forward Transconductance
gFS
Typ
Max.
Unit
V
2.5
V
VDS=30V, VGS =0V
1.0
uA
VGS=±20V ,VDS =0V
±100
nA
VGS=10V, ID=12A
6.5
VGS=4.5V, ID=6A
10
VDS =25V, ID=10A
9
9.5
mΩ
14
mΩ
s
●Electronic Characteristics
Parameter
Symbol
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Condition
f = 1MHz
Min.
Typ
Max.
-
980
-
205
-
-
120
-
Unit
pF
Gate Charge characteristics(Ta= 25℃)
Parameter
Symbol
Condition
Min.
Typ
Max.
Total gate charge
Qg
VDD =25V
-
12
-
Gate - Source charge
Qgs
ID = 8A
-
4
-
Gate - Drain charge
Qgd
VGS = 10V
-
6
-
Unit
nC
Note: ① Pulse Test : Pulse width ≤ 300μs, Duty cycle ≤ 2% ;
② Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom
layer 1inch square copper plate;
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2
VER2.6
AGM308S
Fig.2 Typical output Characteristics
Fig.1 Power Dissipation
VGS=10V
VGS=4.5V
Fig.3 Threshold Voltage V.S Junction Temperature
Fig.6 On-Resistance V.S Junction Temperature
Fig.5 On-Resistance VS Gate Source Voltage
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Fig.4 Resistance V.S Drain Current
3
VER2.6
AGM308S
AGM310S
Fig.8 Gate Charge Waveform
Fig.7 Switching Time Measurement Circuit
Fig.9 Switching Time Measurement Circuit
Fig.10 Gate Charge Waveform
Fig.12 Avalanche Waveform
Fig.11 Avalanche Measurement Circuit
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4
VER2.6
AGM308S
●Dimensions(SOP8)
SYMBOL
min
A
A1
TYP
max
SYMBOL
min
max
4.80
5.00
C
1.30
1.50
0.37
0.47
C1
0.55
0.75
A2
1.27
C2
0.55
0.65
A3
0.41
C3
0.05
0.20
0.19
B
5.80
6.20
C4
B1
3.80
4.00
D
B2
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5.00
D1
5
0.20
0.23
1.05
0.40
0.62
VER2.6
AGM308S
Disclaimers:
Information furnished in this document is believed to be accurate and reliable.
However,
Shenzhen Core Control Source Semiconductor Co., Ltd. assumes no responsibility for
the consequences of
use without consideration for such information nor use beyond it.
Information mentioned in this document is subject to change without notice, apart from
that
when an agreement is signed, Shenzhen core control source complies with the
agreement.
Products and information provided in this document have no infringement of patents.
Shenzhen Core Control Source Semiconductor Co., Ltd. assumes no responsibility for
any infringement of other rights of third parties which may
result from the use of such products and information.
This document is the first version which is made in 12-Apr-21. This document
supersedes and
replaces all information previously supplied.
is a registered trademark of Shenzhen Core Control Source
Semiconductor Co., Ltd.
Copyright ©2017 Shenzhen Core Control Source Semiconductor Co., Ltd. Printed All
rights reserved.
www.agm-mos.com
6
VER2.6
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