AGM12T05A
● General Description
« 100% EAS Guaranteed
Product Summary
« Green Device Available
« Super Low Gate Charge
« Excellent CdV/dt effect decline
BVDSS
RDSON
« Advanced high cell density Trench technology
120V
5.5mΩ
« Level: MSL1
« IEC 61249 standard
PRPAK5X6 Pin Configuration
ID
100A
● Features
AGM12T05A designed by the trench processing
techniques to achieve extremely low on-resistance.
Additional features of this design are a 175°C
junction operating temperature, fast switching speed
and improved repetitive avalanche rating . These
features combine to make this design an
extremely efficient and reliable device for use in
Motor applications and a wide variety of other
applications.
Package Marking and Ordering Information
Device Marking
AGM12T05A
Device
Device Package
Reel Size
Tape width
AGM12T05A
DFN5*6
---mm
---mm
Quantity
3000
Table 1. Absolute Maximum Ratings (TA=25℃)
Symbol
Parameter
Value
Unit
120
V
+20 / -20
V
Drain Current-Continuous(Tc=25℃) (Note 1)
100
A
Drain Current-Continuous(Tc=100℃)
63
A
Drain Current-Continuous@ Current-Pulsed (Note 2)
400
A
Maximum Power Dissipation(T c=25℃)
150
W
1.7
W
240
mJ
VDS
Drain-Source Voltage (VGS=0V)
VGS
Gate-Source Voltage (VDS=0V)
ID
IDM (pluse)
PD
Maximum Power Dissipation(T c=100℃)
EAS
TJ,TSTG
Avalanche energy (Note 3)
-55 To 175
℃
Typ
Max
Unit
Operating Junction and Storage Temperature Range
Table 2. Thermal Characteristic
Symbol
Parameter
RθJA
Thermal Resistance Junction-ambient (Steady State)1
---
63
℃/W
RθJC
Thermal Resistance Junction-Case1
---
1
℃/W
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1
REV2.6
AGM12T05A
Table 3. Electrical Characteristics (TA=25℃unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
On/Off States
120
BVDSS
Drain-Source Breakdown Voltage
VGS=0V ID=250μA
IDSS
Zero Gate Voltage Drain Current
VDS=100V,V GS=0V
1
μA
IGSS
Gate-Body Leakage Current
VGS=±20V,VDS=0V
±100
nA
2.5
V
VGS(th)
gFS
RDS(ON)
Gate Threshold Voltage
VDS=VGS,ID=250μA
Forward Transconductance
Drain-Source On-State Resistance
1.2
V
1.6
VDS=10V,ID=10A
10
S
VGS=10V, ID=20A
5.5
7.0
mΩ
VGS=4.5V, ID=15A
7.5
10
mΩ
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VDS=60V,VGS=0V,
F=1MHZ
VGS=0V, VDS=0V,f=1.0MHz
3200
pF
840
pF
31
pF
1.7
Ω
20
nS
13
nS
nS
Switching Times
td(on)
Turn-on Delay Time3 , 4
VGS=10V, VDD=50V,
ID=1A,RG=3.3
tr
Turn-on Rise Time3 , 4
td(off)
Turn-Off Delay Time
36
tf
Turn-Off Fall Time
18
nS
Qg
Total Gate Charge
88
nC
Qgs
Gate-Source Charge
10
nC
Qgd
Gate-Drain Charge
24
nC
VGS=60V, VDS=10V, ID=20A
Source-Drain Diode Characteristics
ISD
Source-Drain Current(Body Diode)
100
A
VSD
Forward on Voltage
VGS=0V,IS=20A
1
V
trr
Reverse Recovery Time
IF=-15A , dI/dt=100A/µs ,
43
ns
Qrr
Reverse Recovery Charge
·TJ=25℃
88
nc
Note :
1. Repetitive Rating : Pulsed width limited by maximum junction temperature.
2. VDD=50V,VGS=10V,L=0.1mH,IAS=55A.,RG=25Ω,Starting TJ=25℃.
3. The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%.
4. Essentially independent of operating temperature.
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REV2.6
AGM12T05A
4.5V
150
25
4V
10V
ID=20A
120
20
90
15
RDS(ON) (mΩ)
ID (A)
3.5V
60
Vgs=3V
125°C
10
25°C
5
30
0
0
0
0.5
1
1.5
2
2.5
2
3
4
6
10
VGS (V)
VDS (V)
Fig.1
8
Typical Output Characteristics
Fig.2
On-Resistance vs. Gate-Source Voltage
2
15
ID=20A
1.8
VGS=4.5V
9
RDS(ON) (mΩ)
Normalized On-Resistance
12
6
VGS=10V
3
1.6
VGS=10V
1.4
VGS=4.5V
1.2
1
0
0.8
0
5
10
15
20
0
25
ID (A)
Fig.3
50
75
100
125
150
Temperature (°C)
Fig.4
On-Resistance vs. Drain
Current and Gate Voltage
Normalized On-Resistance
vs. Junction Temperature
15
1.E+02
VDS=5V
12
1.E+01
9
ID(A)
IS (A)
25℃
125℃
6
125°C
25°C
1.E+00
3
0
1.E-01
1
1.5
2
2.5
3
3.5
0.2
Fig.5
Typical Transfer Characteristics
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0.4
0.6
0.8
1.0
VSD (V)
VGS(V)
Fig.6
3
Typical Source-Drain Diode Forward Voltage
REV2.6
AGM12T05A
10000
10
VDS=60V
ID=20A
Ciss
8
Capacitance (pF)
1000
VGS (V)
6
4
Coss
100
Crss
10
2
0
1
0
10
20
30
40
50
0
20
40
80
100
VDS (V)
Qg (nC)
Fig.8 Typical Capacitance vs.
Drain-to-Source Voltage
Fig.7 Typical Gate-Charge vs.
Gate-to-Source Voltage
1000
120
RDS(ON) limited
Current rating ID(A)
100µs
10
DC
1ms
10ms
1
10s
TJ(Max)=150°C
TC=25°C
Silicon Limited
100
10µs
100
ID (Amps)
60
0.1
80
60
Package Limited
40
20
0
0.01
0.01
0.1
1
10
100
0
1000
VDS (V)
25
50
75
100
125
150
TAmbient(℃)
Fig.10 Maximun Drain Current vs. Case Temperature
Fig.9 Maximum Safe Operating Area
Duty=Ton/T
Peak TJ=TC+PDM.ZθJC.RθJC
RθJC=1℃/W
1
Duty=0.5
ZθJA Normalized Transient
Thermal Resistance
0.3
0.1
0.05
0.1
0.01
0.03
0.01
single pulse
0.001
1E-05
0.0001
0.001
0.01
0.1
1
Pulse Width (s)
Fig.11 Normalized Maximum Transient Thermal Impedance, Junction-to-Ambient
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REV2.6
H
D2
D
L1
AGM12T05A
k
L
E2
E
E1
L2
D1
e
b
A2
d
SYMBOL
A
MILLIMETER
MIN
Typ.
MAX
0.900
1.000
1.100
A1
0.254 REF.
A
A1
A2
0~0.05
D
4.824
4.900
4.976
D1
3.910
4.010
4.110
D2
4.924
5.000
5.076
E
5.924
6.000
6.076
E1
3.375
3.475
3.575
E2
5.674
5.750
5.826
b
0.350
0.400
0.450
e
1.270 TYP.
L
0.534
0.610
0.686
L1
0.424
0.500
0.576
L2
1.800 REF.
k
1.190
1.290
1.390
H
0.549
0.625
0.701
1.100
d
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5
1.200
1.300
0.100
REV2.6
AGM12T05A
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequencesDo not consider the use of such
information or use beyond its scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the second version issued on October 10, 2021. This document
replaces andReplace all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
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6
REV2.6
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