AGM402A1
● General Description
Product Summary
The AGM402A1 combines advanced trench
MOSFET technology with a low resistance package
to provide extremely low RDS(ON) . This device is ideal
BVDSS
RDSON
ID
40V
2.3mΩ
140A
for load switch and battery protection applications.
● Features
PRPAK5X6 Pin Configuration
■ Advance high cell density Trench technology
■Low RDS(ON) to minimize conductive loss
■Low Gate Charge for fast switching
■Low Thermal resistance
●Application
■MB/VGA Vcore
■SMPS 2nd Synchronous Rectifier
■POL application
■BLDC Motor driver
Package Marking and Ordering Information
Device Marking
AGM402A1
Device
AGM402A1
Device Package
Reel Size
PDFN5*6
Tape width
--mm
Quantity
--mm
3000
Table 1. Absolute Maximum Ratings (TA=25℃)
Symbol
Parameter
VDS
Drain-Source Voltage (VGS=0V)
VGS
Gate-Source Voltage (VDS=0V)
Drain Current-Continuous(Tc=25℃) (Note 1)
ID
IDM (pluse)
Value
Unit
40
V
±20
V
140
A
98
A
Drain Current-Continuous@ Current-Pulsed (Note 2)
570
A
Maximum Power Dissipation(T c=25℃)
125
W
Maximum Power Dissipation(T c=100℃)
62
W
550
mJ
Drain Current-Continuous(Tc=100℃)
PD
EAS
TJ,TSTG
Avalanche energy (Note 3)
Operating Junction and Storage Temperature Range
-55 To 175
℃
Table 2. Thermal Characteristic
Symbol
RθJA
RθJC
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Parameter
Typ
Thermal Resistance Junction-ambient (Steady State)1
Thermal Resistance Junction-Case1
1
Max
Unit
---
62
℃/W
---
1.2
℃/W
VER2.4
AGM402A1
Table 3. Electrical Characteristics (TA=25℃unless otherwise noted)
Typical Characteristics
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
Static Electrical Characteristics @ Tj = 25°C (unless otherwise stated)
Drain-Source Breakdown Voltage
VGS=0V, ID=250μA
40
45
Zero Gate Voltage Drain Current
VDS=40V,VGS=0V
--
--
1
μA
Zero Gate Voltage Drain Current(Tj=125℃)
VDS=40V,VGS=0V
--
--
100
μA
IGSS
Gate-Body Leakage Current
VGS=±20V,VDS=0V
--
--
±100
nA
VGS(TH)
Gate Threshold Voltage
VDS=VGS,ID=250μA
1.0
1.7
2.5
V
RDS(ON)
Drain-Source On-State Resistance③
VGS=10V, ID=40A
--
2.3
3.1
mΩ
RDS(ON)
Drain-Source On-State Resistance③
VGS=4.5V, ID=20A
--
3.1
5
mΩ
V(BR)DSS
IDSS
--
V
Dynamic Electrical Characteristics @ T j= 25°C (unless otherwise stated)
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate Resistance
Qg
Total Gate Charge
4140
pF
405
pF
360
pF
2
Ω
VDS=20V,VGS=0V,
f=1MHz
f=1MHz
--
73
--
nC
-
15
--
nC
-
15
--
nC
--
13.7
--
nS
VDS=20V,ID=40A,
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VGS=10V
Switching Characteristics
t d(on)
Turn-on Delay Time
tr
Turn-on Rise Time
ID=40A,
-
6.1
--
nS
t d(off)
Turn-Off Delay Time
RG=3Ω,
-
50
--
nS
tf
Turn-Off Fall Time
-
10
--
nS
VDD=20V,
VGS=10V
Source- Drain Diode Characteristics@ Tj = 25°C (unless otherwise stated)
VSD
Forward on voltage
ISD=40A,VGS=0V
--
0.8
1.2
V
t rr
Reverse Recovery Time
Tj=25℃,Isd=30A,
--
18
--
nS
Qrr
Reverse Recovery Charge
VGS=0V
di/dt=500A/μs
40
nC
Notes 1.The maximum current rating is package limited.
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature
Notes 3.EAS condition: TJ=25℃,VDD=15V,VG=10V, RG=25Ω
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2
VER2.4
AGM402A1
ID, Drain-Source Current (A)
VGS(TH), Gate -Source Voltage (V)
Typical Characteristics
VDS, Drain -Source Voltage (V)
Tj - Junction Temperature (°C)
Fig1. Typical Output Characteristics
Normalized On Resistance
ID, Drain-Source Current (A)
Fig2. VGS(TH) Gate -Source Voltage Vs. Tj
Fig3. Typical Transfer Characteristics
Fig4. Normalized On-Resistance Vs. Temperature
ID - Drain Current (A)
Tj - Junction Temperature (°C)
ISD, Reverse Drain Current (A)
VGS, Gate -Source Voltage (V)
VSD, Source-Drain Voltage (V)
VDS, Drain -Source Voltage (V)
Fig5. Typical Source-Drain Diode Forward Voltage
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Fig6. Maximum Safe Operating Area
3
VER2.4
AGM402A1
C, Capacitance (pF)
VGS, Gate-Source Voltage (V)
Typical Characteristics
VDS , Drain-Source Voltage (V)
Qg -Total Gate Charge (nC)
Fig8. Typical Gate Charge Vs.Gate-Source Voltage
Thermal Resistance
ZθJc Normalized Transient
Fig7. Typical Capacitance Vs.Drain-Source Voltage
Pulse Width (s)
Fig9 . Normalized Maximum Transient Thermal Impedance
Fig10. Unclamped Inductive Test Circuit and waveforms
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Fig11. Switching Time Test Circuit and waveforms
4
VER2.4
AGM402A1
●Dimensions(DFN5×6)
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5
VER2.4
AGM402A1
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequencesDo not consider the use of such
information or use beyond its scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the second version issued on October 10, 2019. This document
replaces andReplace all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
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VER2.4
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