AGM405D
● General Description
Product Summary
The AGM405D combines advanced trench MOSFET
technology with a low resistance package to provide
extremely low RDS(ON) . This device is ideal for load
switch and battery protection applications.
BVDSS
RDSON
ID
40V
5.3mΩ
72A
● Features
■ Advance
high cell density Trench technology
■ Low
■ Low
RDS(ON) to minimize conductive loss
Gate Charge for fast switching
■ Low
Thermal resistance
TO-252 Pin Configuration
● Application
■ MB/VGA Vcore
■ SMPS
■ POL
2nd Synchronous Rectifier
application
■ BLDC
Motor driver
Package Marking and Ordering Information
Device Marking
AGM405D
Table 1.
Device
AGM405D
Device Package
Reel Size
Tape width
Quantity
TO-252
325mm
16mm
2500
Absolute Maximum Ratings (TA=25℃)
Symbol
Parameter
Value
Unit
VDS
Drain-Source Voltage (VGS=0V)
40
V
VGS
Gate-Source Voltage (VDS=0V)
±20
V
Drain Current-Continuous(Tc=25℃) (Note 1)
72
A
Drain Current-Continuous(Tc=100℃)
52
A
Drain Current-Continuous@ Current-Pulsed (Note 2)
220
A
Maximum Power Dissipation(Tc=25℃)
64
w
Maximum Power Dissipation(Tc=125℃)
--
w
Avalanche energy (Note 3)
--
mJ
ID
IDM (pluse)
PD
EAS
TJ,TSTG
Table 2.
Operating Junction and Storage Temperature Range
-55 To 175
℃
Thermal Characteristic
Symbol
Parameter
Typ
Max
Unit
RθJA
Thermal Resistance Junction-ambient (Steady State)1
---
50
℃/W
RθJC
Thermal Resistance Junction-Case1
---
2.4
℃/W
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1
VER2.5
AGM405D
Table 3.
Electrical Characteristics (TA=25℃unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
On/Off States
BVDSS
Drain-Source Breakdown Voltage
VGS=0V ID=250μA
40
--
--
V
IDSS
Zero Gate Voltage Drain Current
VDS=40V,VGS=0V
--
--
1.0
μA
IGSS
Gate-Body Leakage Current
VGS=±20V,VDS=0V
--
--
±100
nA
VGS(th)
Gate Threshold Voltage
VDS=VGS,ID=250μA
1.0
1.5
2.0
V
gFS
Forward Transconductance
VDS=5V,ID=20A
10
--
--
S
RDS(on)
Drain-Source On-State Resistance
VGS=10V, ID=30A
--
5.3
7.5
mΩ
VGS=4.5V, ID=20A
--
9
11
mΩ
--
1820
--
pF
--
285
--
pF
--
191
--
pF
--
--
--
Ω
--
6.5
--
nS
--
17
--
nS
--
30
--
nS
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VDS=20V,VGS=0V,
F=1MHZ
VGS=0V,
VDS=-0V,f=1.0MHz
Switching Times
td(on)
Turn-on Delay Time
tr
Turn-on Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
--
16
--
nS
Qg
Total Gate Charge
--
29
--
nC
Qgs
Gate-Source Charge
--
4.5
--
nC
Qgd
Gate-Drain Charge
--
6.4
--
nC
--
--
72
A
VGS=10V,VDS=20V
ID=30A,RGEN=3Ω
VGS=10V, VDS=20V,
ID=30A
Source-Drain Diode Characteristics
ISD
Source-Drain Current(Body Diode)
VSD
Forward on Voltage
VGS=0V,IS=30A
--
--
1.2
V
trr
Reverse Recovery Time
IF=20A , dI/dt=100A/µs ,
--
26
--
ns
Qrr
Reverse Recovery Charge
TJ=25℃
--
22
--
nc
Notes 1.The maximum current rating is package limited.
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature
Notes 3.Pulse Test: Pulse Width≤300μs, Duty Cycle≤0.5%
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VER2.5
AGM405D
Typical Performance Characteristics
Figure 2: Typical Transfer Characteristics
Figure1: Output Characteristics
150
ID (A)
120
10V 5V
100
VDS=5V
4V
80
6V
3.5V
90
25℃
60
40
60
125℃
VGS=3V
30
0
0
ID (A)
0.5
1.0
1.5
2.0
VDS(V)
2.5 3.0
3.5
4.0
4.5
20
VGS(V)
0
2
5.0
2.5
4
4.5
IS(A)
1.0E+02
15
3.5
Figure 4: Body Diode Characteristics
Figure 3:On-resistance vs. Drain Current
RDS(ON) (mΩ)
3
1.0E+01
12.5
VGS=4.5V
125℃
1.0E+00
10
1.0E-01
25℃
7.5
1.0E-02
VGS=10V
5.0
1.0E-03
2.5
0
1.0E-04
ID(A)
0
10
20
30
40
50
60
1.0E-05
0.0
Figure 5: Gate Charge Characteristics
10
8
0.2
0.4
VSD(V)
0.6
0.8
1.0
1.2
Figure 6: Capacitance Characteristics
VGS(V)
C(pF)
VDS=20V
ID=30A
10000
6
1000
Ciss
Coss
4
100
Crss
2
0
Qg(nC)
0
5
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10
15
20
25
10
0
30
3
VDS(V)
10
20
30
40
VER2.5
AGM405D
Figure 7: Normalized Breakdown Voltage vs.
Junction Temperature
Figure 8: Normalized on Resistance vs.
Junction Temperature
V BR(DSS)(V)
1.3
R DS (on)(mΩ)
2.5
1.2
2.0
1.1
1.5
1.0
1.0
0.9
0
-100
-50
0
Tj (℃ )
50
100
150
0.5
-100
200
Figure 9: Maximum Safe Operating Area
0
50
100
150
200
Figure 10: Maximum Continuous Drain Current
vs. Case Temperature
ID (A )
1000
Tj (℃ )
-50
80
Limited by R DS(on)
ID (A )
70
60
10μs
100μs
100
50
1ms
40
10
10ms
30
100ms
DC
20
T A=25 ℃
Single pulse
1
10
V DS (V)
0.1
0.1
1
10
0
100
0
25
50
Tc (℃ )
75
100
125
150
175
Figure.11: Maximum Effective
Transient Thermal Impedance, Junction-to-Case
(TO-251S,TO-252)
101
Zth J-C (℃ /W)
10-1
D=0.5
D=0.3
D=0.1
D=0.05
D=0.02
D=0.01
Single pulse
10-2
10-3 -6
10
10-5
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10-4
T P (s)
10-3
PDM
100
t1
t2
Notes:
1.Duty factor D=t1/t2
2.Peak T J=P DM *ZthJC +T C
10-2
10 -1
100
4
VER2.5
AGM405D
Figure1:Gate Charge Test Circuit & Waveform
Figure 2: Resistive Switching Test Circuit & Waveforms
Figure 3:Unclamped Inductive Switching Test Circuit & Waveforms
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5
VER2.5
AGM405D
Figure 4:Peak Diode Recovery dv/dt Test Circuit & Waveforms (For N-channel)
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6
VER2.5
AGM405D
● Dimensions
SYMBOL
min
max
SYMBOL
min
max
A
2.10
2.50
B
0.85
1.25
b
0.50
0.80
b1
0.50
0.90
b2
0.45
0.70
C
0.45
0.70
D
6.30
6.75
D1
5.10
5.50
E
5.30
6.30
e1
2.25
2.35
L1
9.20
10.60
e2
4.45
4.75
L2
0.90
1.75
L3
0.60
1.10
K
0.00
0.23
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7
VER2.5
AGM405D
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequencesDo not consider the use of such
information or use beyond its scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the second version issued on October 10, 2021. This document
replaces andReplace all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
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8
VER2.5
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