AGM420MBA
● General Description
The AGM420MBA combines advanced trench
MOSFET technology with a low resistance package
to provide extremely low RDS(ON) .
Product Summary
This device is ideal for load switch and battery
protection applications.
● Features
BVDSS
RDSON
ID
40V
18mΩ
7.6A
-40V
40mΩ
-6.8A
■ Advance high cell density Trench technology
SOP-8 Pin Configuration
■ Low RDS(ON) to minimize conductive loss
■ Low Gate Charge for fast switching
■ Low Thermal resistance
D1
● Application
D2
■ MB/VGA Vcore
G1
■ SMPS 2nd Synchronous Rectifier
■ POL application
■ BLDC Motor driver
G2
S1
S2
Package Marking and Ordering Information
Device Marking
Device
Device Package
Reel Size
Tape width
Quantity
AGM420MBA
AGM420MBA
SOP8
--mm
--mm
3000
Table 1. Absolute Maximum Ratings (TA=25℃)
Rating
Symbol
Parameter
N-Ch
P-Ch
Units
VDS
Drain-Source Voltage (VGS=0V)
40
-40
V
VGS
Gate-Source Voltage (VDS=0V)
±20
±20
V
7.6
-6.8
A
Drain Current-Continuous(Tc=100℃)
5.5
-4.2
A
Drain Current-Continuous@ Current-Pulsed (Note 2)
24
-18
A
Total Power Dissipation(Tc=25℃)
2.6
2.6
W
Total Power Dissipation(TA=100℃)
0.7
0.7
W
Avalanche energy (Note 3)
22
18
mJ
Drain Current-Continuous(Tc=25℃) (Note 1)
ID
IDM (pluse)
PD
EAS
TJ,TSTG
Operating Junction and Storage Temperature Range
-55 To 150
-55 To 150
℃
Table 2. Thermal Characteristic
Symbol
Parameter
Typ
Max
Unit
RθJA
Thermal Resistance Junction-ambient (Steady State)1
---
85
℃/W
RθJC
Thermal Resistance Junction-Case1
---
50
℃/W
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1
VER2.5
AGM420MBA
Table 3. N- Channel Electrical Characteristics (TA=25℃unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
On/Off States
BVDSS
Drain-Source Breakdown Voltage
VGS=0V ID=250μA
40
--
--
V
IDSS
Zero Gate Voltage Drain Current
VDS=40V,VGS=0V
--
--
1
μA
IGSS
Gate-Body Leakage Current
VGS=±20V,VDS=0V
--
--
±10
nA
VGS(th)
Gate Threshold Voltage
VDS=VGS,ID=250μA
1
1.6
2
V
gFS
Forward Transconductance
VDS=5V,ID=6A
15
--
--
S
RDS(on)
Drain-Source On-State Resistance
VGS=10V, ID=5A
--
16
24
mΩ
VGS=4.5V, ID=4A
--
21
35
mΩ
--
516
--
pF
--
82
--
pF
--
43
--
pF
--
--
--
Ω
--
4.5
--
nS
--
2.5
--
nS
--
14.5
--
nS
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VDS=20V,VGS=0V,
F=1MHZ
VGS=0V,
VDS=-0V,f=1.0MHz
Switching Times
td(on)
Turn-on Delay Time
tr
Turn-on Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
--
3.5
--
nS
Qg
Total Gate Charge
--
8.9
--
nC
Qgs
Gate-Source Charge
--
2.4
--
nC
Qgd
Gate-Drain Charge
--
1.4
--
nC
--
--
--
A
VGS=10V,VDS=15V,
RL=2.5Ω,RGEN=3Ω
VGS=20V, VDS=10V,
ID=6A
Source-Drain Diode Characteristics
ISD
Source-Drain Current(Body Diode)
VSD
Forward on Voltage
VGS=0V,IS=6A
--
0.8
1.2
V
trr
Reverse Recovery Time
IF=-25A , dI/dt=100A/µs ,
--
--
--
ns
Qrr
Reverse Recovery Charge
TJ=25℃
--
--
--
nc
Notes 1.The maximum current rating is package limited.
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature
Notes 3.EAS condition: TJ=25℃,VDD=15V,VG=10V, RG=25Ω
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VER2.5
AGM420MBA
Table 3. P-Channel Electrical Characteristics (TA=25℃unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
On/Off States
BVDSS
Drain-Source Breakdown Voltage
VGS=0V ID=-250μA
-40
--
--
V
IDSS
Zero Gate Voltage Drain Current
VDS=-30V,VGS=0V
--
--
-1
μA
IGSS
Gate-Body Leakage Current
VGS=±20V,VDS=0V
--
--
±100
nA
VGS(th)
Gate Threshold Voltage
VDS=VGS,ID=-250μA
-1.0
-1.5
-2.0
V
gFS
Forward Transconductance
VDS=5V,ID=-12A
--
5
--
S
RDS(on)
Drain-Source On-State Resistance
VGS=-10V, ID=-4A
--
42
53
mΩ
VGS=-4.5V, ID=-3A
--
52
70
mΩ
--
750
--
pF
--
105
--
pF
--
64
--
pF
--
--
--
--
--
--
nS
--
--
--
nS
--
--
--
nS
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VDS=-15V,VGS=0V,
F=1MHZ
VGS=0V,
VDS=-0V,f=1.0MHz
Ω
Switching Times
td(on)
Turn-on Delay Time
tr
Turn-on Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
--
--
--
nS
Qg
Total Gate Charge
--
12
--
nC
Qgs
Gate-Source Charge
--
2.4
--
nC
Qgd
Gate-Drain Charge
--
2.8
--
nC
--
--
-6.8
A
VGS=-10V,VDS=-15V,
ID=25A,RGEN=3Ω
VGS=-10V,
VDS=-25V, ID=-8A
Source-Drain Diode Characteristics
ISD
Source-Drain Current(Body Diode)
VSD
Forward on Voltage
VGS=0V,IS=-6A
--
--
-1.2
V
trr
Reverse Recovery Time
IF=-25A , dI/dt=100A/µs ,
--
32
--
ns
Qrr
Reverse Recovery Charge
TJ=25℃
--
21
--
nc
Notes 1.The maximum current rating is package limited.
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature
Notes 3.EAS condition: TJ=25℃,VDD=15V,VG=10V, RG=25Ω
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VER2.5
AGM420MBA
N- Channel Typical Electrical and Thermal Characteristics (Curves)
Rl
Vin
Vgs
Rgen
Normalized On-Resistance
Vdd
D
Vout
G
S
Figure 1:Switching Test Circuit
ton
tr
td(on)
toff
tf
td(off)
90%
VOUT
90%
INVERTED
10%
10%
90%
VIN
50%
50%
10%
PULSE WIDTH
ID- Drain Current (A)
ID- Drain Current (A)
Figure 2:Switching Waveforms
Vds Drain-Source Voltage (V)
Vgs Gate-Source Voltage (V)
Figure 3 Output Characteristics
Normalized On-Resistance
Rdson On-Resistance(mΩ)
Figure 4 Transfer Characteristics
TJ-Junction Temperature(℃)
ID- Drain Current (A)
Figure 5 Drain-Source On-Resistance
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Figure 6 Drain-Source On-Resistance
4
VER2.5
PD Power(W)
Rdson On-Resistance(mΩ)
AGM420MBA
TJ-Junction Temperature(℃)
Figure7 Rdson vs Vgs
Figure 8 Power Dissipation
Vgs Gate-Source Voltage (V)
Is- Reverse Drain Current (A)
Vgs Gate-Source Voltage (V)
Qg Gate Charge (nC)
Vds Drain-Source Voltage (V)
Figure 10 Source- Drain Diode Forward
ID- Drain Current (A)
C Capacitance (pF)
Figure 9 Gate Charge
Vds Drain-Source Voltage (V)
Vds Drain-Source Voltage (V)
Figure 11 Capacitance vs Vds
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Figure 12 Safe Operation Area
5
VER2.5
r(t),Normalized Effective
Transient Thermal Impedance
AGM420MBA
Square Wave Pluse Duration(sec)
Figure 13 Normalized Maximum Transient Thermal Impedance
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VER2.5
AGM420MBA
P- Channel Typical Electrical and Thermal Characteristics (Curves)
Fig.1 Power Dissipation Derating Curve
Fig.2 Typical output Characteristics
40.0
VGS=10V
1
Drain Current (A)
Power Dissipation Pd/Pd MAX.%
1.2
0.8
0.6
0.4
30.0
20.0
VGS=4.5V
10.0
0.2
0.0
0
0
0
50
100
150
Temperature (。C)
Fig.3 Threshold Voltage V.S Junction Temperature
-50
Junction Temperature
50
50
150
ON Resistance
40
-0.5
-1
30
20
10
-1.5
0
-2
0
10
20
30
40
Drain Current(A)
-2.5
Fig.5 On-Resistance VS Gate Source Voltage
50
Fig.6 On-Resistance V.S Junction Temperature
1.5
Normalized ON-Resistance
50
RDson(mΩ)
1
Fig.4 Resistance V.S Drain Current
0
Vgs(th )d
0.25
0.5
0.75
Drain-Source voltage (V)
200
40
30
20
3
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5
7
VGS( V )
1
0.5
9
-50
7
0
50
100
Temperature
150
VER2.5
AGM420MBA
Fig.7 Switching Time Measurement Circuit
Fig.8 Gate Charge Waveform
Fig.9 Switching Time Measurement Circuit
Fig.10 Gate Charge Waveform
Fig.11 Avalanche Measurement Circuit
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Fig.12 Avalanche Waveform
8
VER2.5
AGM420MBA
● Dimensions(SOP8)
SYMBOL
min
TYP
max
SYMBOL
min
max
A
4.80
5.00
C
1.30
1.50
A1
0.37
0.47
C1
0.55
0.75
A2
1.27
C2
0.55
0.65
A3
0.41
C3
0.05
0.20
0.19
B
5.80
6.20
C4
B1
3.80
4.00
D
B2
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5.00
D1
9
0.20
0.23
1.05
0.40
0.62
VER2.5
AGM420MBA
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequencesDo not consider the use of such
information or use beyond its scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the second version issued on October 10, 2019. This document
replaces andReplace all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
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10
VER2.5