PMEG4002AESF
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
10 March 2017
Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection in a DSN0603-2 (SOD962-2) leadless ultra small ChipScale Package (CSP).
2. Features and benefits
•
•
•
•
•
Average forward current IF(AV) ≤ 0.2 A
Reverse voltage VR ≤ 40 V
Low forward voltage typ. VF = 250 mV
Low reverse current typ. IR = 3 µA
Package height typ. 0.3 mm
3. Applications
•
•
•
•
•
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Ultra high speed switching
LED backlight for mobile application
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF
forward current
Tsp ≤ 145 °C; δ = 1
-
-
0.28
A
VR
reverse voltage
Tj = 25 °C
-
-
40
V
VF
forward voltage
IF = 200 mA; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
450
525
mV
IR
reverse current
VR = 40 V; Tj = 25 °C; pulsed
-
13
80
µA
PMEG4002AESF
Nexperia
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
5. Pinning information
Table 2. Pinning information
Pin
Symbol Description
1
K
2
A
Simplified outline
Graphic symbol
cathode[1]
1
1
anode
2
2
sym001
Transparent
top view
DSN0603-2 (SOD962-2)
[1]
The marking bar indicates the cathode.
6. Ordering information
Table 3. Ordering information
Type number
Package
PMEG4002AESF
Name
Description
Version
DSN0603-2
Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3
mm
SOD962-2
7. Marking
Table 4. Marking codes
Type number
Marking code
PMEG4002AESF
N
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage
Tj = 25 °C
-
40
V
IF
forward current
Tsp ≤ 145 °C; δ = 1
-
0.28
A
IF(AV)
average forward current
δ = 0.5 ; f = 20 kHz; Tamb ≤ 140 °C;
square wave
-
0.2
A
δ = 0.5 ; f = 20 kHz; Tsp ≤ 147 °C; square
wave
-
0.2
A
[1]
IFRM
repetitive peak forward
current
tp ≤ 1 ms; δ ≤ 0.25
-
1.2
A
IFSM
non-repetitive peak
forward current
tp = 8 ms; Tj(init) = 25 °C; square wave
-
3.5
A
Ptot
total power dissipation
Tamb ≤ 25 °C
[2]
-
405
mW
[3]
-
660
mW
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Nexperia
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
Symbol
Parameter
Conditions
[1]
Min
Max
Unit
-
1200
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1]
[2]
[3]
Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode 1 cm each.
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
Rth(j-sp)
[1]
[2]
[3]
[4]
[5]
thermal resistance
from junction to solder
point
Min
Typ
Max
Unit
[1] [2]
-
-
310
K/W
[1] [3]
-
-
190
K/W
[1] [4]
-
-
105
K/W
[5]
-
-
40
K/W
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a
significant part of the total power losses.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode 1 cm each.
Device mounted on a ceramic PCB, Al2O3, standard footprint.
Soldering point of anode tab.
aaa-006823
103
duty cycle =
Zth(j-a)
(K/W)
1
0.75
102
0.33
0.2
0.5
0.25
0.1
0.05
0.02
0
10
10-3
0.01
10-2
10-1
1
10
102
tp (s)
103
FR4 PCB, standard footprint
Fig. 1.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
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PMEG4002AESF
Nexperia
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
aaa-006824
103
Zth(j-a)
(K/W)
duty cycle =
102
0.75
1
0.5
0.25
0.33
0.1
0.2
0.02
0.01
0
0.05
10
10-3
10-2
10-1
1
102
10
103
tp (s)
2
FR4 PCB, mounting pad for anode and cathode 1 cm each
Fig. 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
102
aaa-006825
duty cycle = 1
0.75
Zth(j-a)
(K/W)
0.5
0.25
0.33
0.1
0.05
0.2
0.02
0.01
0
10
10-3
10-2
10-1
1
102
10
103
tp (s)
Ceramic PCB, Al2O3, standard footprint
Fig. 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V(BR)R
reverse reverse
breakdown voltage
IR = 100 µA; tp = 300 µs; δ = 0.02 ;
Tsp = 25 °C
40
-
-
V
VF
forward voltage
IF = 0.1 mA; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
120
185
mV
IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
180
245
mV
IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
250
320
mV
PMEG4002AESF
Product data sheet
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PMEG4002AESF
Nexperia
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
Symbol
Parameter
IR
reverse current
Cd
diode capacitance
trr
reverse recovery time
Conditions
Min
Typ
Max
Unit
IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
370
440
mV
IF = 200 mA; tp ≤ 300 µs; δ ≤ 0.02 ;
Tj = 25 °C
-
450
525
mV
VR = 10 V; Tj = 25 °C; pulsed
-
3
20
µA
VR = 40 V; Tj = 25 °C; pulsed
-
13
80
µA
VR = 1 V; f = 1 MHz; Tj = 25 °C
-
18
-
pF
VR = 10 V; f = 1 MHz; Tj = 25 °C
-
7
-
pF
IF = 500 mA; IR = 500 mA;
IR(meas) = 100 mA; Tj = 25 °C
-
1.25
-
ns
aaa-011755
1
IF
(A)
IR
(A)
(1)
10-1
aaa-011756
10-2
(1)
(2)
10-1
(2)
10-3
(3)
(3)
10-4
10-2
10-5
(4)
(5)
(4)
10-6
10-3
10-7
10-8
10-4
0
0.4
0.8
VF (V)
1.2
10-9
pulsed condition
(1) Tj = 150 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(5) Tj = −40 °C
Fig. 4.
Product data sheet
0
10
20
30
VR (V)
40
pulsed condition
(1) Tj = 150 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(5) Tj = −40 °C
Forward current as a function of forward
voltage; typical values
PMEG4002AESF
(5)
Fig. 5.
Reverse current as a function of reverse
voltage; typical values
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PMEG4002AESF
Nexperia
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
aaa-011757
35
Cd
(pF)
30
aaa-011758
0.16
(4)
PF(AV)
(W)
(3)
0.12
25
(2)
20
(1)
0.08
15
10
0.04
5
0
0
10
20
30
VR (V)
0
40
f = 1 MHz; Tamb = 25 °C
Fig. 6.
Fig. 7.
aaa-011759
PR(AV)
(W)
0.20
0.3
aaa-011760
(1)
0.2
(2)
(3)
0.10
(4)
(3)
0.1
(4)
0.05
0
10
20
30
VR (V)
0
40
Tj = 125 °C
(1) δ = 1
(2) δ = 0.9
(3) δ = 0.8
(4) δ = 0.5
Fig. 8.
IF(AV) (A)
0.3
(2)
0
0.2
Average forward power dissipation as a
function of average forward current; typical
values
IF(AV)
(A)
(1)
0.15
0.1
Tj = 150 °C
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1
Diode capacitance as a function of reverse
voltage; typical values
0.25
0
Average reverse power dissipation as a
function of reverse voltage; typical values
PMEG4002AESF
Product data sheet
0
25
50
75
100
125
150
175
Tamb (°C)
FR4 PCB, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 9.
Average forward current as a function of
ambient temperature; typical values
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PMEG4002AESF
Nexperia
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
aaa-011761
0.3
(1)
IF(AV)
(A)
0.2
(1)
IF(AV)
(A)
0.2
(2)
(3)
0.1
aaa-011763
0.3
(2)
(3)
0.1
(4)
0
0
25
50
75
(4)
100
125
0
150
175
Tamb (°C)
FR4 PCB, mounting pad for anode and cathode
2
1 cm each
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
0
25
50
75
100
125
150
175
Tamb (°C)
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 11. Average forward current as a function of
ambient temperature; typical values
Fig. 10. Average forward current as a function of
ambient temperature; typical values
aaa-011764
0.3
(1)
IF(AV)
(A)
0.2
(2)
(3)
0.1
(4)
0
0
25
50
75
100
125
150
175
Tsp (°C)
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 12. Average forward current as a function of solder point temperature; typical values
PMEG4002AESF
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40 V, 0.2 A low VF MEGA Schottky barrier rectifier
11. Test information
IF
IR(meas)
time
IR
trr
006aad022
Fig. 13. Reverse recovery definition
P
tcy
duty cycle δ =
tp
tcy
tp
t
006aac658
Fig. 14. Duty cycle definition
The current ratings for the typical waveforms are calculated according to the equations: IF(AV) = IM
× δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS defined as
RMS current.
PMEG4002AESF
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40 V, 0.2 A low VF MEGA Schottky barrier rectifier
12. Package outline
Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm
SOD962-2
L
1
2
b
e1
A
A1
E
D
(1)
0
0.5 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
max 0.32
nom
min 0.28
A1
0.03
b
D
E
e1
0.25 0.325 0.625
0.23 0.275 0.575
0.4
L
0.15
0.13
Note
1. The marking bar indicates the cathode.
Outline
version
sod962-2_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
13-07-12
13-07-17
SOD962-2
Fig. 15. Package outline DSN0603-2 (SOD962-2)
PMEG4002AESF
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40 V, 0.2 A low VF MEGA Schottky barrier rectifier
13. Soldering
Footprint information for reflow soldering of leadless ultra small package; 2 terminals
SOD962-2
0.85
0.6
0.2
0.2
0.2
0.4
0.4 0.28
0.256
0.16
0.256
0.676
occupied area
solder paste
solder lands
Dimensions in mm
14-06-12
16-02-01
sod962-2_fr
Fig. 16. Reflow soldering footprint for DSN0603-2 (SOD962-2)
14. Revision history
Table 8. Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PMEG4002AESF_S500 v.1
20150505
Product data sheet
-
-
PMEG4002AESF
Product data sheet
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PMEG4002AESF
Nexperia
40 V, 0.2 A low VF MEGA Schottky barrier rectifier
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Nexperia.
15. Legal information
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to information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Data sheet status
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
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warranted to be suitable for use in life support, life-critical or safety-critical
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Definition
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
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multiple devices. The latest product status information is available on
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PMEG4002AESF
Product data sheet
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability for
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
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Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
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In the event that customer uses the product for design-in and use in
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for such automotive applications, use and specifications, and (b) whenever
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40 V, 0.2 A low VF MEGA Schottky barrier rectifier
customer uses the product for automotive applications beyond Nexperia’
specifications such use shall be solely at customer’s own risk, and (c)
customer fully indemnifies Nexperia for any liability, damages or failed
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40 V, 0.2 A low VF MEGA Schottky barrier rectifier
16. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 2
9. Thermal characteristics............................................... 3
10. Characteristics............................................................ 4
11. Test information......................................................... 8
12. Package outline.......................................................... 9
13. Soldering................................................................... 10
14. Revision history........................................................10
15. Legal information..................................................... 11
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Nexperia B.V. 2017. All rights reserved
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Date of release: 10 March 2017
PMEG4002AESF
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