3ETH9-09.5

08 EC M U -M M EC I LT PANEL PCB SWITCHES 21 3C Multimec™ 3C High performance tactile switches • robust DISTINCTIVE FEATURES 10 x 10 mm; h=6.4 mm Excellent for over-mold and under overlay ENVIRONMENTAL SPECIFICATIONS • Sealing : IP67 according to IEC 60529 • Working and storage temperature : -40 °C/+160 °C (-40 °F to +320 °F) • Soldering : - through-hole : IEC 60068-2-20 8 - surface mount : JEDEC J-STD-020E ELECTRICAL SPECIFICATIONS • Recommended load : - Gold contacts : 0.5µ-50 mA 24 VDC - Silver contacts : 0.5-50 mA 24 VDC • Contact resistance : 10 MΩ MATERIALS • Contact bounce : 10,000,000 cycles • Terminals : SnCu + 2 µNI + 3 µSn100 The company reserves the right to change specifications without notice. All tolerance if not otherwise specified ±0.2 mm. • Max. actuation force : 100 N for 10 sec 1 PCB SWITCHES Multimec™ 3C 6,4 High performance tactile switches • robust 0,3 3C - SMD 14,0 10 0,3 6,4 10 Ø 6,5 0,8 7,62 14,0 Ø 6,5 0,8 6,4 7,62 3C - TH 0,3 Min 10,16 Max 12,5 Ø 6,5 10 6,4 10 0,8 0,3 Min 10,16 Max 12,5 7,62 Ø 6,5 5,6 7,62 10 11 0,8 3C - TH RAS 5,08 7,62 13,9 12 10 11 5,6 7,62 5,08 4,8 7,62 PCB LAYOUT & CIRCUIT DIAGRAM 3 ØØ1,0(3x) 0,9 4 3 2,5 +3 +3 2,5 Ø1,0(3x) 3 7,62 Ø1,0(3x) 3 7,62 2,54 2,54 7,62 7,62 Ø1,0(4x) 7,62 1 Ø1,0(4x) 7,62 7,62 5,08 7,62 5,08 4 7,62 1 5,08 +3 2,54 7,62 Ø1,0(4x) 1 2,54 432,5 12,50 1 2,54 Ø 0,9 1 7,62 5,08 4 4 3 2,5 7,62 7,62 7,62 3 4 Ø 0,93 2,5 1 5,08 4 12,507,62 -2 10, 16 1 -2 2,54 3 Ø 0,9 21 1 7,62 5,08 1,2 4 -2 2 12,50 10, 16 1,2 3 12, 50 1 1 7,62 7,62 7,62 34 2,5 Ø 0,9 2 10,16 1 2 RAS 1,2 4 4 10, 16 12, 50 2 1 2 1,2 3 Ø 0,9 12 7,62 7,62 7,62 2 2 1,2 1 SMD. 12, 50 10,16 7,62 1,2 TH. 10,16 High performance tactile switches • robust BUILD YOUR PART NUMBER NON-ILLUMINATED 3C MOUNTING SERIES TH9 through-hole SH9 surface mount OPTIONAL Q RAS quiet contact right angle (with TH only) R tape & reel (with SMD only) G gold contacts 3 PANEL PCB SWITCHES Multimec™ 3C High performance tactile switches • robust OPERATING FORCE TAPE & REEL Tape and reel is available for the parts listed and has the following specifications FORCE 10 • Reel diameter: Ø330 mm 9 • Tape width: 24 mm • Pitch: see list 8 • Tape and reel material: antistatic or better • Quantity per reel: see list 7 PART NO. ORDERING CODE PITCH QUANTITY PER REEL 3CSH9 3CSH9R 16 500 6 F(N) PCB SWITCHES Multimec™ 3C RECOMMENDED OPERATING CONDITIONS 3.5 3,5NN 4 3 0,3 [0.012 in] Max. e tio ng ec ra dir e l gl ca an rti g (ve in an 4° Le ° ± 90 Plunger 5 2 1 n) TRAVEL 0 0 0,2 0,4 0,6 0,8 1 L(mm) 1,2 1,4 1,6 1,8 2 Switch For the optimal performance of the switch use the recommended operating conditions. MOUNTING MOUNTING TOOLS FOR MULTIMEC™ THROUGH-HOLE SWITCHES Part No. 9861000 1 4 2 3 4 5 High performance tactile switches • robust MOUNTING (CONTINUED) SPACE REQUIREMENT - MATRIX MOUNTING Through-hole (TH) Surface mount (SMD) 5 PANEL PCB SWITCHES Multimec™ 3C PCB SWITCHES Multimec™ 3C High performance tactile switches • robust USAGE GUIDELINES HOW TO GET THE BEST RESULTS WITH MEC SWITCHES ? SOLDERING - SURFACE MOUNT VERSIONS These guidelines are offered to users of MEC Switches as an aid to ensure successful and reliable switch operation. Please see the technical specifications for details on operating and storage temperatures and soldering guidelines to make sure you select the best switch for your application. When reflow soldering is taking place, MEC strongly recommend that the temperature profile is analyzed and compared with the temperature rating of the switch. It is also important to monitor the accumulated heat buildup from both the pre-heat zones and the solder zone. For all methods - infrared, convection and vapor phase. The upper limit 240 °C/40 sec must be observed. The soldering temperature profile must have moderate temperature gradients. (JEDEC J-STD020E) MOUNTING AND DISMOUNTING If switches are to be mounted in rows it is essential that the recommendations regarding spacing are followed. PC board thickness should be 1.4 ±0.2 mm and terminal hole diameter should be 0.9 mm. A mounting tool is available for through hole multimec™ 3 series switches. SOLDERING AND CLEANING MULTIMEC™ 3 SERIES Multimec 3 series switches are fully sealed to IP67 specifications to prevent solder flux and aqueous based cleaning solutions from entering the switch and contaminating the contacts. The switches can be placed on the PC board with other components and reflow soldered. Multimec™ 3 series offers a high level of sealing, however, with aqueous solvent solutions care must be taken to avoid the worst case situation with water jets, complete immersion into a liquid with a temperature below the board or surface tension reducing additives. ™ Recommended cleaning methods are demineralized water. Any surface tension reducing agents, such as soap, must not be used as they risk causing a potential leakage of the switch. SOLDERING - THROUGH HOLE VERSIONS Hand soldering: max. 350 °C for max. 3 sec Wave soldering: heat built up in the switch during pre-heating and soldering must not exceed the maximum operating temperature of the switch. Peak temperature must not exceed 260 °C, and soldering time is max 10 sec. (IEC 60068-2-20 8). 6 ROHS COMPLIANCE As of 1 July 2006 MEC has completed the conversion to RoHS compliance. For more info please see our homepage www.apem.com TEMPERATURE LIMITS: Switch 160 °C PACKAGING Multimec™ 3 series switches are packed in rigid tubes of 50 pieces each. A box contains 1.000 pcs. The surface mount versions of multimec™ 3C series switches can also be delivered on tape/reel. Each reel contains 500 pcs. Right angle switches are packed into trays. Each tray contains 100 pcs.