RCB05DYHN-S1355

High Density Card Edge .050” [1.27 mm] Contact Centers, .488” [12.40 mm] Insulator Height, Ultra Thin, Dip Solder/Card Extender/SMT High Density Card Edge SPECIFICATIONS • • • • • • • Accommodates .062” ± .008” [1.57 mm ± 0.20 mm] PC board PPS or PA9T insulator Contact Material: Phosphor Bronze, Beryllium Copper or Spinodal Molded-in key available 1 Amp current rating per contact for contacts fully energized UL Flammability Rating: 94V-0 Operating Temperature: -65°C up to +200°C MOUNTING STYLE READOUT .134” [3.41] .025” [0.64] NO MOUNTING EARS (N) DUAL (D) METAL BOARD LOCK (with no mounting ears) (R) TERMINATION TYPE .100” [2.54] .125” [3.18] .175” [4.44] .140” [3.56] 3X .100” [2.54] ACCEPTS .062” [1.57] PCB .200” [5.08] DIP SOLDER (YH) DIP SOLDER (YS) SURFACE MOUNT (YF) CARD EXTENDER (YR) PCB LAYOUT A .100” [2.54] .050” [1.27] PIN 1 Ø.032” [0.81] .050” [1.27] MIN. 3X .100” [2.54] .200” [5.08] A .050” [1.27] 18 .062” [1.57] F A .050” [1.27] .290” [7.37] MIN. .200” [5.08] Ø .030” [0.76] MIN. PCB LAYOUT (YH) A PCB LAYOUT (YS) .040” [1.02] PCB LAYOUT (YR) .040” [1.02] MAX. .160” [4.06] MAX. 2X Ø.096” [2.44] (FOR 'R' MOUNTING) PCB LAYOUT (YF) www.sullinscorp.com | 760-744-0125 | toll-free 888-774-3100 | fax 760-744-6081 | info@sullinscorp.com High Density Card Edge .050” [1.27 mm] Contact Centers, .488” [12.40 mm] Insulator Height, Ultra Thin, Dip Solder/Card Extender/SMT PART NUMBER OPTIONS G C B 20 D YH N - S1355 MODIFICATION CODE (Consult Factory) S1355 = for YH Termination Only S1675 = for YS, YR & YF Terminations MOUNTING STYLE N = No Mounting R = Metal Board Locks (for YF Termination Only) CONTACT FINISH - RoHS Compliant All platings are Lead Free and have .000050” Nickel underplate Contact Surface B = .000010” Gold C = .000030” Gold M = .000030” Gold Termination .000100” Pure Tin, Matte .000100” Pure Tin, Matte .000010” Gold Overall TERMINATION TYPE (See Opposite Page) YH = Dip Solder, Alternate Bent In & Out YS = Dip Solder YR = Card Extender YF = Surface Mount CONTACT CENTERS B = .050” [1.27 mm] READOUT D = Dual NUMBER OF CONTACT POSITIONS See Chart Below High Density Card Edge MATERIALS (INSULATOR/CONTACT) R = PPS/Phosphor Bronze G = PA9T/Phosphor Bronze A = PPS/Beryllium Copper J = PA9T/Beryllium Copper F = PPS/Spinodal** Refer to Page 7 for Operating/Processing Temperatures **Consult factory for special soldering guidelines. 'M' plating only. DIMENSIONS Dimensions in [ ] are in millimeters, all others are in inches. C B A FIRST POSITION INDICATOR .320[8.13] .250[6.35] .155 [3.94] .488 [12.40] INSERTION DEPTH .060 [1.52] .050 [1.27] TYP. POSITIONS/ CONTACTS .016 [0.41] SQ. INCHES MILLIMETERS A±.005 B±.005 C±.015 F±.010 A±0.13 B±0.13 C±0.38 F±0.25 5/10 0.200 0.300 0.425 0.350 5.08 7.62 10.80 8.89 6/12* 0.250 0.350 0.475 0.400 6.35 8.89 12.07 10.16 10/20* 0.450 0.550 0.675 0.600 11.43 13.97 17.15 15.24 15/30 0.700 0.800 0.925 0.850 17.78 20.32 23.50 21.59 20/40 0.950 1.050 1.175 1.100 24.13 26.67 29.85 27.94 25/50* 1.200 1.300 1.425 1.350 30.48 33.02 36.20 34.29 30/60 1.450 1.550 1.675 1.600 36.83 39.37 42.55 40.64 40/80 1.950 2.050 2.175 2.100 49.53 52.07 55.25 53.34 50/100 2.450 2.550 2.675 2.600 62.23 64.77 67.95 66.04 79/158 3.900 4.000 4.125 4.050 99.06 101.60 104.78 102.87 * Consult factory for availability. www.sullinscorp.com | 760-744-0125 | toll-free 888-774-3100 | fax 760-744-6081 | info@sullinscorp.com 19