High Density Card Edge
.050” [1.27 mm] Contact Centers, .488” [12.40 mm] Insulator Height, Ultra Thin,
Dip Solder/Card Extender/SMT
High Density Card Edge
SPECIFICATIONS
•
•
•
•
•
•
•
Accommodates .062” ± .008” [1.57 mm ± 0.20 mm] PC board
PPS or PA9T insulator
Contact Material: Phosphor Bronze, Beryllium Copper or Spinodal
Molded-in key available
1 Amp current rating per contact for contacts fully energized
UL Flammability Rating: 94V-0
Operating Temperature: -65°C up to +200°C
MOUNTING STYLE
READOUT
.134” [3.41]
.025” [0.64]
NO MOUNTING EARS
(N)
DUAL (D)
METAL BOARD LOCK
(with no mounting ears)
(R)
TERMINATION TYPE
.100” [2.54]
.125” [3.18]
.175” [4.44]
.140” [3.56]
3X .100” [2.54]
ACCEPTS .062” [1.57] PCB
.200” [5.08]
DIP SOLDER
(YH)
DIP SOLDER
(YS)
SURFACE MOUNT
(YF)
CARD EXTENDER
(YR)
PCB LAYOUT
A
.100” [2.54]
.050” [1.27]
PIN 1
Ø.032” [0.81] .050” [1.27]
MIN.
3X .100” [2.54] .200” [5.08]
A
.050” [1.27]
18
.062” [1.57]
F
A
.050” [1.27]
.290” [7.37]
MIN.
.200” [5.08]
Ø .030” [0.76]
MIN.
PCB LAYOUT
(YH)
A
PCB LAYOUT
(YS)
.040” [1.02]
PCB LAYOUT
(YR)
.040” [1.02]
MAX.
.160” [4.06] MAX.
2X Ø.096” [2.44]
(FOR 'R' MOUNTING)
PCB LAYOUT
(YF)
www.sullinscorp.com | 760-744-0125 | toll-free 888-774-3100 | fax 760-744-6081 | info@sullinscorp.com
High Density Card Edge
.050” [1.27 mm] Contact Centers, .488” [12.40 mm] Insulator Height, Ultra Thin,
Dip Solder/Card Extender/SMT
PART NUMBER OPTIONS
G C B 20 D YH N - S1355
MODIFICATION CODE (Consult Factory)
S1355 = for YH Termination Only
S1675 = for YS, YR & YF Terminations
MOUNTING STYLE
N = No Mounting
R = Metal Board Locks
(for YF Termination Only)
CONTACT FINISH - RoHS Compliant
All platings are Lead Free and have .000050” Nickel underplate
Contact Surface
B = .000010” Gold
C = .000030” Gold
M = .000030” Gold
Termination
.000100” Pure Tin, Matte
.000100” Pure Tin, Matte
.000010” Gold Overall
TERMINATION TYPE (See Opposite Page)
YH = Dip Solder, Alternate Bent In & Out
YS = Dip Solder
YR = Card Extender
YF = Surface Mount
CONTACT CENTERS
B = .050” [1.27 mm]
READOUT
D = Dual
NUMBER OF CONTACT POSITIONS
See Chart Below
High Density Card Edge
MATERIALS (INSULATOR/CONTACT)
R = PPS/Phosphor Bronze
G = PA9T/Phosphor Bronze
A = PPS/Beryllium Copper
J = PA9T/Beryllium Copper
F = PPS/Spinodal**
Refer to Page 7 for Operating/Processing Temperatures
**Consult factory for special soldering guidelines. 'M' plating only.
DIMENSIONS Dimensions in [ ] are in millimeters, all others are in inches.
C
B
A
FIRST POSITION
INDICATOR
.320[8.13]
.250[6.35]
.155 [3.94]
.488 [12.40]
INSERTION DEPTH
.060 [1.52]
.050 [1.27] TYP.
POSITIONS/
CONTACTS
.016 [0.41] SQ.
INCHES
MILLIMETERS
A±.005
B±.005
C±.015
F±.010
A±0.13
B±0.13
C±0.38
F±0.25
5/10
0.200
0.300
0.425
0.350
5.08
7.62
10.80
8.89
6/12*
0.250
0.350
0.475
0.400
6.35
8.89
12.07
10.16
10/20*
0.450
0.550
0.675
0.600
11.43
13.97
17.15
15.24
15/30
0.700
0.800
0.925
0.850
17.78
20.32
23.50
21.59
20/40
0.950
1.050
1.175
1.100
24.13
26.67
29.85
27.94
25/50*
1.200
1.300
1.425
1.350
30.48
33.02
36.20
34.29
30/60
1.450
1.550
1.675
1.600
36.83
39.37
42.55
40.64
40/80
1.950
2.050
2.175
2.100
49.53
52.07
55.25
53.34
50/100
2.450
2.550
2.675
2.600
62.23
64.77
67.95
66.04
79/158
3.900
4.000
4.125
4.050
99.06
101.60
104.78
102.87
* Consult factory for availability.
www.sullinscorp.com | 760-744-0125 | toll-free 888-774-3100 | fax 760-744-6081 | info@sullinscorp.com
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