AS7211-BLGT

AS7211 Smart Lighting Manager with Integrated Daylight Sensor, Control Interfaces and Network Access General Description The AS7211 Smart Lighting Manager device is an intelligent, photopic-sensor based light manager that enables automatic daylight level adaptation and energy conservation for next generation lighting systems. It is part of the ams “Cognitive Lighting™” family of products that enable lights to be “aware” and adapt to their surroundings and provide human lighting needs and energy conservation needs autonomously. The AS7211 is equipped with an advanced Cognitive Light Engine (CLE) to optimize daylight harvesting and drives either dimming ballasts or LED drivers. For local inputs it uses direct connection to Local Sensor Networks (LSN), like occupancy sensors, dimmers or bridges. It connects to standard 0-10V dimmers inputs and drives 0-10V dimming ballasts/drivers for fluorescent lighting or LED drivers for LED lighting. A UART interface is provided for remote configuration, control and management of the CLE. This UART interface responds to simple AT commands. The AS7211 can also directly connect to precision LED drivers from ams, providing a complete lighting solution that can be easily commissioned and deployed. Ordering Information appears at end of datasheet. ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 1 Key Benefits & Features The benefits and features of this device are listed below: Figure 1: Added Value of Using AS7211 Benefits Features  Very accurate ambient light measurements possible  Ambient light sensing (photopic response) optimized for Day-Lighting applications  No life-time drift and very high temperature stability  Photopic response realized by interference filters  Evaluation of additional sensors possible  Input signal conditioning not necessary  Output signal conditioning not necessary  Configurable Local Sensor Network (LSN), supporting either 0-10V or I2C  Accepts 0-10V input signals from dimmers  0-10V output for control of dimmable ballast, linear fluorescent, LEDs  Integrated 12bit PWM for linear/non-linear  Closed Loop PWM control dimming  AT Commands: Configuration and control  Simplifies the device set-up through UART  Network control: UART interface to network  Enables Network controlled lighting & building management (BLE, Wi-Fi, ZigBee, BacNet, KNX) systems via AT commands  Avoidance of AC beat frequency flicker  SYNC pin to synchronize multiple lights  Industrial Temperature range  Temperature range: 0 to 85°C  Low VDD requirement  VDD LV range: 2.7V to 3.6V  Small package, with built in aperture  20-pin LGA package 4.5 x 4.7 x 2.5mm Applications Sense ambient light, dim and maintain brightness of luminaires and lamps in local loop control, automatic lumen maintenance, flexible network connectivity and simple control of luminaires and lamps.    LED and florescent luminaires, troffers, high-bays Track-head and downlights LED and florescent replacement lamps AS7211 – 2 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 Block Diagram Figure 2: Functional Blocks of AS7211 VDDHV VDD Outputs VDDHV VDD VDD 0-10V Optional Inputs VDD 0_10V_DIM OCC Cognitive Lighting Engine (CLE) VDDHV DAC PWM_1 / 0_10V_O PWM PWM Generator PWM_2 Dimming & Occupancy PWM_3 VDD SDA_M Photopic Sensors I2C Master SYNC / RESN MODE SCL_M Setup Network Access VDD VDD OSC 16MHz RX TX LED_IND °C UART MISO SPI Master MOSI SCK CSN_SD GND The AS7211 provides closed loop ambient Daylight sensing and PWM tuning while interfacing to Local and Network controls. Pin Assignments Figure 3: Pin Diagram of AS7211 (top view) 20 16 1 15 5 11 6 10 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 3 Figure 4: Pin Description of AS7211 (20 pin LGA) Pin Number 1 Pin Name Description PWM_3 Digital PWM 3 SYNC SYNC input RESN Reset pin, active low 3 SCK SPI serial clock 4 MOSI SPI MOSI 5 MISO SPI MISO 6 CSN_EE Chip select for the required external serial Flash memory, active low 7 CSN_SD Chip select for SD Card interface, active low 8 AUX Auxiliary mode input pin 9 SCL_M I2C master clock pin 10 SDA_M I2C master data pin 11 RX UART RX pin 12 TX UART TX pin 13 0_10V_DIM 0-10V input dimming pin 14 VDDHV High Voltage Supply 15 MODE Mode selection pin 16 GND Ground 17 VDD Low Voltage Supply 18 LED_IND LED Driver output for Indicator LED, current sink PWM_1 Digital PWM 1 0_10V_O 0-10V output pin PWM_2 Digital PWM 2 2 19 20 AS7211 – 4 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings“ may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The device is not designed for high energy UV (ultraviolet) environments, including upward looking outdoor applications, which could affect long term optical performance. Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Comments Supply voltage VDD -0.3 5 V pin VDD to GND, Low Voltage pin VDDHV_MAX Supply voltage VDDHV -0.3 20 V pin VDDHV to GND, High Voltage pin VDD_IO Input/output pin voltage -0.3 VDD + 0.3 V Low Voltage pins to GND VDDHV_IO Input/output pin voltage -0.3 VDDHV + 0.3 V High Voltage pins to GND Electrical Parameters VDD_MAX ISCR Input current (latch-up immunity) ± 100 mA ±2000 V JEDEC JESD78D Nov 2011 (Class II) Electrostatic Discharge ESDHBM(1) Electrostatic discharge HBM JS-001-2014 Temperature Ranges and Storage Conditions Tstrg Tbody Storage temperature -40 85 Package Body Temperature Humidity noncondensing Moisture Sensitive Level 5 °C 260 °C 85 % 3 Norm: IPC/JEDEC J-STD020. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC JSTD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices” Represents a 168 hour max. floor lifetime Note (1): Except for pins 14 and 19 where ESDHBM = ±1500V ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 5 Electrical Characteristics All limits are guaranteed with VDD = 3.3V, VDDHV = 12V, TAMB = +25ºC. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. If VDD and VDDHV are to be the same voltage, they must be sourced by the same 2.97-3.6V supply. Figure 6: Electrical Characteristics Symbol Parameter Conditions Min Typ Max Unit General Operating Conditions VDD Low Voltage operating Supply 2.97 3.3 3.6 V VDDHV High Voltage operating Supply VDD 12 15 V -40 25 85 °C 5 mA TAMB IVDD ISTANDBY(1) Operating Temperature Operating Current Standby Current 12 µA Internal RC Oscillator FOSC tJITTER(2) Internal RC oscillator frequency Jitter 15.7 16 @25°C 16.3 MHz 1.2 ns 0-10V Output (0_10V_O pin) ROUT_10 Resistive Load 1 kΩ IS_10 Source Current 10 mA Sink Current -10 mA ISINK_10 CLOAD_10 Capacitive Load VOUT_10(3) Output Swing 0 100 pF 10 V 315 kΩ 0-10V Input RIN_HV AS7211 – 6 Analog Input Resistance VDDHV ≥ 12V 138 200 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 Temperature Sensor DTEMP Absolute accuracy of the temperature measurement -8.5 8.5 °C 1 8 mA -10 10 % Indicator LED IIND LED Current IACC Accuracy of Current VLED Voltage range of connected LED 1, 2, 4 or 8 Vds of current sink 0.2 V Vin=0V or VDD -1 1 uA Digital Inputs and Outputs IIH, IIL Logic Input Current VIH CMOS Logic High Input 0.7* VDD VDD V VIL CMOS Logic Low Input 0 0.3* VDD V VOH CMOS Logic High Output I=1mA VDD0.4 V VOL CMOS Logic Low Output I=1mA 0.4 V 1 uA IIh, IIL Logic Input Current Vin=0V or VDD -1 tRISE(2) Current rise time C(Pad)=30pF 5 ns tFALL(2) Current fall time C(Pad)=30pF 5 ns Notes: (1) 15µA over temperature (2) Guaranteed, not production tested (3) For VDDHV>10.5, output max is 10V, else output max tracks VDDHV ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 7 Figure 7: AS7211 I2C Master Timing Characteristics Symbol Parameter Conditions Min Typ Max Unit 100 400 kHz I2C Interface fSCLK SCL Clock Frequency tBUF Bus Free Time Between a STOP and START 1.3 µs tHD:STA Hold Time (Repeated) START 0.6 µs tLOW LOW Period of SCL Clock 1.3 µs tHIGH HIGH Period of SCL Clock 0.6 µs tSU:STA Setup Time for a Repeated START 0.6 µs tHD:DAT Data Hold Time 0 tSU:DAT Data Setup Time 100 tR Rise Time of Both SDA and SCL 20 300 ns tF Fall Time of Both SDA and SCL 20 300 ns tSU:STO Setup Time for STOP Condition 0.6 CB Capacitive Load for Each Bus Line CI/O I/O Capacitance (SDA, SCL) 0.9 µs ns µs CB — total capacitance of one bus line in pF 400 pF 10 pF Figure 8: I2C Master Timing Diagram tR tF tLOW SCL P tHIGH S tHD:STA tHD:DAT S tSU:DAT tSU:STA P tSU:STO VIH SDA tBUF Stop AS7211 – 8 VIL Start ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 Figure 9: AS7211 SPI Timing Characteristics Symbol Parameter Conditions Min Typ Max Unit 16 MHz SPI Interface fSCK Clock frequency 0 tSCK_H Clock high time 40 ns tSCK_L Clock low time 40 ns tSCK_RISE SCK rise time 5 ns tSCK_FALL SCK fall time 5 ns tCSN_S CSN setup time Time between CSN highlow transition to first SCK high transition 50 ns tCSN_H CSN hold time Time between last SCK falling edge and CSN lowhigh transition 100 ns 100 ns tCSN_DIS CSN disable time tDO_S Data-out setup time 5 ns tDO_H Data-out hold time 5 ns tDI_V Data-in valid 10 ns Figure 10: SPI Master Write Timing Diagram tCSN_DIS CSN tSCK_RISE tCSN_S tCSN_H tSCK_FALL SCK tDO_S MOSI tDO_H LSB MSB HI-Z HI-Z MISO Figure 11: SPI Master Read Timing Diagram CSN_xx tSCK_H tSCK_L SCK tDI_V Dont care MOSI MISO MSB ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 LSB AS7211 – 9 Figure 12: Typical Spectral Responsivity Photopic Response Normalized Response Ys(l) Wave Length [nm] Figure 13: AS7211 Optical Characteristics Symbol Parameter SOR Sensor output Responsivity Conditions Min Typ(1) Max Unit 190 200 210 LUX White LED CCT = 4000K Ev = 200 LUX IRResp IR Responsivity DRLUX Dynamic Range (1)Typical IR LED 850nm, 1 Ev = 100 LUX 10 LUX 60000 LUX values at Int=400.4ms, Gain=1x, TAMB = +25ºC. AS7211 – 10 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 Figure 14: AS7211 LGA Package Field of View Detailed Description AS7211 Smart Lighting Manager - Overview The Cognitive Light Engine (CLE) is the “brains” of the Smart Lighting Manager. The CLE constantly processes information from the Photopic Sensors, Network Access and Inputs while controlling Outputs. Initial Setup and ongoing parameter storage is done by reading and writing an external EEPROM via SPI bus. A Luminaire solution for Daylighting and Spectral Presence requires only the AS7211. A Luminaire solution with Daylighting, and Lumen Maintenance requires just the addition of an ams TSL4531 single chip light sensor, connected via I 2C. Refer to the table in the Figure below. Overall AS7211 timing generation uses an on chip 16MHz temperature compensated oscillator for master clock timing. Figure 15: AS7211 Solution Chart Device Orientation (from luminaire light source) Solution Required Daylighting Lumen Maintenance Spectral Presence Detect          AS7211  (into room)  (into luminaire)  (into luminaire) ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 TSL4531 (optional)  (not required)  (not required)  (into room) AS7211 – 11 Photopic Sensor The Photopic sensor, part of the AS7211 Cognitive Light Engine (CLE), is a nextgeneration digital light sensor device which approximates the human eye response. The sensor contains an integrating analog-to-digital converter (16-bit resolution ADC), which integrates current from a photodiodes. Upon completion of the conversion cycle, the result is transferred to the corresponding data registers. Transfers are double-buffered to ensure integrity of the data is maintained. The Photopic response is realized by an interference filter, which enables no life-time drift and very high temperature stability. Note the AS7211 LGA package contains an internal aperture that provides a Package Field of View (PFOV) of +/- 22°. External optics can be used as needed to expand or reduce this built in PFOV. AS7211 Inputs Figure 16: VDDHV Based Settings for Inputs VDDHV Dimming 10.5-15V Direct input for 0_10V_DIM, dimming input 2.97-10V(1) External 5:1 resistor divider for 0-10V_DIM, dimming input(2) Note (1): For VDDHV 12V 3.3V 10V VDD 3.3V VDDHV VDD 10V 0 VDDHV 0 0_10V_DIM 0_10V Rin=200k typ. MODE CLE ADC 5:1 ADC CLE MODE 0_10V_DIM 0-10V Analog Input AS7211 0-10V Analog Input AS7211 RMODE RMODE The auxiliary sensor input (AUX) can be configured as an analog or digital sensing. It can be used as a 0-10V analog sensing input, or, as a digital sensing input both of which are common types of external occupancy sensors. And this sensing can therefore be used to directly control the luminaire. Refer to AS7211 User Guide as well as the ams AT Command document for additional usage and setup information. Synchronization and Reset Figure 18: Synchronization and Reset Circuit Opto Coupler AC Main SYNC/ RESN 10k CLE optional SYNC and Reset Push > 100ms Synchronization and Reset Circuit: This figure shows the basic diagram when using reset and synchronization function together. AS7211 provides optional synchronization of the PWMs. This sync signal can be derived from the AC mains so, for example, all luminaires in a room are synchronized to prevent beat frequency flicker. If the SYNC pin is left open, synchronization is automatically disabled. Refer to the Figure above. When pulled down for more than 100ms the SYNC/RESN pin will reset the AS7211 Smart Lighting Manager. In this case the push-button “overrides” the output of the opto-coupler. Therefore a resistor should be placed in series with the opto-coupler. ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 13 AS7211 Outputs The AS7211 outputs, used to control ballast dimming and/or LED string dimming, can be configured as either three PWM outputs or two PWMs and one analog output. The PWMs are 12 bit with max frequency of 5.3 kHz, which is factory set to 888 Hz. Refer to the Figure below. The three PWM outputs, PWM_1, PWM_2 and PWM_3 all switch with the same duty cycle, but are not simultaneous for better EMI performance. The PWM_1 output can be set to either analog (0-VDDHV) or digital (0-VDDHV) dimming. Analog dimming range is 10-100%. Digital Dimming range is 1-100%. PWM2 and PWM3 track output 1 dimming level, but are always digital (1-100%). To set the desired device operation MODE use the appropriate RMODE resistor, also shown in the Figure below. Figure 19: Outputs MODE RMODE Setting 0 100 Ω 0-10V analog 1 470 Ω 0-10V digital Outputs PWM_1/0_10V_O PWM_2 & PWM_3 Analog 0-VDDHV(1) Digital PWMs (0-VDD) Digital PWM (0-VDDHV) (1) Digital PWMs (0-VDD) Note (1): For VDDHV>10.5, output max is 10V, else output max tracks VDDHV. Indicator LED An LED, connected to pin LED_IND, is used to indicate programming progress of the device. During programming of the AS7211 via an external SD card the indicator LED starts. When programming is finished the indicator LED is off. Refer to the separate ams document for a complete description of AS7211 Firmware Update Methodology. AS7211 – 14 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 UART and AT Command Interface The UART block implements the TX and RX signals as defined in the RS-232 / V.24 standard communication protocol. UART Feature List  Full Duplex Operation (Independent Serial Receive and Transmit Registers) with FIFO buffer of 8 bytes for each.  Factory set to 115.2k Baud  Supports Serial Frames with 8 Data Bits, 1 Parity Bit and 1 Stop Bit. Operation TRANSMISSION If data is available in the transmit FIFO, it will be moved into the output shift register and the data will be transmitted at the configured Baud Rate, starting with a Start Bit (logic zero) and followed by a Stop Bit (logic one). RECEPTION At any time, with the receiver being idle, if a falling edge of a start bit is detected on the input, a byte will be received and stored in the receive FIFO. The following Stop Bit will be checked to be logic one. Figure 20: UART Protocol Data Bits TX D0 D1 Start Bit D2 D3 D4 D5 D6 D7 Parity Bit Stop Bit Tbit=1/Baude Rate Always Low RX D0 P Next Start Even or odd Always High D0 D1 D2 D3 D4 D5 D6 D7 D0 P Start Bit detected After Tbit/2: Sampling of Start Bit After Tbit: Sampling of Data Sample Points ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 15 AT Command Interface The network interface on the Smart Lighting Manager supporting the AT Commands is the UART interface. The Smart Lighting Manager adapts the concept of an AT command set for lighting control and configuration. The Smart Lighting Manager uses a text-based serial command interface as popularized by the “AT Command” model used in early Hayes modems. For example:  Set the desired daylight LUX level target: ATLUXT = 500 >> OK The “AT Command Interface”, shown below between the network interface and the core of the system, provides access to the Smart Lighting Manager’s lighting control and configuration functions. Figure 21: AT Command Interface BLE Wi-Fi ZigBee BacNet KNX Network Bridge RX AT Commands TX AT Command Interface CLE AT Command Interface AS7211 Refer to the separate ams AS7211 AT Command Set document for complete command set and usage. AS7211 – 16 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 I2C Master Interface (Local Sensor Interface) The I2C Master interface can be used to connect external sensors (such as Daylight, Occupancy, CO sensors, etc.). Refer to the separate ams Application note for external sensor usage with the AS7211. I2C Feature List  Clock is set to 100kHz  7+1-bit addressing mode.  Write formats: Single-Byte-Write, Page-Write  Read formats: Random-Read, Sequential-Read  SDA input delay and SCL spike filtering by integrated RC-components. I2C Protocol Figure 22: I2C symbol definition Symbol Definition RW Note S Start condition after stop R 1 bit Sr Repeated start R 1 bit SW Slave address for write R Slave address SR Slave address for read R Slave address WA Word address R 8 bit A Acknowledge W 1 bit N No Acknowledge R 1 bit Data Data/write R 8 bit Data (n) Data/read W 8 bit P Stop condition R 1 bit WA++ Slave Increment word address R during acknowledge The above I2C symbol definition table describes the symbols used in the following mode descriptions. ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 17 I2C W RITE ACCESS Byte Write and Page Write formats are used to write data to the slave. Figure 23: I2C Byte write S SW A WA Data A A P Write WA++ Figure 24: I2C Page write S SW A WA Data 1 A …….. A Write WA++ Data n A Write WA++ A P Write WA++ The transmission begins with the START condition, which is generated by the master when the bus is in IDLE state (the bus is free). The device-write address is followed by the word address. After the word address any number of data bytes can be sent to the slave. The word address is incremented internally, in order to write subsequent data bytes on subsequent address locations. For reading data from the slave device, the master has to change the transfer direction. This can be done either with a repeated START condition followed by the device-read address, or simply with a new transmission START followed by the device-read address, when the bus is in IDLE state. The device-read address is always followed by the 1st register byte transmitted from the slave. In Read Mode any number of subsequent register bytes can be read from the slave. The word address is incremented internally. I2C READ ACCESS Random, Sequential and Current Address Read are used to read data from the slave. Figure 25: I2C Random read S SW A WA A S r SR A read WA++ Data N P WA++ Random Read and Sequential Read are combined formats. The repeated START condition is used to change the direction after the data transfer from the master. AS7211 – 18 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 The word address transfer is initiated with a START condition issued by the master while the bus is idle. The START condition is followed by the device-write address and the word address. In order to change the data direction a repeated START condition is issued on the 1st SCL pulse after the acknowledge bit of the word address transfer. After the reception of the device-read address, the slave becomes the transmitter. In this state the slave transmits register data located by the previous received word address vector. The master responds to the data byte with a not-acknowledge, and issues a STOP condition on the bus. Figure 26: I2C Sequential read S SW A WA A S r SR A Data 1 read WA++ A read WA++ Data n N P WA++ I2C sequential read: Shows the format of an I2C sequential read access. Sequential Read is the extended form of Random Read, as more than one registerdata bytes are transferred subsequently. In difference to the Random Read, for a sequential read the transferred register-data bytes are responded by an acknowledgement from the master. The number of data bytes transferred in one sequence is unlimited (consider the behavior of the word-address counter). To terminate the transmission the master has to send a not-acknowledge following the last data byte and generate the STOP condition subsequently. The AS7211 is compatible to the NXP two wire specifications. http://www.nxp.com/documents/user_manual/UM10204.pdf Version 4.0 Feb 2012 for standard mode and fast mode. ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 19 Application Information Schematics Figure 67: Constant Current LED Daylighting w/Networking & Spectral Sensing AC BLE Wi-Fi ZigBee BacNet KNX 3V 12V 10uF 100nF 0..10V Dimmer VDDHV VDD RX TX Network Bridge PWM_1/0_10V_O AS7211 0_10V_DIM Occupancy Sensor SDA_M SCL_M Dimming Control Output MODE MOSI MISO SCK CSN_EE OCC Additional Sensors I2C AC/DC LED Driver EEPROM 3V LED_IND GND Figure 28: Constant Voltage LED Daylighting w/Networking & Spectral Sensing AC BLE Wi-Fi ZigBee BacNet KNX AC/DC 3V 10uF 100nF VDDHV VDD RX TX Network Bridge 0_10V_DIM Occupancy Sensor SDA_M SCL_M MODE MOSI MISO SCK CSN_EE OCC Additional Sensors I2C AS3834 LED Driver PWM_1/0_10V_O AS7211 0..10V Dimmer DC/DC Boost GND EEPROM 3V LED_IND Figure 29: Fluorescent Daylighting System w/Networking and Spectral Sensing BLE Wi-Fi ZigBee BacNet KNX Network Bridge 0..10V Dimmer Occupancy Sensor Additional Sensors I2C AS7211 – 20 100nF 3V 12V 10uF 10uF RX TX VDD VDDHV PWM_1/0_10V_O AS7211 0_10V_DIM MODE MOSI MISO SCK CSN_EE OCC SDA_M SCL_M 100nF GND EEPROM 3V LED_IND ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 PCB Layout Figure 30: Typical Layout Routing As shown, to prevent interference trace routing feedthroughs with exposure directly under the AS7211 should be avoided. The AS7211 Smart Lighting Integration Kit (SLIK) demo board with schematic and PCB layout documentation is available from ams for additional design information. ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 21 Package Drawings & Markings Figure 31: Package Drawing AS7211 Notes: 1. 2. 3. 4. 5. Unless otherwise specified, all dimensions are in millimeters. Tolerances: Angular (± .5°), Two Place Decimal (± .015), Three Place Decimal (± .010) Contact finish is Au. This package contains no lead (Pb). This drawing is subject to change without notice. AS7211 – 22 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 PCB Pad Layout Suggested PCB pad layout guidelines for the LGA package are show. Flash Gold is recommended as a surface finish for the landing pads. Figure 32: Recommended PCB Pad Layout Unit: mm 0.30 1.10 0.65 4.60 1 4.40 Notes: 1. Unless otherwise specified, all dimensions are in millimeters. 2. Dimensional tolerances are ±0.05mm unless otherwise noted. 3. This drawing is subject to change without notice. ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 AS7211 – 23 Mechanical Data Figure 33: Tape & Reel Information AS7211 – 24 ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 Soldering, Manufacturing Process Considerations & Storage Information Solder Reflow Profile The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 34: Recommended Reflow Soldering Profile Profile Feature Reference Average temperature gradient in preheating Soak Time Device 2.5°C/s tSOAK 2 to 3 minutes Time above 217°C (T1) t1 Time above 230°C (T2) t2 Max 50s Time above Tpeak - 10°C (T3) t3 Max 10s Tpeak 260°C Peak temperature in reflow Temperature gradient in cooling ams Preliminary Datasheet, Confidential: [v0-92] 2016–M11–03 Max 60s Max - 5°C/s AS7211 – 25 Manufacturing Process Considerations The AS7211 package is compatible with standard reflow no-clean and cleaning processes including aqueous, solvent or ultrasonic techniques. However, as an open-aperture device, precautions must be taken to avoid particulate or solvent contamination as a result of any manufacturing processes, including pick and place, reflow, cleaning, integration assembly and/or testing. Temporary covering of the aperture is allowed. To avoid degradation of accuracy or performance in the end product, care should be taken that any temporary covering and associated sealants/debris are thoroughly removed prior to any optical testing or final packaging. Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions: • Shelf Life: 12 months • Ambient Temperature: