VECM7060-701-2PL

客 户 Z133 CUSTOMER 承 認 書 SPECIFICATION FOR APPROVAL 客户品名 CUSTOMER NAME. 料 号 PART NO. 本公司品名 OURS PART NAME. VECM7060-701-2PL 料 号 PART NO. FIA09070-01 工程出图 承認印 ENGINEERING DRAWING CUSTOMER APPROVE 發行 檢查 承認 MADE CHECKED APPROVED 采 购 工 程 品 保 承认结果：请予以认证，提出修改意见或确认 后签回，如未签回下订单，则是视为默认。 日期 DATE： 2019 年 07 月 29 日 所签回的传真件及复印件均视为具有法律效力 深圳市千代源电子有限公司 SHEN ZHEN VOLUME SOURCE ELECTRONICS CO.,LTD. 地址:深圳市龙岗区坂田上雪科技工业城北区 4 号 B 栋 Tel: 0755-28906603 Fax: 0755-28906603-806 HOME: http://www.volumesz.com.cn 承 认 书 番 号 SPEC NO. VE-Z133-20190729001 一． 产品实物图 Product physical map 二.产品尺寸图：(mm) 三． 电性原理图： Dimensions in (mm) Schematic 注：绕线均匀平整无交叉。 A B 7.0±0.3 6.0±0.3 四． 绕组结构 WINDING C D E F G H I J 4.0Max 1.6±0.3 1.8±0.3 3.0Typ 3.0Ref 6.5Ref 2.5Ref 1.6Ref WINDING START FINISH N1 1 2 N2 4 3 WIRE(φ) COLORE APPROVALS 深圳市千代源电子有限公司 SHEN ZHEN VOLUME SOURCE ELECTRONICS CO.,LTD. DRAWN BY 卢永汉 TURNS REMARK DATE REV A0 CHECKED BY DATE 2019-07-24 APPROVED BY PAGE 2/5 五：规格 Specifications 产品种类 Product Category Common-mode choke/filter 零件号别名 Part number alias VECM7060-701-2PL 端接类型 End connection type SMD/SMT 应用 application LAN's,telephones,personal computers 阻抗 Impedance 700 Ω 磁芯型号 Core type CM7060 容差 tolerance 25% 测试条件 Test conditions 100MHz 最大直流电流 Maximum DC Current 4.0A 最大直流电阻 Maximum DC Resistance 15 mΩ 80 储存温度 Storage temperature -5℃～+30℃（相对湿度：20%-75%） RATED VOLTAGE MAX.(VDC) 额定电压 最大值（直流电压） INSULATION RESISTANCE MIN.(mΩ) 绝缘 最小电阻（mΩ） 工作温度范围 Operating Temperature Range 10 -25℃～+85℃ 封装 encapsulation Mouse Reel 包装数量 Packing Quantity 1000 PCS 子类别 Subcategories Inductors, Chokes & Coils 单位重量 Unit weight (typ.) 0.55g 六．阻抗频率特性 Impedance frequency characteristics 七．推荐的焊接技术 Recommended Soldering Technologies 1. Re-flowing Profile: △ Preheat condition: 150 ~200℃/60~120sec. △ Allowed time above 217℃: 60~90sec. △ Max temp: 260℃ △ Max time at max temp: 5sec. Solder paste: Sn/3.0Ag/0.5Cu △ Allowed Reflow time: 2x max Please refer to Fig.1-1. [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the Reflow profile shows.] 2. Iron Soldering Profile: △ △ △ △ △ Iron soldering power: Max. 30W Pre-heating: 150℃/60sec. Soldering Tip temperature: 350℃ Max. Soldering time: 3sec. Max. Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering Please refer to Fig.2-1. [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 八．包装形式 Packaging Form 1.卷筒尺寸 A Ф330±2.0 W1 16.5+2/0 Dimensions in (mm) N E 100±1.0 2.0Typ W2 22.5±0.5 2.编带尺寸 Dimensions in (mm) P0 A B ФD0 E F 7.6±0.2 9.6±0.2 1.5+0.1/0 1.75±0.1 7.5±0.1 P1 P2 W K t 12.0±0.1 2.0±0.1 16.0±0.3 4.6±0.1 0.4±0.05 4.0±0.1 Dimensions in (mm)