Document MT0512P, Revision 2019.A, Dec 2019
MTi 1-series Datasheet
IMU, VRU, AHRS and GNSS/INS module
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Revision
Date
By
Changes
A
8 Jul 2015
MHA
Initial release
F
1 July 2018
AVY
Added MTi-2 VRU and MTi-3 AHRS
performance specifications.
Updated MTi-7 performance specifications.
G
11 Jan 2019
MCR, AKO
Added information on Device
ID/functionality.
Updated documentation on AHS.
Added EU and FCC declaration of
conformity.
Updated gyroscope specifications.
H
26 Mar 2019
MCR
Updated EU and FCC declaration of
conformity for hardware v2.0.
I
3 June 2019
AKO
Added information on MTi-#-C packaging
2019.A
Dec 2019
AKO
Xsens brand update
© 2005-2020, Xsens Technologies B.V. All rights reserved. Information in this document is subject to change
without notice. Xsens, Xsens DOT, MVN, MotionGrid, MTi, MTi-G, MTx, MTw, Awinda and KiC are registered
trademarks or trademarks of Xsens Technologies B.V. and/or its parent, subsidiaries and/or affiliates in The
Netherlands, the USA and/or other countries. All other trademarks are the property of their respective owners.
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Table of Contents
1 General information .................................................................. 6
1.1
Ordering information................................................................................... 6
1.2
Identifying device functionality using the unique Device Identifier .................... 6
1.3
Block diagram ............................................................................................ 8
2 Sensor specifications .............................................................. 10
2.1
MTi 1-series performance specifications........................................................10
2.2
Sensors specifications ................................................................................10
3 Functional description ............................................................. 12
3.1
Pin configuration .......................................................................................12
3.2
Pin map ...................................................................................................13
3.3
Pin descriptions .........................................................................................13
3.4 Peripheral interface selection ......................................................................14
3.4.1 Peripheral interface architecture ............................................................14
3.4.2 Xbus Protocol ......................................................................................15
3.4.3 MTSSP Synchronous Serial Protocol........................................................15
3.4.4 I2C .....................................................................................................19
3.4.5 SPI ....................................................................................................21
3.4.6 UART half-duplex .................................................................................22
3.4.7 UART full duplex with RTS/CTS flow control .............................................23
4 MTi 1-series architecture ........................................................ 25
4.1 MTi 1-series configurations .........................................................................25
4.1.1 MTi-1 IMU ...........................................................................................25
4.1.2 MTi-2 VRU ..........................................................................................25
4.1.3 MTi-3 AHRS.........................................................................................25
4.1.4 MTi-7 GNSS/INS ..................................................................................26
4.2 Signal processing pipeline...........................................................................26
4.2.1 Strapdown integration ..........................................................................26
4.2.2 Xsens sensor fusion algorithm for VRU and AHRS product types ................26
4.2.3 Xsens sensor fusion algorithm for GNSS/INS product ...............................27
4.3 Magnetic interference ................................................................................28
4.3.1 Magnetic Field Mapping.........................................................................28
4.3.2 In-run Compass Calibration (ICC) ..........................................................29
4.3.3 Active Heading Stabilization (AHS) .........................................................29
4.4
Frames of reference ...................................................................................30
5 System and electrical specifications ........................................ 31
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5.1
Interface specifications ..............................................................................31
5.2
System specifications .................................................................................32
5.3
Electrical specifications ...............................................................................32
5.4
Absolute maximum ratings .........................................................................32
6 Design and packaging ............................................................. 33
6.1
Footprint ..................................................................................................33
6.2 Tray packaging information ........................................................................34
6.2.1 Tray of 20 pcs (MTi-#-T) ......................................................................34
6.2.2 Tray of 100 pcs (MTi-#-C) ....................................................................35
6.3
Reel packaging information .........................................................................36
6.4
Package drawing .......................................................................................37
7 Declaration of conformity ........................................................ 39
7.1
EU Declaration of Conformity ......................................................................39
7.2
FCC Declaration of Conformity ....................................................................40
List of Tables
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
1: Ordering information for MTi 1-series modules .............................................. 6
2: Device ID's for MTi 1-series ........................................................................ 7
3: Orientation performance specifications .......................................................10
4: Position and velocity performance specifications (with MTi-7-DK) ...................10
5: Gyroscope specifications ...........................................................................10
6: Accelerometer specifications ......................................................................11
7: Magnetometer specifications .....................................................................11
8: Alignment specifications ............................................................................11
9: Pin mapping for peripheral selection ...........................................................13
10: Pin description MTi 1-series module ..........................................................13
11: Peripheral interface selection ...................................................................14
12: List of defined opcodes ...........................................................................17
13: List of I2C addresses ...............................................................................19
14: Implemented I2C bus protocol features .....................................................20
15: SPI timing .............................................................................................22
16: Filter profiles for VRU and AHRS ...............................................................27
17: Filter profiles for MTi-7 (GNSS/INS) ..........................................................28
18: Data output with reference coordinate system ...........................................30
19: Communication interfaces .......................................................................31
20: Auxiliary interfaces .................................................................................31
21: System specifications .............................................................................32
22: Electrical specifications ...........................................................................32
23: Absolute maximum ratings MTi 1-series module .........................................32
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Table 24: MTi 1-series module generations ..............................................................37
List of Figures
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
Figure
1: MTi 1-series module diagram .................................................................... 8
2: Pin configuration of the MTi 1-series module (top view) ...............................12
3: Communication architecture of MTi 1-series module (simplified) ...................15
4: Data flows within MTSSP ..........................................................................16
5: I2C write message operation ....................................................................20
6: Read message operation with full write transfer and full read transfer (I 2C) ...20
7: Read message transfer using a repeated start condition (I 2C) .......................21
8: SPI basic transfer ...................................................................................21
9: SPI timing ..............................................................................................22
10: Behaviour of the nRE and DE lines ..........................................................23
11: Data transmit behaviour under CTS .........................................................23
12: RTS behaviour under data reception ........................................................24
13: Default sensor fixed coordinate system for the MTi 1-series module ............30
14: Recommended MTi 1-series module footprint ............................................33
15: MTi 1-series v1.1 dimensions and sensor locations ....................................37
16: MTi 1-series v2.0 dimensions and sensor locations ....................................37
17: Location PCB number on MTi 1-series module (bottom view) .......................38
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1 General information
This document provides information on the contents and usage of the MTi 1-series
modules. The MTi 1-series module (MTi 1-s) is a fully functional, self-contained module
that is easy to design-in. The MTi 1-s can be connected to a host through I2C, SPI or
UART interfaces.
The Hardware Integration Manual: MTi 1-series (MT1503) supplements this document.
Notes on typical application scenarios, recommended external components, printed
circuit board (PCB) layout, origin of measurements, stress related considerations,
reference designs and handling information could be found in the hardware integration
manual.
The MT Low Level Communication Protocol (MT0101P) document provides a complete
reference for the protocol to communicate with Xsens Motion Trackers. For a better
understanding of the Synchronous Serial Protocol (Section 3.4.3) for use with the MTi 1s, the advice is to read the communication protocol reference in the MT Low Level
Communication Protocol document first. The communication protocol document also
describes the synchronization messages and settings in detail.
Links to the latest available documentation can be found in your MT Software Suite
installation folder or via the following link: https://xsens.com/xsens-mti-documentation
1.1 Ordering information
Table 1: Ordering information for MTi 1-series modules
Part
Number
Output
MTi-1T
IMU; inertial data
MTi-2T
VRU; inertial data, roll/pitch
(referenced), yaw (unreferenced)
MTi-3T
AHRS; inertial data, roll/pitch/yaw
MTi-7T
GNSS/INS; inertial data,
roll/pitch/yaw, velocity, position
MTi-1R
IMU; inertial data
MTi-2R
VRU; inertial data, roll/pitch
(referenced), yaw (unreferenced)
MTi-3R
AHRS; inertial data, roll/pitch/yaw
MTi-7R
GNSS/INS; inertial data,
roll/pitch/yaw, velocity, position
Package
PCB, JEDEC-PLCC-28
compatible
PCB, JEDEC-PLCC-28
compatible
PCB, JEDEC-PLCC-28
compatible
PCB, JEDEC-PLCC-28
compatible
PCB, JEDEC-PLCC-28
compatible
PCB, JEDEC-PLCC-28
compatible
PCB, JEDEC-PLCC-28
compatible
PCB, JEDEC-PLCC-28
compatible
Packing Method
Tray of 20
Tray of 20
Tray of 20
Tray of 20
Reel of 250
Reel of 250
Reel of 250
Reel of 250
1.2 Identifying device functionality using the unique Device Identifier
Each Xsens product is marked with a unique serial device identifier referred to as the
Device ID. The Device ID is categorized per MTi product configuration in order to make it
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possible to recognize the MTi by reviewing the Device ID. The second digit of the Device
ID denotes the functionality (e.g. ‘1’ for all IMU products, such as MTi-1, MTi-10 and MTi100), the third digit denotes the product series (6 for MTi 10-series, 7 for MTi 100-series,
8 for MTi 1-series) and the fourth digit denotes the interface (always 8 for the MTi 1series). The last four digits are unique for each device; these four digits have a
hexadecimal format.
Below is a list of the MTi 1-series product types with their associated Device IDs.
Table 2: Device ID's for MTi 1-series
Product (MTi 1-series)
MTi-1 IMU
MTi-2 VRU
MTi-3 AHRS
MTi-7 GNSS/INS
Device ID
0188xxxx
0288xxxx
0388xxxx
0788xxxx
HW version
Check component
layout (Section
6.4)
≥ 2.0 only
The rest of this document only caters to MTi 1-series with HW version ≥ 2.0. Refer to
version MTi 1-series Datasheet rev D (5 Dec 2016) when you have an MTi with HW
version < 2.0.
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1.3 Block diagram
Figure 1: MTi 1-series module diagram
The diagram in Figure 1 shows a simplified organization of the MTi 1-series module (MTi
1-s). The MTi 1-s contains a 3-axis gyroscope, 3-axis accelerometer, 3-axis
magnetometer, a high-accuracy crystal and a low-power micro controller unit (MCU). The
MTi-7 module can also accept the signals from an external GNSS receiver and/or
barometer. The MCU coordinates the timing and synchronization of the various sensors.
The module offers the possibility to use external signals in order to accurately
synchronize the Mti 1-s with any user application. The MCU applies calibration models
(unique to each sensor and including orientation, gain and bias offsets, plus more
advanced relationships such as non-linear temperature effects and other higher order
terms) and runs the Xsens optimized strapdown algorithm, which performs highrate dead-reckoning calculations at 800 Hz, allowing accurate capture of high frequency
motions and coning & sculling compensation. The Xsens sensor fusion engine combines
all sensor inputs and optimally estimates the orientation, position and velocity at an
output data rate of up to 100 Hz. The MTi 1-s is easily configurable for the outputs and
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depending on the application’s needs can be set to use one of the filter profiles available
within the Xsens sensor fusion engine. In this way, the MTi 1-s limits the load and the
power consumption on the user application processor. The user can communicate with
the module by means of three different communication interfaces. They are I2C, SPI and
UART.
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2 Sensor specifications
This section presents the performance and the sensor component specifications for the
calibrated MTi 1-s module. Each module goes through the Xsens calibration process
individually. The calibration procedure calibrates for many parameters, including bias
(offset), alignment of the sensors with respect to the module PCB and each other and
gain (scale factor). All calibration values are temperature dependent and temperature
calibrated. The calibration values are stored in non-volatile memory of the module.
2.1 MTi 1-series performance specifications
Table 3: Orientation performance specifications
Parameter
Roll/Pitch
Yaw
MTi-1 IMU
MTi-2 VRU
MTi-3 AHRS
N/A
N/A
N/A
0.5º
0.8º
Unreferenced
0.5º
0.8º
2º
Static
Dynamic
Dynamic
MTi-7
GNSS/INS
0.5º
0.5º
1.5º
Table 4: Position and velocity performance specifications (with MTi-7-DK)
Parameter
Position
Horizontal (SBAS)
Vertical (SBAS, baro)
Velocity
Specification
1.0 m (1σ STD)
2.0 m (1σ STD)
0.05 m/s (1σ RMS)
All above specifications are based on typical application scenarios. The specifications
mentioned in Table 3 and Table 4 are with MTi-3-DK and MTi-7-DK reference designs.
2.2 Sensors specifications
Table 5: Gyroscope specifications
Gyroscope specification1
Standard full range
In-run bias stability
Bandwidth (-3dB)
Noise density
g-sensitivity
(calibrated)
Non-linearity
Scale Factor variation
1
Unit
[°/s]
[°/h]
[Hz]
[°/s/√Hz]
[°/s/g]
[%FS]
[%]
MTi 1-series
±2000
10
255
0.007
0.001
0.1
0.5 (typical)
1.5 (over life)
As Xsens continues to update the sensors on the module, these specifications may change
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Table 6: Accelerometer specifications
Accelerometer2
Standard full range
In-run bias stability
Bandwidth (-3dB)
Noise density
Non-linearity
Unit
[g]
[mg]
[Hz]
[µg/√Hz]
[%FS]
MTi 1-series
±16
0.03
324 (Z: 262)
120
0.5
Table 7: Magnetometer specifications
Magnetometer2
Standard full range
Non-linearity
Total RMS noise
Resolution
Unit
[G]
[%]
[mG]
[mG]
MTi 1-series
8
0.2
0.5
0.25
Table 8: Alignment specifications
Parameter2
Non-orthogonality (accelerometer)
Non-orthogonality (gyroscope)
Non-orthogonality (magnetometer)
Alignment (gyr to acc)
Alignment (mag to acc)
Alignment of acc to the module board
2
Unit
[°]
[°]
[°]
[°]
[°]
[°]
MTi 1-series
0.05
0.05
0.05
0.05
0.1
0.2
As Xsens continues to update the sensors on the module, these specifications may change
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3 Functional description
This chapter describes the MTi 1-s pinout and gives details about the supported
communication interfaces.
3.1 Pin configuration
Figure 2: Pin configuration of the MTi 1-series module (top view)
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3.2 Pin map
The pin map depends on the peripheral selection. See Section 3.4 on how to set the
peripherals.
Table 9: Pin mapping for peripheral selection
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
PSEL:
I2 C
AUX_SCK/DNC3
DNC
DNC
GND
VDDA
nRST
VDDIO
GND
DNC
ADD24
ADD1
ADD0
GND
PSEL0
PSEL1
SYNC_IN
RESERVED
AUX_RX/DNC
AUX_TX/DNC
SYNC_PPS/DNC
DNC
DRDY
I2C_SDA
I2C_SCL
GND
AUX_nCS/DNC
AUX_MOSI/DNC
AUX_MISO/DNC
PSEL:
SPI
AUX_SCK/DNC
DNC
DNC
GND
VDDA
nRST
VDDIO
GND
SPI_nCS
SPI_MOSI
SPI_MISO
SPI_SCK
GND
PSEL0
PSEL1
SYNC_IN
RESERVED
AUX_RX/DNC
AUX_TX/DNC
SYNC_PPS/DNC
DNC
DRDY
DNC
DNC
GND
AUX_nCS/DNC
AUX_MOSI/DNC
AUX_MISO/DNC
PSEL:
UART half duplex
AUX_SCK/DNC
DNC
DNC
GND
VDDA
nRST
VDDIO
GND
DNC
DNC
DNC
DNC
GND
PSEL0
PSEL1
SYNC_IN
RESERVED
AUX_RX/DNC
AUX_TX/DNC
SYNC_PPS/DNC
DE
nRE
UART_RX
UART_TX
GND
AUX_nCS/DNC
AUX_MOSI/DNC
AUX_MISO/DNC
PSEL:
UART full duplex
AUX_SCK/DNC
DNC
DNC
GND
VDDA
nRST
VDDIO
GND
DNC
DNC
DNC
DNC
GND
PSEL0
PSEL1
SYNC_IN
RESERVED
AUX_RX/DNC
AUX_TX/DNC
SYNC_PPS/DNC
RTS
CTS5
UART_RX
UART_TX
GND
AUX_nCS/DNC
AUX_MOSI/DNC
AUX_MISO/DNC
3.3 Pin descriptions
Table 10: Pin description MTi 1-series module
Name
Type
Power Interface
VDDA
Power
VDDIO
Power
Controls
PSEL0
Selection
pins
PSEL1
nRST
Description
Analog power supply voltage for sensing elements
Digital supply voltage. Also used as I/O reference.
These pins determine the signal interface. See Table 11. Note that when the
PSEL0/PSEL1 is not connected, its value is 1. When PSEL0/PSEL1 is connected
to GND, its value is 0.
Active low reset pin. Only drive with an open drain output or momentary (tactile)
switch to GND. During normal operation this pin must be left floating, because this
AUX and SYNC_PPS pins are only available on MTi-7
I2C addresses, see Table 13.
5 CTS cannot be left unconnected if the interface is set to UART full duplex. If HW flow control is
not used, connect o GND.
3
4
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ADD2
Selection
pins
ADD1
ADD0
Signal Interface
I2C_SDA
I2 C
interface
I2C_SCL
SPI_nCS
SPI
interface
SPI_MOSI
SPI_MISO
SPI_SCK
RTS
UART
interface
CTS
nRE
DE
UART_RX
UART_TX
SYNC_IN
line is also used for internal resets. This pin has an internal weak pull-up to VDDIO.
I2C address selection lines. See Table 13 for list of I2C addresses.
I2C serial data input/output
I2C serial clock input
SPI chip select input (active low)
SPI serial data input (slave)
SPI serial data output (slave)
SPI serial clock input
Hardware flow control output in UART full duplex mode (Ready-to-Send)
Hardware flow control input in UART full duplex mode (Clear-to-Send). If flow
control is not used connect to GND
Receiver control signal output in UART half duplex mode
Transmitter control signal output in UART half duplex mode
Receiver data input
Transmitter data output
Accepts a trigger input to request the latest available data message
Sync
interface
DRDY
Data ready Data ready output indicates that data is available (SPI / I2C)
Auxiliary interface (MTi-7 only)
AUX_RX
Auxiliary
Receiver data input from GNSS module
GNSS
AUX_TX
Transmitter data output to GNSS module
interface
SYNC_PPS
Pulse per second input from GNSS module
AUX_nCS
Auxiliary
SPI chip select output
SPI
AUX_MOSI
SPI serial data output (master)
interface
AUX_MISO
SPI serial data input (master)
AUX_SCK
SPI serial clock output
3.4 Peripheral interface selection
The MTi 1-series module supports UART, I2C, and SPI interfaces for host communication.
The host can select the active interface through the peripheral selection pins PSEL0 and
PSEL1. The module reads the state of these pins at start-up, and configures its peripheral
interface according Table 11. To change the selected interfaces, the host must first set
the desired state of the PSEL0 and PSEL1 pins, and then reset the module. The module
has internal pull-ups on the PSEL0 and PSEL1 pins. If these pins are left unconnected,
the peripheral interface selection defaults to I 2C (PSEL0 = 1, and PSEL1 = 1).
Table 11: Peripheral interface selection
Interface
I 2C
SPI
UART half-duplex
UART full-duplex
PSEL1
1
1
0
0
PSEL0
1
0
1
0
3.4.1 Peripheral interface architecture
At its core, the module uses the Xsens-proprietary Xbus protocol which is compatible
with all Xsens Motion Tracker products. This protocol is available on all interfaces, UART
(asynchronous serial port interfaces), I2C and SPI interfaces. The I2C and SPI interfaces
differ from UART in that they are synchronous, and have a master-slave relation in which
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the slave cannot send data by itself. This makes the Xbus protocol not directly
transferable to these interfaces. For this purpose, the module introduces the MTi
Synchronous Serial Protocol (MTSSP) protocol, a protocol for exchanging standard Xbus
protocol messages over the I2C and SPI interfaces. Figure 3 shows how MTSSP fits in the
module's (simplified) communication architecture. The module has generic Input- and
Output-Queues for Xbus protocol messages. For I2C and SPI, the MTSSP layer translates
these messages, while for the UART connection, the module transports the messages asis.
Figure 3: Communication architecture of MTi 1-series module (simplified)
3.4.2 Xbus Protocol
The Xbus protocol is Xsens’ proprietary protocol for interfacing with the MTi 1-series. The
MT Low Level Communication Protocol Documentation is a complete reference for the
protocol. For a better understanding of the MTSSP explanation, the advice is to read the
protocol reference first.
3.4.3 MTSSP Synchronous Serial Protocol
This Section specifies the MTi Synchronous Serial Protocol (MTSSP). The MTi 1-series
module uses MTSSP as the communication protocol for both the I 2C and SPI interfaces.
The ARM® mbedTM example program (see https://developer.mbed.org/teams/Xsens),
provides a reference implementation for the host side of the protocol.
Data flow
MTSSP communication happens according the master-slave model. The MTi 1-series
module will always fulfill the slave-role while the user/integrator/host of the module is
always the Master. The Master always initiates and drives communication. The Master
either writes a message to the module, or reads a message from the module.
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Figure 4 shows the data flow between the host (Master Device), and the MTi 1-s (Slave).
The Master can control the Module by sending Xbus messages to the Control Pipe.
The Module considers the bytes received in a single bus transfer to be exactly one
Xbus message. The modules places the received message in the Input Queue for
further handling. The Xbus Interpreter handles the messages in the Input Queue,
and places the response messages in the Output Queue. The Master Device can read
these response messages from the Notification Pipe.
The Master can switch the Module between configuration and measurement mode by
sending the usual GotoConfig and GotoMeasurement messages to the Control Pipe.
When placed in Measurement mode, the module will place the generated
measurement data in the Measurement Pipe. The Master Device has to read the
Measurement Pipe to received measurement data.
For the Master to know the size of the messages in the Notification- and
Measurement pipes it can read the Pipe Status. The Pipe Status contains the size in
bytes of the next message in both the Notification- and Measurement pipe. The
Master can tweak the behavior of the protocol by writing the Protocol Configuration.
The Master can also read the Protocol Configuration to check current behavior, and
get protocol information.
Figure 4: Data flows within MTSSP
Data ready signal
The Data Ready Signal (DRDY) is a notification line driven by the module. Its default
behavior is to indicate the availability of new data in either the Notification- or the
Measurement pipe. By default, the line is low when both pipes are empty, and will go
high when either pipe contains an item. As soon as the Master has read all pending
messages, the DRDY line will go low again.
The Master can change the behaviour of the DRDY signal using the Procotol
Configuration. Please refer to the description of the ConfigureProtocol opcode (Table
12)for more information.
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Opcodes
The Master starts each transfer with an opcode. The opcode determines the type of the
transfer. The defined opcodes are as listed in Table 12. Following the opcode, and
depending on whether it is a read- or write transfer, the Master either reads or writes
one or more data bytes. The specific transfer format is dependent of the underlying bus
protocol (I2C or SPI), and is specified in Sections 3.4.4 and 3.4.5.
For some opcodes, the MTSSP uses reduced Xbus messages. A reduced Xbus message is
a regular Xbus message with the preamble and busID fields removed to save bandwidth.
These fields correspond to the first two bytes of a regular Xbus message. The calculation
of the checksum for a reduced Xbus message still includes the busID and assumes its
value to be 0xFF.
Table 12: List of defined opcodes
Opcode
0x01
Name
ProtocolInfo
Read/Write
Read
Data format
Opcode defined
0x02
ConfigureProtocol
Write
Opcode defined
0x03
ControlPipe
Write
Reduced Xbus
0x04
PipeStatus
Read
Opcode defined
0x05
NotificationPipe
Read
Reduced Xbus
0x06
MeasurementPipe
Read
Reduced Xbus
Description
Status of the protocol behaviour,
protocol version
Tweak the Protocol, e.g. the
behaviour of the DRDY pin,
behaviour of the pipes
Used to send control messages
to the module
Provides status information for
the read pipes
Used to read non-measurement
data: errors acknowledgements
and other notifications from the
module
All measurement data generated
by the module will be available in
the measurement pipe
ProtocolInfo (0x01)
The ProtocolInfo opcode allows the Master to read the active protocol configuration. The
format of the message is as follows (All data is little endian, byte aligned):
struct MtsspInfo
{
uint8_t m_version;
uint8_t m_drdyConfig;
};
m_version:
7
6
5
4
3
VERSION [7:0]
2
1
0
m_drdyConfig:
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Bits
7:4
Reserved for future use
Bit 3
MEVENT: Measurement pipe DRDY event enable
0 : Generation of DRDY event is disabled
1 : Generation of DRDY event is enabled (default)
Bit 2
NEVENT: Notification pipe DRDY event enable
0 : Generation of DRDY event is disabled
1 : Generation of DRDY event is enabled (default)
Bit 1
OTYPE: Output type of DRDY pin
0: Push/pull (default)
1: Open drain
Bit 0
POL: Polarity of DRDY signal
0: Idle low (default)
1: Idle high
ConfigureProtocol (0x02)
The ProtocolInfo opcode allows the Master to change the active protocol configuration.
The format of the message is as follows (All data is little endian, byte aligned):
struct MtsspConfiguration
{
uint8_t m_drdyConfig;
};
m_drdyConfig:
Bits
7:4
Reserved for future use
Bit 3
MEVENT: Measurement pipe DRDY event enable
0 : Generation of DRDY event is disabled
1 : Generation of DRDY event is enabled (default)
Bit 2
NEVENT: Notification pipe DRDY event enable
0 : Generation of DRDY event is disabled
1 : Generation of DRDY event is enabled (default)
Bit 1
OTYPE: Output type of DRDY pin
0: Push/pull (default)
1: Open drain
Bit 0
POL: Polarity of DRDY signal
0: Idle low (default)
1: Idle high
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ControlPipe (0x03)
The ControlPipe opcode allows the Master to write messages to the Control Pipe. The
bytes following the opcode represent a single (reduced) Xbus message
PipeStatus (0x04)
The PipeStatus opcode allows the Master to retrieve the status of the module's
Notification- and Measurement pipes. The format of the message is as follows (All data is
little endian, byte aligned):
struct MtsspConfiguration
{
uint16_t m_notificationMessageSize;
uint16_t m_measurementMessageSize;
};
NotificationPipe (0x05)
The Master uses the NotificationPipe opcode to read from the Notification Pipe. The read
data is a single reduced Xbus message
MeasurementPipe (0x06)
The Master uses the MeasurementPipe opcode to read from the Measurement Pipe. The
read data is a single reduced Xbus message
3.4.4 I2C
The MTi 1-series supports the I2C transport layer as of firmware 1.0.6. Note, it is not
possible to upgrade devices with firmware revision 1.0.3 or earlier, to support this
protocol. The MTi 1-series module acts as an I2C Slave. The User of the MTi 1-series
module is the I2C Master.
The User can configure the I2C slave address through the ADD0, ADD1 and ADD2 pins.
The module reads the state of these pins at start-up, and configures the slave address
according to Table 13. The ADD0, ADD1 and ADD2 pins are pulled-up internally so when
left unconnected the address selection defaults to 0x6B (ADD = 111).
Table 13: List of I2C addresses
I2C
address
0x1D
0x1E
0x28
0x29
0x68
0x69
0x6A
0x6B
(default)
ADD2
ADD1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
19
ADD0
0
1
0
1
0
1
0
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Table 14: Implemented I2C bus protocol features
Feature
7-bit slave address
10-bit slave address
Acknowledge
Arbitration
Clock stretching
Device ID
General Call address
Software Reset
START byte
START condition
STOP condition
Synchronization
Slave Requirement
Mandatory
Optional
Mandatory
N/A
Optional
Optional
Optional
Optional
N/A
Mandatory
Mandatory
N/A
MTi 1-series
Yes
No
Yes
N/A
Yes6
No
No
No
N/A
Yes
Yes
N/A
Writing to the MTi 1-s
Write operations consists of a single I2C write transfer. The Master addresses the module
and the first byte it sends is the opcode. The bytes that follow are the data bytes. The
interpretation of these data bytes depends on the opcode, as described in Section 3.4.3.
The maximum message size a module can receive is 512 bytes. If the Master sends more
than 512 bytes, the module will reset its receive-buffer, which reduces the received
message to consist only of the excess bytes.
Figure 5 shows the I2C transfer of a write message operation:
Figure 5: I2C write message operation
Reading from the module
To read from the module, the Master first does an I2C write transfer to transmit the
opcode. The opcode tells the module what data the Master want to read. The module
then prepares the requested data for transmission. The Master then does an I2C read
transfer to retrieve the data. Figure 6 shows the I2C transfers for the described read
method.
Figure 6: Read message operation with full write transfer and full read transfer (I 2C)
The MTi-1 module relies on the I2C clock stretching feature to overcome fluctuations in processing
time, the Master is required to support this feature
6
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Alternatively, the User can perform the read operation using a I 2C transfer with a
repeated start condition. Figure 7 depicts this read method.
Figure 7: Read message transfer using a repeated start condition (I2C)
The Master controls how many data bytes it reads. For reading the Notification- and
Measurement Pipes, the number of bytes the Master must read depends on the size of
the pending message. In order to determine the correct number of bytes, the Master
should first read the Pipe Status to obtain the sizes of the pending messages.
If the Master reads more bytes than necessary, the module will restart sending the
requested data from the beginning.
3.4.5 SPI
The MTi 1-series supports the SPI transport layer as of firmware 1.0.6. Note, that it is
not possible to upgrade devices with firmware revision 1.0.3 or earlier, to support this
protocol.
The MTi 1-series module acts as an SPI Slave. The User of the MTi 1-series module is the
SPI Master.
SPI Configuration
The MTi 1-series supports 4-wire mode SPI. The four lines used are:
• Chip Select (SPI_nCS)
• Serial Clock (SPI_SCK)
• Master data in, slave data out (SPI_MISO)
• Master data out, slave data in (SPI_MOSI)
The module uses SPI mode 3: It captures data on the rising clock edge, and it
latches/propagates data on the falling clock edge. (CPOL=1 and CPHA=1).Data is
clocked-out MSB first. The module uses an 8-bit data format.
Data transfer
The module uses a single type of SPI transfer for all communications. Figure 8 depicts
this basic transfer.
Figure 8: SPI basic transfer
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The Master starts a transfer by pulling the SPI_nCS low, in order to select the Slave. The
Master must keep the SPI_nCS line low for the duration of the transfer. The Slave will
interpret the rising edge of the SPI_nCS line as the end of the transfer. The Master
places the data it needs to transmit on the SPI_MOSI line. The Slave will place its data
on the SPI_MISO line.
The Master first transmits the opcode. The opcode determines what kind of data the
Master transmits, and what kind of data the Master wants to read from the Slave (See
Section 3.4.3). The second- to fourth byte the Master transmits are the fill words. These
fill words are needed to give the Slave time to select the data it must send in the
remainder of the transfer. Both Master and Slave are free to choose the value of the fill
words, and the receiving end should ignore their value. However, the first 4 bytes
transmitted by the MTi 1-series module (Slave) are always 0xFA, 0xFF, 0xFF, 0xFF.
Following the first four words are the actual data of the transfer. It is the responsibility of
the Master to determine how many bytes it must transfer. For reading the Notificationand Measurement Pipes, the number of bytes the Master must read depends on the size
of the pending message. In order to determine the correct number of bytes, the Master
should first read the Pipe Status to obtain the sizes of the pending messages.
Timing
Table 15 and Figure 9 specify the timing constraints that apply to the SPI transport layer.
The Master must adhere to these constraints.
Table 15: SPI timing
Symbol
T1
T2
T3
Parameter
Slave select to first complete word delay
Byte time
Consecutive SPI transfer guard time
Max SPI bitrate
Unit
μs
μs
μs
Mbit
Min
4
4
3
Max
2
Figure 9: SPI timing
3.4.6 UART half-duplex
The User can configure the MTi 1-series module to communicate over UART in halfduplex mode. The UART frame configuration is 8 data bits, no parity and 1 stop bit
(8N1). In addition to the RX and TX pins, the modules uses control lines nRE and DE. The
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modules uses these control outputs to drive the TX signal on a shared medium and to
drive the signal of the shared medium on the RX signal.
A typical use case for this mode is to control an RS485 transceiver where the shared
medium is the RS485 signal, and the nRE and DE lines control the buffers inside the
transceiver.
When the module is transmitting data on its TX pin it will raise both the nRE and DE
lines, else it will pull these lines low. Figure 10 depicts the behaviour of the involved
signals.
Figure 10: Behaviour of the nRE and DE lines
Note that in this mode the UART of the MTi 1-s itself is still operating full duplex.
3.4.7 UART full duplex with RTS/CTS flow control
The user can configure the MTi 1-s module to communicate over UART in full duplex
mode with RTS/CTS flow control. The UART frame configuration is 8 data bits, no parity
and 1 stop bit (8N1). In addition to the RX and TX signals for data communication, the
module uses the RTS and CTS signals for hardware flow control.
The CTS signal is an input for the module. The module checks the state of the CTS line at
the start of every byte it transmits. If CTS is low, the module transmits the byte.
Otherwise, it postpones transmission until CTS is lowered. When during the transmission
of a byte the User raises the CTS signal, then the module completes transmission of that
byte before postponing further output. The module will not retransmit this byte. Figure
11 shows the behaviour of the TX and CTS lines.
Figure 11: Data transmit behaviour under CTS
The RTS signal is an output for the module. If the RTS line is high, the module is busy
and unable to receive new data. Otherwise, the module’s UART is idle and ready to
receive. After receiving a byte the direct memory access (DMA) controller of the module
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will transfer the byte to its receive first in first out (FIFO) buffer. The module will raise
the RTS signal during this transfer. Therefore, with every byte received, the module
raises the RTS line shortly. Figure 12 shows this behaviour.
Figure 12: RTS behaviour under data reception
This User can use this communication mode without hardware flow control. In this case,
the user must tie the CTS line low (GND) to make the module transmit.
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4 MTi 1-series architecture
This section discusses the MTi 1-s module architecture including the various
configurations available and the signal processing pipeline.
4.1 MTi 1-series configurations
The MTi 1-s module is a fully tested self-contained module available as an Inertial
Measurement Unit (IMU), Vertical Reference Unit (VRU), Attitude and Heading Reference
System (AHRS) and GNSS aided Inertial Navigation System (GNSS/INS). It can output
3D orientation data (Euler angles, rotation matrix or quaternions), orientation and
velocity increments (∆q and ∆v), position and velocity quantities and calibrated sensors
data (acceleration, rate of turn, magnetic field). Depending on the product, output
options may be limited to sensors data and/or unreferenced yaw.
The MTi 1-s module features a 3D accelerometer, a 3D gyroscope, a magnetometer, a
high-accuracy crystal and a low-power MCU. The MCU coordinates the timing and
synchronization of the various sensors, applies calibration models (e.g. temperature
models) and runs the sensor fusion algorithm. The MCU also generates output messages
according to the proprietary XBus communication protocol. The data output are fully
configurable, so that the MTi 1-s limits the load, and thus power consumption, on the
user application processor.
4.1.1 MTi-1 IMU
The MTi-1 module is an IMU that outputs calibrated 3D rate of turn, 3D acceleration and
3D magnetic field. The MTi-1 also outputs coning and sculling compensated orientation
increments and velocity increments (∆q and ∆v). Advantages over a gyroscopeaccelerometer combo-sensor are the inclusion of synchronized magnetic field data, onboard signal processing and the easy-to-use synchronization and communication
protocol. Moreover, the testing and calibration over temperature performed by Xsens
result in a robust and reliable sensor module, that can be integrated within a short time
frame. The signal processing pipeline and the suite of output options allow access to the
highest possible accuracy at any output data rate, limiting the load on the user
application processor.
4.1.2 MTi-2 VRU
The MTi-2 is a 3D VRU. Its algorithm computes 3D orientation data with respect to a
gravity referenced frame: drift-free roll, pitch and unreferenced yaw. Although the yaw is
unreferenced, it is superior to gyroscope integration. In addition, it outputs calibrated
sensor data: 3D acceleration, 3D rate of turn and 3D magnetic field data. All modules of
the MTi 1-series output data generated by the strapdown integration algorithm
(orientation and velocity increments - ∆q and ∆v). The 3D acceleration is also available
as so-called free acceleration, which has the local-gravity subtracted. The drift in
unreferenced heading can be limited using the Active Heading Stabilization (AHS)
feature, see Section 4.3.3 for more details.
4.1.3 MTi-3 AHRS
The MTi-3 supports all features of the MTi-1 and MTi-2, and in addition is a full
magnetometer-enhanced AHRS. In addition to the roll and pitch, it outputs a true
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magnetic North referenced yaw and calibrated sensors data: 3D acceleration, 3D rate of
turn, 3D orientation and velocity increments (∆q and ∆v) and 3D earth-magnetic field
data. Free acceleration is also computed by the MTi-3 AHRS.
4.1.4 MTi-7 GNSS/INS
The MTi-7 provides a GNSS/INS solution offering a position and velocity output in
addition to orientation output. The MTi-7 uses advanced sensor fusion algorithms
developed by Xsens to synchronize the inputs from the module’s on-board
accelerometer, gyroscope and magnetometer with the data from an external GNSS
receiver and/or barometer. The raw sensor signals are combined and processed at a high
data rate of 800 Hz to produce a real-time data stream with device’s 3D position, velocity
and orientation (roll, pitch and yaw).
4.2 Signal processing pipeline
The MTi 1-series is a self-contained module, so all calculations and processes such as
sampling, coning & sculling compensation and the Xsens sensor fusion algorithm run on
board.
4.2.1 Strapdown integration
The Xsens optimized strapdown algorithm performs high-rate dead-reckoning
calculations at 800 Hz allowing accurate capture of high frequency motions. This
approach ensures a high bandwidth. Orientation and velocity increments are calculated
with full coning & sculling compensation. These orientation and velocity increments are
suitable for any 3D motion tracking algorithm. Increments are internally timesynchronized with other sensor. The output data rate can be configured with different
frequencies up to 100 Hz. The inherent design of the signal pipeline with the computation
of orientation and velocity increments ensure there is absolute no loss of information at
any output data rate. This makes the MTi 1-series attractive for systems with limited
communication bandwidth.
4.2.2 Xsens sensor fusion algorithm for VRU and AHRS product types
Xsens sensor fusion algorithm optimally estimates the orientation with respect to an
Earth fixed frame utilizing the 3D inertial sensor data (orientation and velocity
increments) and 3D magnetometer.
The user can set the sensor fusion algorithm with different filter profiles in order to get
the best performance based on the application scenario (see Table 16). These filter
profiles contain predefined filter parameter settings suitable for different user application
scenarios.
In addition, all filter profiles can be used with the Active Heading Stabilization (AHS)
setting, which significantly reduces heading drift during magnetic disturbances. The Inrun Compass Calibration (ICC) setting can be used to compensate for magnetic
distortions that are caused by every object the MTi is attached to. See Section 4.3 for
more details.
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Table 16: Filter profiles for VRU and AHRS
Name
General
High_mag_dep
Number
50
51
Product
MTi-3
MTi-3
Dynamic
52
MTi-3
North_referenced
53
MTi-3
VRU_general
54
MTi-2
MTi-3
Description
Suitable for most applications.
Heading corrections strongly rely on the magnetic field
measured and should be used when magnetic field is
homogeneous.
Assumes that the motion is highly dynamic.
Assumes a good Magnetic Field Mapping (MFM) and a
homogeneous magnetic field. Given stable initialization
procedures and observability of the gyro bias, after
dynamics, this filter profile will trust more on the gyro
solution and the heading will slowly converge to the
disturbed mag field over the course of time.
Magnetometers are not used to determine heading.
Consider using VRU_general in environments that have a
heavily disturbed magnetic field or when the application
only requires unreferenced heading (see also Section
4.3.3).
4.2.3 Xsens sensor fusion algorithm for GNSS/INS product
The Xsens sensor fusion algorithm in the MTi-7 has several advanced features. The MTi-7
algorithm adds robustness to the orientation and position estimates by combining
measurements and estimates from the inertial sensors and GNSS receiver in order to
compensate for transient accelerations and magnetic disturbances.
When the MTi-7 has limited/mediocre GNSS reception or even no GNSS reception at all
(outage), the MTi-7 sensor fusion algorithm seamlessly adjusts the filter settings in such
a way that the highest possible accuracy is maintained. The GNSS status is continuously
monitored and the filter accepts GNSS data when available and sufficiently trustworthy.
The sensor will continue to output position, velocity and orientation estimates, although
the accuracy is likely to degrade over time as the filters will have to rely on deadreckoning. If the GNSS outage lasts longer than 45 seconds, the MTi-7 stops output of
the position and velocity estimates, and begins sending these outputs once the GNSS
data becomes acceptable again.
Table 17 reports the different filter profiles the user can set based on the application
scenario. Every application is different and results may vary from setup to setup. It is
recommended to reprocess recorded data with different filter profiles in MT Manager to
determine the best results in your specific application.
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Table 17: Filter profiles for MTi-7 (GNSS/INS)
Name
General
Number
11
GNSS7
GeneralNoBaro
12
•
GeneralMag8
13
•
•
Barometer7
Magnetometer
•
•
•
Description
This filter profile is the
default setting. Yaw is
North referenced
(when GNSS is
available). Altitude
(height) is determined
by combining static
pressure, GNSS
altitude and
accelerometers. The
barometric baseline is
referenced by GNSS,
so during GNSS
outages, accuracy of
height measurements
is maintained.
This filter profile is
very similar to the
general filter profile
except for the use of
barometer.
This filter profile bases
its yaw estimate
mainly on magnetic
heading and GNSS
measurements. A
homogenous or
magnetic field
calibration is essential
for good performance.
4.3 Magnetic interference
Magnetic interference can be a major source of error for the heading accuracy of any
AHRS. As an AHRS uses the magnetic field to reference the dead-reckoned orientation on
the horizontal plane with respect to the (magnetic) North, a severe and prolonged
distortion in that magnetic field will cause the magnetic reference to be inaccurate. The
MTi 1-series module has several ways to cope with these distortions to minimize the
effect on the estimated orientation.
4.3.1 Magnetic Field Mapping
When the distortion moves with the MTi (i.e. when a ferromagnetic object solidly moves
with the MTi module), the MTi can be calibrated for this distortion. Examples are the
cases where the MTi is attached to a car, aircraft, ship or other platforms that can distort
7
8
External aiding sensors for the MTi-7
This filter profile can be used even when the barometer is not part of the design.
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the magnetic field. It also handles situations in which the sensor has become
magnetized. These type of errors are usually referred to as soft and hard iron distortions.
The Magnetic Field Mapping procedure compensates for both hard iron and soft iron
distortions.
The magnetic field mapping (calibration) is performed by moving the MTi together with
the object/platform that is causing the distortion. The results are processed on an
external computer (Windows or Linux), and the updated magnetic field calibration values
are written to the non-volatile memory of the MTi 1-series module. The magnetic field
mapping procedure is extensively documented in the Magnetic Field Mapper User Manual
(MT0202P), available in the MT Software Suite.
4.3.2 In-run Compass Calibration (ICC)
In-run Compass Calibration is a way to calibrate for magnetic distortions present in the
sensor operation environment using an onboard algorithm. The ICC is an alternative for
the offline MFM (Magnetic Field Mapper). It results in a solution that can run embedded
on different industrial platforms (leaving out the need for a host processor like a PC) and
relies less on specific user input. The MFM tool, which does require a host processor, is
however still recommended over or in addition to the ICC. The ICC is aimed at
applications for which the MFM solution cannot be used (e.g. MTi 1-s that is not able to
be connected to a PC), when MFM is not sufficient (e.g. applications that move outside of
the plane of motion used during the calibration), or when the user uses the same MFM
result performed for one sensor to calibrate different sensors (typical for large volume
applications).
It should be noted that magnetic distortions present in the environment of the motion
tracker that move independently or change over time are not compensated by the ICC
unless they are changing very slowly. Such distortions do not affect the parameter
estimation; they are simply not compensated for. This also means that (ferromagnetic)
objects should not be attached to or detached from the sensor while ICC is running.
If the user is able to perform a calibration motion in a homogeneous magnetic field or
environment that is representative for the application, then it is possible to use
"Representative Motion" feature (RepMo). RepMo is available in MT Manager, XDA and
Low-Level Communication Protocol (Xbus protocol).
Additional examples are available in BASE: https://base.xsens.com/hc/enus/articles/213588029.
4.3.3 Active Heading Stabilization (AHS)
The Active Heading Stabilization (AHS) is a software component within the sensor fusion
engine designed to give low-drift unreferenced heading solution in a disturbed magnetic
environment. AHS is not tuned for nor intended to be used with GNSS/INS devices.
Therefore, Xsens discourages the use of this feature for GNSS/INS devices, including the
MTi-7.
For more information on the activation and use of AHS, refer to the BASE article:
https://base.xsens.com/hc/en-us/articles/211809465.
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4.4 Frames of reference
The MTi 1-series module uses a right-handed coordinate system and the default sensor
frame is defined as shown in Figure 13. For a more exact location of the sensor frame
origin, refer to the Hardware Integration manual. Some of the commonly used data
outputs with their output reference coordinate system are listed in Table 18.
Z
X
Y
Figure 13: Default sensor fixed coordinate system for the MTi 1-series module
Table 18: Data output with reference coordinate system
Data
Acceleration
Rate of turn
Magnetic field
Velocity increment
Orientation increment
Free acceleration
Orientation
Velocity
Position
Reference coordinate system
Sensor-fixed or object frame
Sensor-fixed or object frame
Sensor-fixed or object frame
Sensor-fixed or object frame
Sensor-fixed or object frame
Local Tangent Plane (LTP), default
Local Tangent Plane (LTP), default
Local Tangent Plane (LTP), default
Local Tangent Plane (LTP), default
ENU
ENU
ENU
ENU
The default reference coordinate system is East-North-Up (ENU). In addition, the MTi 1-s
module has predefined output options for North-East-Down (NED) and North-West-Up
(NWU). Orientation resets have effect on all outputs that are by default output with an
ENU reference coordinate system.
For MTi-7, the Local Tangent Plane (LTP) is a local linearization of the Ellipsoidal
Coordinates (Latitude, Longitude, Altitude) in the WGS-84 Ellipsoid. Velocity data
calculated by the sensor fusion algorithm is provided in the same coordinate system as
the orientation data, and thus adopts orientation resets as well.
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5 System and electrical specifications
5.1 Interface specifications
Table 19: Communication interfaces
Interface
I 2C
fI2C
Min
Max
400
Unit
kHz
SPI
fSPI
2
MHz
UART
DCSCK
fUART
70
4000
%
kbps
30
Typ
50
921.6
Description
Host I2C interface Clock
speed
Host SPI Interface Clock
Speed
SPI Clock Duty Cycle
Host UART Interface Baud
Rate
Table 20: Auxiliary interfaces
Interface
SYNC_IN
Symbol
VIL
VIH
VHYS
nRST
AUX_UART
AUX_SPI
VIL
RPU
TP
fUART
fSPI
Min
Typ
Max
0.3 · VDDIO
0.45 · VDDIO
+ 0.3
0.45 · VDDIO
+ 0.3
30
20
115.2
1
31
Unit
V
V
Description
Input low voltage
Input high voltage
V
Threshold hysteresis
voltage
Only drive momentarily
Pull-up resistor
Generated reset pulse
duration
UART baud rate
SPI serial clock speed
0.3 · VDDIO
50
V
kΩ
µs
2000
8
kbps
MHz
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5.2 System specifications
Table 21: System specifications
Interface
Size
Weight
Temperature
Min
12.0
2.5
Width/Length
Height
Operating
temperature
Typ
12.1
2.6
0.6
-40
Power
consumption
Timing accuracy
MTBF
Output data rate
Max
12.2
2.7
+85
Unit
mm
mm
gram
ºC
100
mW
800
ppm
hours
Hz
109
225,000
Comments
PLCC-28 compatible
Ambient temperature,
non-condensing
VDDA 3.0V; VDDIO
1.8V
RateOfTurnHR and
ArccelerationHR
DataID only
5.3 Electrical specifications
Table 22: Electrical specifications
VDDA
VDDA ripple
VDDIO
VIL
VIH
VHYS
VOL
VOH
Min
2.16
1.8
Max
3.610
50
VDDA + 0.1
0.3 · VDDIO
Unit
V
mVpp
V
V
V
V
0.4
V
V
0.45 · VDDIO + 0.3
0.45 · VDDIO + 0.3
VDDIO – 0.4
Description
Analog supply voltage
Analog supply ripple
Digital supply voltage
Input low voltage
Input high voltage
Threshold hysteresis
voltage
Output low voltage
Output high voltage
5.4 Absolute maximum ratings
Table 23: Absolute maximum ratings MTi 1-series module
Storage temperature
Operating temperature
VDDA
VDDIO
SYNC_IN
Acceleration 11
ESD protection12
Min
-40
-40
0.3
0.3
Max
+90
+85
4.0
VDDA + 0.5
5
10,000
±2000
Unit
ºC
ºC
V
V
V
g
V
Comments
With respect to GND
With respect to GND
With respect to GND
Any axis, unpowered, for 0.2 ms
Human body model
Output clock accuracy of 1 ppm can be achieved with the MTi-7-DK reference design
Previous generation version ≤1.1, VDDA max: 3.45V
11 This is a mechanical shock (g) sensitive device. Proper handling is required to prevent damage to the part.
12 This is an ESD-sensitive device. Proper handling is required to prevent damage to the part.
9
10
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6 Design and packaging
6.1 Footprint
The footprint of the MTi 1-s module is similar to a 28-lead Plastic Leaded Chip Carrier
package (JEDEC MO-047). Although it is recommended to solder the MTi 1-s module
directly onto a PCB, it can also be mounted in a compatible PLCC socket (e.g. 842821B1-RK of M3, as used on the MTi 1-series Development Kit). When using a socket,
make sure that it supports the maximum dimensions of the MTi 1-series module as given
in Table 21 (note the tolerance of ± 0.1 mm).
Figure 14: Recommended MTi 1-series module footprint
The MTi 1-s module is shipped in trays with 20 modules or in reels with 250 modules.
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6.2 Tray packaging information
6.2.1 Tray of 20 pcs (MTi-#-T)
Tray Dimensions (mm)
Length
“X”
Width
“Y”
Height
“Z”
322.60
135.90
7.62
Pocket
XPitch
14.65
Pocket
YPitch
16.00
Pocket
X-Y
Array
12 x 12
Tray packaging
information
Qty/Tray Qty/Box
Pin 1
20 units
Detail “A”
Marking
20 units
NOTES:
• All dimensions are in millimeters.
• Pictured tray representative only, actual tray may look different.
• The hardware version number is labeled SPEC REV on the TNR Label.
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6.2.2 Tray of 100 pcs (MTi-#-C)
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6.3 Reel packaging information
Carrier tape (mm)
Ao
Bo
Ko
W
12.6
12.8
12.
6
12.
8
2.9
3.1
0
23.7
0
24.3
0
Po
P1
P2
3.9
0
4.1
0
15.9
0
16.1
0
1.9
0
2.1
0
Reels (mm)
A
N
C
177.8
0
36
5
5
12.8
0
13.5
0
W3
23.9
0
27.4
0
Pin 1
Orientation
by
quadrant
1&2
Packing
QTY/
Reel
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NOTES:
• All dimensions are in millimeters, unless otherwise specified.
• The hardware version number is labeled SPEC REV on the TNR Label.
6.4 Package drawing
All the MTi 1-series module generations have the same board dimensions and footprint,
but the component placement can differ between generations.
Table 24: MTi 1-series module generations
Version 1.1 (PCB no. SM141111)
Version 2.0 (PCB no. SM171223)
Figure 15: MTi 1-series v1.1 dimensions and
sensor locations
•
•
Figure 16: MTi 1-series v2.0 dimensions and
sensor locations
All dimensions are in mm.
General tolerances are ± 0.1 mm
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Figure 17: Location PCB number on MTi 1-series module (bottom view)
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7 Declaration of conformity
7.1 EU Declaration of Conformity
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7.2 FCC Declaration of Conformity
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